351. Kinetics analysis and simulation of sequential epoxy dual-curing systems with independent thermal activation
- Author
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David Santín, Osman Konuray, Xavier Fernández-Francos, Xavier Ramis, Universitat Politècnica de Catalunya. Departament de Màquines i Motors Tèrmics, and Universitat Politècnica de Catalunya. POLTEPO - Polímers Termoestables Epoxídics
- Subjects
Kinetics analysis ,Materials science ,Polymers ,Kinetics ,Thermosetting polymer ,Enginyeria dels materials::Materials plàstics i polímers [Àrees temàtiques de la UPC] ,02 engineering and technology ,Dual curing ,Dual-curing ,01 natural sciences ,Chemistry, Physical and theoretical ,Thermal ,Physical and Theoretical Chemistry ,Composite material ,Instrumentation ,Curing (chemistry) ,Amine ,Latent base ,Epoxy ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,Thermosets ,010406 physical chemistry ,0104 chemical sciences ,Polímers ,Polymerization ,visual_art ,visual_art.visual_art_medium ,0210 nano-technology ,Enginyeria química::Química física [Àrees temàtiques de la UPC] ,Fisicoquímica - Abstract
The curing kinetics of a sequential dual-curing system based on an off-stoichiometric amine-epoxy formulation with intermediate latent reactivity has been analyzed. The first curing stage is an epoxy-amine polycondensation taking place at low temperatures, while the second curing stage is an anionic homopolymerization of the excess epoxy groups, taking place at high temperatures and catalyzed by a latent base. The different reactivity of both polymerization processes allows an excellent separation into well-defined curing stages each of which can be analyzed individually. The kinetics of the two curing stages have been analyzed by integral isoconversional procedures and model-fitting methods. Both methodologies successfully simulated each curing stage and also the global curing process, showing that it is possible to control the activation of both curing stages. Isoconversional integral analysis is a simple yet powerful method that can be used for the simulation of temperature-controlled curing programmes. Model-fitting analysis is more suitable for the flexible simulation of processing scenarios such as the curing of composites.