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353. A 0.35-0.8V 8b 0.5-35MS/s 2bit/step extremely-low power SAR ADC.

354. A 12.5Gb/s/link non-contact multi drop bus system with impedance-matched Transmission Line Couplers and Dicode partial-response channel transceivers.

355. Simultaneous data and power transmission using nested clover coils.

356. Session 23 overview: Advances in heterogeneous integration: Technology directions subcommittee.

357. Near-field wireless connection for 3D-system integration.

363. Introduction to the Special Issue on the 2005 Symposium on VLSI Circuits.

364. Introduction to the Special Issue.

368. A 300 mV sub-threshold region 2.4 GHz voltage-controlled oscillator and frequency divider with transformer technique for ultralow power RF applications.

369. Asynchronous Pulse Transmitter for Power Reduction in Inductive-Coupling Link.

370. Wireless proximity interfaces with a pulse-based inductive coupling technique.

371. Low-Power and ppm-Level Multimolecule Detection by Integration of Self-Heated Metal Nanosheet Sensors.

372. A 96-MB 3D-Stacked SRAM Using Inductive Coupling With 0.4-V Transmitter, Termination Scheme and 12:1 SerDes in 40-nm CMOS.

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