1. Scalable CMOS-BEOL compatible AlScN/2D Channel FE-FETs
- Author
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Kim, Kwan-Ho, Oh, Seyong, Fiagbenu, Merrilyn Mercy Adzo, Zheng, Jeffrey, Musavigharavi, Pariasadat, Kumar, Pawan, Trainor, Nicholas, Aljarb, Areej, Wan, Yi, Kim, Hyong Min, Katti, Keshava, Tang, Zichen, Tung, Vincent C., Redwing, Joan, Stach, Eric A., Olsson III, Roy H., and Jariwala, Deep
- Subjects
Physics - Applied Physics ,Condensed Matter - Mesoscale and Nanoscale Physics ,Condensed Matter - Materials Science - Abstract
Intimate integration of memory devices with logic transistors is a frontier challenge in computer hardware. This integration is essential for augmenting computational power concurrently with enhanced energy efficiency in big-data applications such as artificial intelligence. Despite decades of efforts, reliable, compact, energy efficient and scalable memory devices are elusive. Ferroelectric Field Effect Transistors (FE-FETs) are a promising candidate but their scalability and performance in a back-end-of-line (BEOL) process remain unattained. Here, we present scalable BEOL compatible FE-FETs using two-dimensional (2D) MoS2 channel and AlScN ferroelectric dielectric. We have fabricated a large array of FE-FETs with memory windows larger than 7.8 V, ON/OFF ratios of greater than 10^7, and ON current density greater than 250 uA/um, all at ~80 nm channel lengths. Our devices show stable retention up to 20000 secs and endurance up to 20000 cycles in addition to 4-bit pulse programmable memory features thereby opening a path towards scalable 3D hetero-integration of 2D semiconductor memory with Si CMOS logic.
- Published
- 2022