Search

Your search keyword '"Ai Kehua"' showing total 15 results
Start Over Author "Ai Kehua"
15 results on '"Ai Kehua"'

8. Study of microvia filling process based on multi-physical coupling

Author

Yuanming Chen, Shidong Su, Wei He, Hexian Nie, Linxian Ji, and Ai Kehua

Subjects
Coupling, Microvia, Interconnection, Materials science, 020209 energy, Metals and Alloys, Process (computing), Mechanical engineering, 02 engineering and technology, Surfaces and Interfaces, Condensed Matter Physics, Surfaces, Coatings and Films, Printed circuit board, Mechanics of Materials, 0202 electrical engineering, electronic engineering, information engineering
Abstract

The microvia filling process used in the high-density interconnect printed circuit board manufacturing industry was investigated by multi-physical coupling technology. To achieve a perfect ...

Published
2018
Full Text
View/download PDF

9. Tetraoxa-Diphosphaspiro Derivative as Suppressor for Microvia Filling by Copper Electroplating in Acidic Solution

Author

Shouxu Wang, Yuanming Chen, Ai Kehua, Jing Li, Yongqiang Peng, Zhihua Tao, Wei He, and Yan Hong

Subjects
Microvia, Materials science, Renewable Energy, Sustainability and the Environment, 020209 energy, 02 engineering and technology, Condensed Matter Physics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, chemistry, 0202 electrical engineering, electronic engineering, information engineering, Materials Chemistry, Electrochemistry, Copper plating, Derivative (chemistry), Nuclear chemistry
Published
2017
Full Text
View/download PDF

12. Preparation and Properties of Cyanate/Epoxy-based Composite with Thermal Conductive Silica Particles

Author

Huaiwu Zhang, Yuanming Chen, Chong Wang, Ai Kehua, Kai Zhu, Yang Wenjun, Xuemei He, Wei He, and Yongqing Peng

Subjects
Materials science, Thermal decomposition, Composite number, Epoxy, Dielectric, Cyanate, chemistry.chemical_compound, Thermal conductivity, chemistry, visual_art, visual_art.visual_art_medium, Thermal stability, Composite material, Dispersion (chemistry)
Abstract

Cyanate/epoxy (CE/EP) was added with surface-modified silica (SiO2) particles to form a composite system. Microstructure of the composites was observed to find the dispersion effect of SiO2 particles in the CE/EP matrix. Thermal conductivity, thermal stability and dielectric properties were also tested to investigate the effects of SiO2 particles. CE/EP-based composite with 50 wt% SiO2 exhibited thermal conductivity of 0.492 W.m−1.K−1, thermal decomposition temperature of 420 °C and dielectric constant of 4.1 at 1 MHz.

Published
2018
Full Text
View/download PDF

15. Tetraoxa-Diphosphaspiro Derivative as Suppressor for Microvia Filling by Copper Electroplating in Acidic Solution

Author

Li, Jing, Wang, Shouxu, Chen, Yuanming, Ai, Kehua, Peng, Yongqiang, and Hong, Yan

Abstract

In this work, a novel suppressor, tetraoxa-diphosphaspiro derivative (MPTD) was applied in copper electroplating solution for microvia filling. The suppression function of MPTD and its synergistic effect with other additives during copper electroplating were investigated by means of galvanostatic measurements, cyclic voltammetric and EIS. The surface morphology of electrodeposition experiments was examined using a scanning electron microscope (SEM). The filling performance was evaluated by observing the obtained cross-sectional views of the microvias after electroplating. The galvanostatic measurements results revealed the strong synergistic inhibitory effect on both MPTD and chloride ions. In addition, the results from cyclic voltammetry (CV) measurements indicates that the concentration of the plating additives (such as suppressor, accelerator and leveler) at fixed relative proportion required an optimal Cl[?] concentration in the plating bath to reach the strongest suppression strength. The negative values of DG0ads suggest that the synergistic inhibitory effect of Cl[?] onto the cathode surface is a spontaneous process. The values of the standard free energy of adsorption reveals that Cl[?] adsorbed on Cu surface involves both chemisorption and physisorption. This improved copper plating solution composed of CuSO4, H2SO4, MPTD, SPS, chloride ions, and JGB is optimal and capable to perform bottom-up copper filling of microvias.

Published
2017

Catalog

Books, media, physical & digital resources
See catalog results