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Abstract: A major obstacle for a viable technological development of dye sensitized solar cells (DSSCs) is still the synthesis of a high performance iodide-conducting polymer electrolyte. Here we present a series of eight electrolytic complexes with formula PEG1000/(MgI2) x (I2) y (0.0038≤ x ≤0.5801, 0≤ y ≤0.0636). The synthesis involves the preparation of a disordered form of MgI2 by a metallorganic route, which enables us to dissolve high amounts of salt in the chosen polymer host. The thermal analysis of the resulting polymer electrolytes was performed using modulated differential scanning calorimetry measurements. Vibrational studies were carried out using medium FT-IR, far FT-IR and FT-Raman. The variation of the CO and OH stretching modes in the medium infrared, as a function of the mole-to-mole ratio n Mg/n O, was investigated by Gaussian decomposition to provide insight into the polymer–polymer and salt–polymer interactions in these materials. The FT-Raman spectra confirmed and complemented the vibrational assignment. The conductivity study of these systems was performed by electrical spectroscopy in the frequency interval 10 mHz–10MHz. The direct current conductivity (σ DC) profiles versus the reciprocal temperature exhibited a Vögel-Tamman-Fülcher (VTF) behavior. The best σ DC at 50°C was 5×10−5 Scm−1. The overall results indicate the presence of bivalent, monovalent and neutral species, Mg2+, [MgI]+ and MgI2, respectively, which participate in the conduction process. These results are consistent with what was previously observed in PEG400-based systems doped with δ-MgCl2. The presence of at least one Mg site containing a distribution in parameters was observed using 25Mg solid state magic angle spinning nuclear magnetic resonance (MAS NMR) spectroscopy. The site has been assigned to a Mg complex involving the coordination by oxygen atoms of the polymer backbone. [Copyright &y& Elsevier]

Abstract: Organic–inorganic hybrid monoliths consisting of poly(methyl methacrylate) and SiO2 were synthesized by the sol–gel process. Three PMMA/TEOS ratios by weight were prepared, namely PMMA/TEOS=80/20, 50/50 and 20/80. The effects of the ratio of PMMA/TEOS on thermal stability, microstructure, morphology and optical properties were systematically studied. In particular, scanning electron microscopy (SEM) demonstrated morphological variation corresponding to the degree of miscibility between organic and inorganic components. Energy dispersive spectroscopy (EDS) clearly revealed that the SiO2 was more uniformly distributed in the hybrids with increasing PMMA content. The refractive index could be adjustable in the range of 1.474–1.486. The 80/20 monolith had the similar transparency to pure PMMA in the visible region and lower absorption than PMMA in the near infrared region, suggesting its potential applications for optical devices. [Copyright &y& Elsevier]

Fused deposition of ceramics (FDC) is one of the developing solid freeform fabrication (SFF) techniques. The successful production of high performance ceramics by the FDC process requires that no defects exist in the green parts. However, build defects, such as missing roads, poorly bonded layers or sub-perimeter voids can be encountered in improperly built FDC parts. In this study, a method known as WIP''ing (warm isostatic pressing) was evaluated for its ability to eliminate existing defects in GS44 Si3N4 green FDC parts. Analogous to CIP''ing (cold isostatic pressing), the green FDC parts were rubber bagged and loaded into a pressure chamber filled with water soluble oil at different temperatures, ranging from 30 to 90°C, at pressures of up to 35 MPa. X-Ray radiography results indicated that at temperatures above 70°C, WIP''ing was effective in closing the gaps of the intentionally placed void defects in FDC parts. However, WIP''ing above 70°C was not effective in healing the defects completely. The fracture strengths of FDC parts with intentional added defects, WIP''ed above 70°C were substantially lower than control samples. [Copyright &y& Elsevier]

The advancement of spatial interaction technology has greatly enriched the domain of consumer electronics. Traditional solutions based on optical technologies suffers high power consumption and significant costs, making them less ideal in lightweight implementations. In contrast, ultrasonic solutions stand out due to their lower power consumption and cost-effectiveness, capturing widespread attention and interest. This paper addresses the challenges associated with the application of ultrasound sensors in spatial localization. Traditional ultrasound systems are hindered by blind spots, large physical dimensions, and constrained measurement ranges, limiting their practical applicability. To overcome these limitations, this paper proposes a miniature ultrasonic spatial localization module employing piezoelectric micromechanical ultrasonic transducers (PMUTs). The module is comprised of three devices each with dimension of 1.2 mm × 1.2 mm × 0.5 mm, operating at a frequency of around 180 kHz. This configuration facilitates a comprehensive distance detection range of 0-800 mm within 80° directivity, devoid of blind spot. The error rate and failure range of measurement as well as their relationship with the SNR (signal-to-noise ratio) are also thoroughly investigated. This work heralds a significant enhancement in hand spatial localization capabilities, propelling advancements in acoustic sensor applications of the meta-universe.

This paper presents a novel piezoelectric micromachined ultrasonic transducer (PMUT) with theoretical simulation, fabrication, and testing. Conventional methods using a PCB or an external horn to adjust the PMUT acoustic field angle are limited by the need for transducer size. To address this limitation, the stepped-tube (expanded tube) backside cavity PMUT has been proposed. The stepped-tube PMUT and the tube PMUT devices have the same membrane structure, and the acoustic impedance matching of the PMUT is optimized by modifying the boundary conditions of the back cavity structure. The acoustic comparison experiments show that the average output sound pressure of the stepped-tube backside cavity PMUT has increased by 17%, the half-power-beam-width (θ -3db ) has been reduced from 55° to 30° with a reduction of 45%, and the side lobe level signal is reduced from 147 mV to 66 mV. In addition, this work is fabricated on an eight-inch wafer. The process is compatible with standard complementary metal oxide semiconductor (CMOS), conditions are stable, and the cost is controllable, plus it facilitates the batch process. These conclusions suggest that the stepped-tube backside cavity PMUT will bring new, effective, and reliable solutions to ranging applications.