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Optoelectronics is a valuable solution to scale up wireless links frequency to sub-THz in the next generation antenna systems and networks. We propose an innovative, low-power consumption, small footprint building block for 5G and 6G new radio wireless transmission allowing broadband capacity (e.g., 10–100 Gb/s per link and beyond). We pioneer the first wireless datalink based on graphene, reaching setup limited sub-THz carrier frequency and multi-Gbit/s data rate using a graphene-based integrated optoelectronic mixer capable of mixing an optically generated ~ 100 GHz reference oscillator with a baseband electrical signal. We report > 96GHz optoelectronic bandwidth and − 44 dB upconversion efficiency with a footprint significantly smaller than those of state-of-the-art photonic transmitters (i.e., 2). This paves the way to the development of novel arrayed-antennas for millimeter-wave technology relying on a new approach which takes advantage of optics. These results have been achieved thanks to an integrated-photonic technology based on wafer-scale high-mobility graphene.

Graphene is ideally suited for optoelectronics. It offers absorption at telecom wavelengths, high-frequency operation and CMOS-compatibility. We show how high speed optoelectronic mixing can be achieved with high frequency (~20 GHz bandwidth) graphene field effect transistors (GFETs). These devices mix an electrical signal injected into the GFET gate and a modulated optical signal onto a single layer graphene (SLG) channel. The photodetection mechanism and the resulting photocurrent sign depend on the SLG Fermi level (E

Graphene has been proposed to be integrated with Si Photonics because of its very high mobility, fast carrier dynamics and ultra-broadband optical properties. High speed graphene photodetectors have been demonstrated so far, however the most are based on the photo-bolometric or photo-conductive effect. These devices are characterized by large dark current, in the order of milli-Amperes. Photothermal effect (PTE) photodetectors can be used in voltage detection mode with no dark current, it is ultra fast and it operates near zero-bias. Graphene PTE-based photodetectors have been reported so far but high-speed optical telecommunication signal detection has not been shown yet. Here, we report on a graphene PTE-based photodetector on SOI waveguide. Thanks to the optimized design we show a direct detection of 105Gb/s non-return to zero (NRZ) and 120Gb/s 4-level pulse amplitude modulation (PAM) optical signals.

Electro-absorption (EA) waveguide-coupled modulators are essential building blocks for on-chip optical communications. Compared to state-of-the-art silicon (Si) devices, graphene-based EA modulators promise smaller footprints, larger temperature stability, cost-effective integration and high speeds. However, combining high speed and large modulation efficiencies in a single graphene-based device has remained elusive so far. In this work, we overcome this fundamental trade-off by demonstrating the 2D-3D dielectric integration in a high-quality encapsulated graphene device. We integrated hafnium oxide (HfO2) and two-dimensional hexagonal boron nitride (hBN) within the insulating section of a double-layer (DL) graphene EA modulator. This combination of materials allows for a high-quality modulator device with high performances: a ~39 GHz bandwidth (BW) with a three-fold increase in modulation efficiency compared to previously reported high-speed modulators. This 2D-3D dielectric integration paves the way to a plethora of electronic and opto-electronic devices with enhanced performance and stability, while expanding the freedom for new device designs., Here, three-dimensional hafnium oxide and two-dimensional hexagonal boron nitride are integrated in the insulating section of double-layer graphene optical modulators, leading to a maximum bandwidth of 39 GHz and enhanced modulation efficiency.

International audience; High-mobility hexagonal boron nitride (hBN)/graphene/ hBN heterostructures are able to reach intrinsic limits of transport. Here, we investigate optoelectronic mixing, which is a demanding function combining efficient photodetection and fast carrier dynamics. Using such a heterostructure embedded in a coplanar waveguide, we obtain a record conversion efficiency of about −40 dB for frequencies up to 65 GHz. This performance is obtained at high doping in the photobolometric regime. We provide a microscopic model of the photodetection, which accurately describes the experimental observations, allows the assessment of the intrinsic limits of our device, and paves the way for device optimization by revealing the different mechanisms at play.

Electro-absorption (EA) waveguide-coupled modulators are essential building blocks for on-chip optical communications. Compared to state-of-the-art silicon (Si) devices, graphene based EA modulators promise smaller footprints, larger temperature stability, cost-effective integration and high speeds. However, combining high speed and large modulation efficiencies in a single graphene-based device has remained elusive so far. In this work, we overcome this fundamental trade-off by demonstrating the first 2D-3D dielectric integration in a high-quality encapsulated graphene device. We integrated hafnium oxide (HfO2) and two-dimensional hexagonal boron nitride (hBN) within the insulating section of a double-layer (DL) graphene EA modulator. This novel combination of materials allows for a high-quality modulator device with record high performances: a ∼39GHz bandwidth (BW) with a three-fold increase in modulation efficiency compared to previously reported high speed modulators. This first demonstration of 2D-3D integration paves the way to a plethora of electronic and opto-electronic devices with enhanced performance and stability, while expanding the freedom for new device designs.

The future global-scale quantum communication network will require free-space and satellite links able to work in daylight conditions and compatible with the telecom fiber infrastructure. Here we present a full prototype for daylight quantum key distribution at 1550 nm exploiting an integrated silicon-photonics chip as state encoder. We tested our prototype in the urban area of Padua (Italy) over a 145m-long free-space link, obtaining a quantum bit error rate around 0.5% and an averaged secret key rate of 30 kbps. The developed chip represents a cost-effective solution for portable free-space transmitters and a promising resource for future satellite missions.

We report compact, scalable, high-performance, waveguide integrated graphene-based photodetectors (GPDs) for telecom and datacom applications, not affected by dark current. To exploit the photothermoelectric (PTE) effect, our devices rely on a graphene-polymer-graphene stack with static top split gates. The polymeric dielectric, poly(vinyl alcohol) (PVA), allows us to preserve graphene quality and to generate a controllable p-n junction. Both graphene layers are fabricated using aligned single-crystal graphene arrays grown by chemical vapor deposition. The use of PVA yields a low charge inhomogeneity 8 x 10$^{10}$ $cm^{-2}$ at the charge neutrality point, and a large Seebeck coefficient 140 ${\mu}$V K$^{-1}$, enhancing the PTE effect. Our devices are the fastest GPDs operating with zero dark current, showing a flat frequency response up to 67 GHz without roll-off. This performance is achieved on a passive, low-cost, photonic platform, and does not rely on nanoscale plasmonic structures. This, combined with scalability and ease of integration, makes our GPDs a promising building block for next-generation optical communication devices., Comment: 15 pages, 11 figures. Published under ACS AuthorChoice license

The challenge of next generation datacom and telecom communication is to increase the available bandwidth while reducing the size, cost and power consumption of photonic integrated circuits. Silicon (Si) photonics has emerged as a viable solution to reach these objectives. Graphene, a single-atom thick layer of carbon5, has been recently proposed to be integrated with Si photonics because of its very high mobility, fast carrier dynamics and ultra-broadband optical properties. Here, we focus on graphene photodetectors for high speed datacom and telecom applications. High speed graphene photodetectors have been demonstrated so far, however the most are based on the photo-bolometric (PB) or photo-conductive (PC) effect. These devices are characterized by large dark current, in the order of milli-Amperes , which is an impairment in photo-receivers design, Photo-thermo-electric (PTE) effect has been identified as an alternative phenomenon for light detection. The main advantages of PTE-based photodetectors are the optical power to voltage conversion, zero-bias operation and ultra-fast response. Graphene PTE-based photodetectors have been reported in literature, however high-speed optical signal detection has not been shown. Here, we report on an optimized graphene PTE-based photodetector with flat frequency response up to 65 GHz. Thanks to the optimized design we demonstrate a system test leading to direct detection of 105 Gbit s-1 non-return to zero (NRZ) and 120 Gbit s-1 4-level pulse amplitude modulation (PAM) optical signals

International audience; We present technological building blocks and concepts under study which could ease the build-up of future THz remote sensing and communication systems. Critical issues regarding such systems mainly rely on the availability of sensitive and compact detectors together with powerful, large bandwidth and versatile sources.

Resonant cavities, confining light in sub-wavelength dimensions are key elements of the rapid advance in the development of on-chip optoelectronic devices. Recently, graphene has been studied for its physical and device properties, revealing fascinating properties for ultrafast and compact communication systems [1]. However, the response cannot compete with state-of-the art technology. Here, we present a detector concept combining a resonant cavity together with graphene as shown in Fig 1(a). The constructive interference inside the ring gives rise to an absorption of the guided light near unity. Dual-gate electrodes centred on top of the active layer allows to generate a pn-junction in the graphene layer, optimizing the response due to the photo-thermoelectric (PTE) effect [2]. The remarkable strong light-matter interaction results in an elevated temperature of the photo-excited carriers of several hundreds of Kelvin, depending on the input power as the data in Fig 1(b) shows. Thus, showing a nonlinear behaviour of the carrier temperature as suggested in the supercollision model [3]. The detector reaches a record high responsivity fore PTE-based detectors of 28 V/W and an electrical 3dB cut-off frequency of 10 GHz.

We report on a C-band double layer graphene electro-absorption modulator on a passive SOI platform showing 29GHz 3dB-bandwith and NRZ eye-diagrams extinction ratios ranging from 1.7 dB at 10 Gb/s to 1.3 dB at 50 Gb/s. Such high modulation speed is achieved thanks to the quality of the CVD pre-patterned single crystal growth and transfer on wafer method that permitted the integration of high-quality scalable graphene and low contact resistance. By demonstrating this high-speed CVD graphene EAM modulator integrated on Si photonics and the scalable approach, we are confident that graphene can satisfy the main requirements to be a competitive technology for photonics.

Here we present a daylight QKD system using silicon photonics. The system exhibits continuous daytime operation, outperforms comparable systems by two orders of magnitude, and represents a promising resource for future satellite missions.

Graphene-based devices are edging closer to industrialization, at first instance related to sensors and opto-electronics applications. In particular, graphene-based photodetectors(1) and modulators have already shown competitive performances and proof-on-concept integration with Si-CMOS technologies has been demonstrated(2). For example, graphene modulators are reaching, and even surpassing(3), state-of-the-art commercial modulators. In order to fulfil all industrial requirements, new dielectric combinations providing flat encapsulation for graphene that allow high levels of doping control and hysteresis-free operation are needed. In this work, we present a newly developed dielectric combination based on two-dimensional (2D) materials and a three-dimensional (3D) high-kappa dielectric. This 2D-3D integration of graphene, hexagonal Boron Nitride (hBN) and hafnium oxide (HfO2) allows us to combine the high-quality of hBN-encapsulated graphene, while achieving high values of relative permittivity (epsilon(r)) and high breakdown voltages (V-BD). To confirm the benefits of such a 2D-3D compound, we fabricated a double-layer (DL) graphene electro-absorption (EA) modulator employing this novel hBN/HfO2/hBN dielectric. The graphene-based modulator shows nearly hysteresis-free operation with strong doping tunability to allow for a large extinction ratio(3). In this work, we discuss the fabrication procedures to integrate these 2D and 3D materials and highlight the importance of the dielectric layer for the quality of graphene by comparing several dielectric combinations by means of Raman spectroscopy and opto-electronic measurements.

The future envisaged global-scale quantum-communication network will comprise various nodes interconnected via optical fibers or free-space channels, depending on the link distance. The free-space segment of such a network should guarantee certain key requirements, such as daytime operation and the compatibility with the complementary telecom-based fiber infrastructure. In addition, space-to-ground links will require the capability of designing light and compact quantum devices to be placed in orbit. For these reasons, investigating available solutions matching all the above requirements is still necessary. Here we present a full prototype for daylight quantum key distribution at 1550 nm exploiting an integrated silicon-photonics chip as state encoder. We tested our prototype in the urban area of Padua (Italy) over a 145 m-long free-space link, obtaining a quantum bit error rate around 0.5% and an averaged secret key rate of 30 kbps during a whole sunny day (from 11:00 to 20:00). The developed chip represents a cost-effective solution for portable free-space transmitters and a promising resource to design quantum optical payloads for future satellite missions.

© 2016 American Chemical Society. The remarkable properties of graphene, such as broadband optical absorption, high carrier mobility, and short photogenerated carrier lifetime, are particularly attractive for high-frequency optoelectronic devices operating at 1.55 μm telecom wavelength. Moreover, the possibility to transfer graphene on a silicon substrate using a complementary metal-oxide-semiconductor-compatible process opens the ability to integrate electronics and optics on a single cost-effective chip. Here, we report an optoelectronic mixer based on chemical vapor-deposited graphene transferred on an oxidized silicon substrate. Our device consists in a coplanar waveguide that integrates a graphene channel, passivated with an atomic layer-deposited Al2O3 film. With this new structure, 30 GHz optoelectronic mixing in commercially available graphene is demonstrated for the first time. In particular, using a 30 GHz intensity-modulated optical signal and a 29.9 GHz electrical signal, we show frequency downconversion to 100 MHz. These results open promising perspectives in the domain of optoelectronics for radar and radio-communication systems.

© 2016 Author(s).We report on statistical analysis and consistency of electrical performances of devices based on a large scale passivated graphene platform. More than 500 graphene field effect transistors (GFETs) based on graphene grown by chemical vapor deposition and transferred on 4 in. SiO2/Si substrates were fabricated and tested. We characterized the potential of a two-step encapsulation process including an Al2O3 protection layer to avoid graphene contamination during the lithographic process followed by a final Al2O3 passivation layer subsequent to the GFET fabrication. Devices were investigated for occurrence and reproducibility of conductance minimum related to the Dirac point. While no conductance minimum was observed in unpassivated devices, 75% of the passivated transistors exhibited a clear conductance minimum and low hysteresis. The maximum of the device number distribution corresponds to a residual doping below 5 × 1011 cm−2 (0.023 V/nm). This yield shows that GFETs integrating low-doped graphene and exhibiting small hysteresis in the transfer characteristics can be envisaged for discrete components, with even further potential for low power driven electronics.

Graphene and related materials can lead to disruptive advances in next generation photonics and optoelectronics. The challenge is to devise growth, transfer and fabrication protocols providing high (>5,000 cm2 V-1 s-1) mobility devices with reliable performance at the wafer scale. Here, we present a flow for the integration of graphene in photonics circuits. This relies on chemical vapour deposition (CVD) of single layer graphene (SLG) matrices comprising up to ~12000 individual single crystals (SCs), grown to match the geometrical configuration of the devices in the photonic circuit. This is followed by a transfer approach which guarantees coverage over ~80% of the device area, and integrity for up to 150 mm wafers, with room temperature mobility ~5000 cm2 V-1 s-1. We use this process flow to demonstrate double SLG electro-absorption modulators with modulation efficiency ~0.25, 0.45, 0.75, 1 dB V-1 for device lengths ~30, 60, 90, 120 {\mu}m. The data rate is up to 20 Gbps. Encapsulation with single-layer hBN is used to protected SLG during plasma-enhanced CVD of Si3N4, ensuring reproducible device performance. Our full process flow (from growth to device fabrication) enables the commercial implementation of graphene-based photonic devices., Comment: 30 pages, 9 Figures

Integrated photonics is a promising technology for next generation sub-THz links. We propose a new transmitter based on a graphene optoelectronic mixer as active material and demonstrate its operation at ~100 GHz carrier frequency.

This paper deals with the fabrication of Resistive Random Access Memory (ReRAM) based on oxidized carbon nanofibers (CNFs). Stable suspensions of oxidized CNFs have been prepared in water and sprayed on an appropriate substrate, using the dynamic spray-gun deposition method, developed at Thales Research and Technology. This technique allows extremely uniform mats to be produced while heating the substrate at the boiling point of the solvent used for the suspensions. A thickness of around 150 nm of CNFs sandwiched between two metal layers (the metalized substrate and the top contacts) has been achieved, creating a Metal-Insulator-Metal (MIM) structure typical of ReRAM. After applying a bias, we were able to change the resistance of the oxidized layer between a low (LRS) and a high resistance state (HRS) in a completely reversible way. This is the first time that a scientific group has produced this kind of device using CNFs and these results pave the way for the further implementation of this kind of memory on flexible substrates.