201. Heat transfer performance of sintered Cu microchannels produced by a novel method.
- Author
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Diao, Kaikan and Zhao, Yuyuan
- Subjects
- *
HEAT transfer , *THERMAL management (Electronic packaging) , *HEAT transfer coefficient , *POROUS metals - Abstract
• New sintering method for manufacturing Cu microchannels with multilayers of channels. • Pressure drop significantly lower than LCS porous Cu. • Heat transfer coefficient higher than the conventional machined microchannels. Microchannels have many thermal management applications due to their high heat transfer performance. In this paper, sintered Cu microchannels with well controlled channel diameters of 450 µm, 390 µm and 290 µm, and volume fractions of channels of 0.1, 0.2, 0.3 and 0.4, were manufactured by a new method and their pressure drops and heat transfer coefficients were compared with conventional machined Cu microchannel and porous Cu manufactured by Lost Carbonate Sintering (LCS). The pressure drops of the sintered Cu microchannels were higher than a conventional machined microchannel, but significantly lower than LCS porous Cu samples. The sintered Cu microchannels achieved a similar range of heat transfer coefficients as the LCS porous Cu, with much lower volume fractions of channels. They had higher heat transfer coefficients than the conventional machined microchannel, mainly due to the introduction of multilayers of channels in the metal matrix. Darcy-Weisbach and Sieder-Tate equations with the introduction of appropriate correcting factors can be used to estimate the pressure drop and heat transfer coefficient of the sintered Cu microchannels. There exists a strong correlation between heat transfer coefficient and pumping power. [ABSTRACT FROM AUTHOR]
- Published
- 2019
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