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Multifunctional polymer matrix composites (PMCs) exhibiting increased thermal and electrical conductivity can be achieved by adding conductive carbon-based fillers in the polymer matrix. Emerging markets for thermally and electrically conductive PMCs include heat management devices in electronics, light emitting diodes, and/or photovoltaics cells as well as bipolar plates in fuel cells. In this study, the effects of micro-sized and nanosized carbon fillers [e.g., pitch-based carbon fibers (CF), multiwalled carbon nanotubes (MWNT), and graphene nanoplatelets (GNPs)] on the multifunctional properties of polyphenylene sulfide (PPS) matrix composites were investigated. Among the three carbon-based fillers, experimental results revealed that GNPs were the most effective fillers to promote the PMC's effective thermal conductivity ([k.sub.eff]). The highest ken of 1.94 W/m K was attained by adding 30.0 wt% (i.e., 22.4 vol%) of GNPs in the PPS matrix. The nano-sized MWNTs and GNPs had lower percolation threshold than the micron sized CFs to suppress the composite's electrical impedance. However, the coefficient of thermal expansion and the compressive elastic modulus of the composites were only slightly improved with the filler addition. The different levels of improvement in the composite's multifunctional properties can be related to the filler geometry, filler size, and the composite's phase morphology. POLYM. ENG. SCI., 53:2398-2406, 2013. © 2013 Society of Plastics Engineers, INTRODUCTION Engineering plastics are gaining traction in various emerging markets such as under-the-hood automotive applications, sensors and housing for motors, electronic components, and light-emitting diodes (LED), replacing traditionally used metal [...]

Development of novel injection moldable materials that are thermally conductive but electrically insulative are important for the continuous advancement in modern electronics. In this context, this article details the fabrication and characterization of polymer–matrix composites (PMC), which consists of linear low-density polyethylene matrix, and filled with either silicon carbide or hexagonal boron nitride. Experimental results indicated that the addition of ceramic fillers not only promoted the PMCs’ effective thermal conductivity without compromising their electrical resistivity but also resulted in the reduction of coefficient of thermal expansion and improved mechanical properties. [ABSTRACT FROM AUTHOR]

The future of integrated circuits with three-dimensional chip architecture hinges on the development of practical solutions for the management of excessive amounts of heat generation. This requires new polymer-matrix composites (PMCs), with good processibility, high effective thermal conductivity ( keff), and low but tailored electrical conductivity (σ). This article explores the synergy of hybrid fillers: (i) hexagonal boron nitride (hBN) platelets with different sizes and shapes; (ii) hBN platelets with carbon-based fillers promoting the keff of the polyphenylene sulfide (PPS) composites. It explores the promotion of interconnectivity among the fillers in the PPS matrix, leading to higher keff, by the uses of hybrid fillers. It discusses using carbon-based fillers as secondary fillers to tailor the PMCs' σ. Finally, it presents the effects of hybrid fillers on the PMCs' coefficient of thermal expansion. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013 [ABSTRACT FROM AUTHOR]