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5. Stress memorization technique-fundamental understanding and low-cost integration for advanced CMOS technology using a nonselective process

7. Effects of [Al.sub.2][O.sub.3] dielectric cap and nitridation on device performance, scalability, and reliability for advanced high-k/metal gate pMOSFET applications

8. Electrical characteristics of 8 Angstrom EOT Hf[O.sub.2]/TaN low thermal-budget n-channel FETs with solid-phase epitaxially regrown junctions

9. Electrical and physical characterization of remote plasma oxidized Hf[O.sub.2] gate dielectrics

16. Diffusion and Gate Replacement: A New Gate-First High- $k$ /Metal Gate CMOS Integration Scheme Suppressing Gate Height Asymmetry

31. Trapping in 1nm EOT high-k/MG

34. Endurance of One Transistor Floating Body RAM on UTBOX SOI

38. (Invited) Advanced Dielectrics Targeting 2X DRAM MIM Capacitors

44. Insight Into N/PBTI Mechanisms in Sub-1-nm-EOT Devices

49. Advanced PBTI reliability with 0.69nm EOT GdHfO gate dielectric

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