1. 三维集成电子封装中 TGV 技术及其器件应用进展.
- Author
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张 迅, 王晓龙, 李宇航, 行 琳, 刘松林, 阳威, 洪华俊, 罗宏伟, and 王如志
- Abstract
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- Published
- 2024
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