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444 results on '"Reichl, Herbert"'

201. Labonsubstrate technology platform

Author

Braun, Tanja, Böttcher, Lars, Bauer, Jörg, Jung, Erik, Becker, KarlFriedrich, Ostmann, Andreas, Aschenbrenner, Rolf, and Reichl, Herbert

Abstract

A technology platform based on standard PCB technology has been developed for costeffective fabrication of biological and medical test devices. Aluminum, polyimide and Pyralux have been selected as materials with focus on bio and process compatibility. A process flow consisting of lamination, Al structuring by wet etching, microwell and via formation by laser drilling and via metallization was developed. Surface treatments have been evaluated for hydrophobic and hydrophilic modification of the materials. The technology was demonstrated with a dielectrophoresis enhanced microwell device for single cell handling and detection of celltocell interaction as needed for the improvement of tumor therapy. © 2009 WILEYVCH Verlag GmbH & Co. KGaA, Weinheim

Published
2009
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202. METHOD FOR THE SELECTIVE, METAL-BASED ACTIVATION OF SUBSTRATE SURFACES FOR THE WET-CHEMICAL METAL DEPOSITION WITHOUT EXTERNAL CURRENT AND A MEANS THEREFORE

Author

FRAUNHOFER GES FORSCHUNG, LANGE STEPHAN, GALIUS VENIAMIN, FIEDLER STEPHAN, HANNEMANN MONIKA, SCHEELL WOLFGANG, and REICHL HERBERT

Subjects
C23C18/30, C23C18/16
Abstract

The invention relates to a method for the selective metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current. The inventive method is characterised in that the substrate surface is activated by means of an activator metal which, as such or in the form of a precursor, has been selectively transported to the location of the surface by means of vesicles, whereby said location has to be activated. The invention also relates to a vesicle mixture comprising vesicles that are filled with an activator metal precursor and to vesicles that are filled with a reaction partner for the activator metal precursor. The reaction partner can convert the activator metal precursor into activator metal as soon as the vesicle membranes are opened. Said vesicle mixture is present as such or suspended in a suspension agent and is suitable for use in said method.

203. Impact of Process Tolerances on the Performance of Bond Wire Antennas at RF/Microwave Frequencies.

Author

Ndip, Ivan, Öz, Abdurrahman, Tschoban, Christian, Schmitz, Stefan, Schneider-Ramelow, Martin, Guttowski, Stephan, Reichl, Herbert, and Lang, Klaus-Dieter

Subjects
WIRE antennas, RADIO frequency, MICROWAVE frequency converters, BANDWIDTHS, ENGINEERING tolerances
Abstract

Due to the multitude of advantages bond wire antennas have over conventional planar antennas (especially on-chip planar antennas), they have received much research attention within the last four years. The focus of the contributions made so far has been on exploiting different configurations of single-element and array bond wire antennas for short-range applications at RF/microwave frequencies. However, the effects of process tolerances of bond wires on the radiation characteristics of bond wire antennas have not been studied in published literature. Therefore in this paper, we investigate the impact of up to 20% fluctuations in the parameters of bond wires on the performance of 42 GHz and 60 GHz bond wire antennas. Our results reveal that the length and radius of bond wires are the most and least sensitive parameters, respectively. Furthermore, the severity of the impact of process tolerances depends on the impedance bandwidth of the original antenna, before considering the tolerances. For example, a 10% change in the length of a bond wire causes the resonance frequency of a 42 GHz antenna to be shifted out of the specified 3GHz bandwidth (40.5 GHz-43.5 GHz) required for point-to-point communication. However, although a 10% change in length of a bond wire yields a 2.5 GHz shift in the resonance frequency of a 60 GHz bond wire antenna, it doesn't completely detune the antenna because of the original 6 GHz bandwidth available, prior to the fluctuation. Therefore, to prevent the impact of process tolerances from severely degrading the performance bond wire antennas, these antennas should be designed to have larger bandwidths than specified. For experimental verification, a bond wire antenna was designed, fabricated and measured. Very good correlation was obtained between measurement and simulation. [ABSTRACT FROM AUTHOR]

Published
2012

205. Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology

Author

Dieckerhoff, Sibylle, Wernicke, Thies, Kallmayer, Christine, Guttowski, Stephan, and Reichl, Herbert

Abstract

The impact of a reduced package stray inductance on the switching performance of fast power MOSFETs is discussed applying advanced 3D packaging technologies. Starting from an overview over new packaging approaches, a solder bump technology using a flexible PI substrate is exemplarily chosen for the evaluation. Measurement techniques to determine the stray inductance are discussed and compared with a numerical solution based on the PEEC method. Experimental results show the improvement of the voltage utilization while there is only a slight impact on total switching losses.

Published
2008
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