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Copyright of Journal of Food Safety & Quality is the property of Journal of Food Safety & Quality Editorial Department and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Food & Fermentation Industries is the property of Food & Fermentation Industries and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Journal of Henan University of Technology Natural Science Edition is the property of Henan University of Technology Journal Editorial Department and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Journal of Henan University of Technology Natural Science Edition is the property of Henan University of Technology Journal Editorial Department and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Shipin Kexue/ Food Science is the property of Food Science Editorial Department and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Shipin Kexue/ Food Science is the property of Food Science Editorial Department and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

3D microprocessors have advantages of high-level integration，short global interconnection and more connecting parts. However the traditional 3D topology cannot take full advantage of the characteristics 3D integrated circuits in the vertical direction. It is difficult for these structures to meet the requirements of large-scale many-core processors，such as short diameter，high-bandwidth and highly scalability. We propose a 3D on-chip interconnection network topology，called V-Spidergon. In the horizontal layer, the V-Spidergon adopts the Spidergon topology in the horizontal layer and a domain-based interconnected structure in the vertically direction. The entire vertical network is divided into multi-level domains according to the hierarchical domain thought, and every domain interconnects with each other. Simulation results show that the time delays in 8 layers，16 layers and 32 layers of the V-Spidergon are lower than those of the 3D-Mesh by 15. 1%, 28. 5% ？ 55. 7% respectively，and are also lower than those of the NoC-Bus by 11. 5% 32. 7% and 77. 6% respectively under injections of 15% and 100% load rates，the average time delay o£ the V-Spidergon does not increase with the growth of horizontal layers. [ABSTRACT FROM AUTHOR]

Toll 样受体（TLR）2 在先天性免疫和适应性免疫中都起着重要作用，近年来，越来越多的文献报 道TLR2 与移植排斥反应密切相关，针对TLR2 信号系统的相关免疫抑制靶点研发的免疫抑制剂可能会减轻器官 移植术后的排斥反应。本文综述了TLR2 在缺血- 再灌注损伤、同种器官移植以及异种器官移植中的近期研究进展。 [ABSTRACT FROM AUTHOR]