201. Impact of MCMs on system performance optimization
- Author
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Trevor Mudge, Richard B. Brown, R.J. Lomax, Karem A. Sakallah, T.R. Huff, and Ayman Kayssi
- Subjects
Materials science ,business.industry ,Electrical engineering ,Insulator (electricity) ,Hardware_PERFORMANCEANDRELIABILITY ,Dielectric ,Conductivity ,Gallium arsenide ,Conductor ,Instructions per second ,chemistry.chemical_compound ,chemistry ,Electrical resistivity and conductivity ,Hardware_INTEGRATEDCIRCUITS ,Optoelectronics ,Hardware_ARITHMETICANDLOGICSTRUCTURES ,business ,Electrical conductor - Abstract
Presents a performance model for the University of Michigan MCM (multichip module)-based GaAs microcomputer. The model takes into account architectural as well as MCM packaging considerations such as the chip-to-substrate bonding method, the dielectric constant of the insulator, and the resistivity of the metal conductor. The authors illustrate the use of the model by finding the I-cache size which maximizes the MIPS (millions of instructions per second) rating for given MCM technology parameters. >
- Published
- 2003
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