279 results on '"Jalar, Azman"'
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252. Shock Wave Effect on Micromechanics Properties of Sn-Ag-Cu solder (SAC 387) via Nanoindentation
253. Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds.
254. Flux Modification for Wettability and Reliability Improvement in Solder Joints
255. The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation and Experimental
256. Solder Paste’s Rheology Data for Stencil Printing Numerical Investigations
257. Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders
258. The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth
259. Reliability Analysis on the Flexible Printed Circuit Board After Reflow Soldering
260. Tin Whiskers Growth in Electronic Assemblies
261. Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints
262. Development of Geopolymer Ceramic-Reinforced Solder
263. Significance of Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint, Methods of IMC Layer Thickness Measurements
264. Molecular Dynamic of the Nanoparticle Reinforcement in the Pb-Free Solder During Reflow Soldering Process
265. Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder
266. Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi
267. Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder Paste
268. Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics
269. Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint.
270. Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages.
271. Microstructural evolution and micromechanical properties of gamma-irradiated Au ball bonds.
272. Effect of wafer thinning methods towards fracture strength and topography of silicon die
273. The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
274. Bondability of ultrasonic Aluminum bonds on the molybdenum (de)selenide and molybdenum of back contact layer of copper indium gallium (de)selenide CIGS thin film photovoltaic solar panel.
275. Study of the side gate junctionless transistor in accumulation region.
276. Oxidation behaviour of ferritic stainless steel grade Crofer 22 APU at 700 °C in flowing Ar−75%CO{sub 2}−12%H{sub 2}O
277. Structural phase transformations in radiolytically synthesized Al-Cu bimetallic nanoparticles.
278. In-vitro bioactivity of wollastonite materials derived from limestone and silica sand.
279. Synthesis and characterization of ZnO thin films by thermal evaporation
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