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Organic Electronics provides multiple technological advantages such as low cost, flexibility, solution processability and waste reduction through the use of new materials and alternative fabrication techniques in the microelectronic world. The use of additive and printed fabrication processes allows the development of instantly fabricated, fully additive, low temperature processing together with lightweight, bendable, scalable and sustainable systems. Different models have been presented in the field but none of them with an industrial implementation. Complete simulation models are very useful for circuit production and commercialization since the organic electronics market is expected to grow in the near future and the need for industrial solutions for designers will increase. For this reason and for the first time, we present a compact model of DC and AC behaviour combined with different ambient conditions and parameter variability for full organic electronic system simulations.

[ES] Los circuitos integrados RFID comprenden un circuito analógico (2), con un circuito rectificador (3) y otras etapas electrónicas, y un circuito digital (5). El procedimiento de la invención se basa en la separación de la fabricación del circuito rectificador (3) del resto de componentes del circuito integrado RFID (1) y comprende las etapas de: fabricación del circuito rectificador (3) del circuito analógico (2), fabricación de las etapas electrónicas adicionales (4, 9, 10, 11) del circuito analógico (2), fabricación del circuito digital (5), y unión del circuito rectificador (3), las etapas electrónicas adicionales (4, 9, 10, 11) y el circuito digital (5). Además, el circuito RFID se puede unir a una antena (7) RFID, que incluso se puede fabricar simultáneamente al circuito rectificador (3), constituyendo así una etiqueta RFID (6)., [EN] The present invention relates to RFID integrated circuits comprising an analogue circuit (2), with a rectifier circuit (3) and other electronic steps, and a digital circuit (5). The method of the invention is based on the separation of the manufacture of the rectifier circuit (3) from the rest of the components of the RFID integrated circuit (1) and comprises the steps of: manufacturing the rectifier circuit (3) of the analogue circuit (2), manufacturing the additional electronic steps (4, 9, 10, 11) of the analogue circuit (2), manufacturing the digital circuit (5), and attaching the rectifier circuit (3), the additional electronic steps (4, 9, 10, 11) and the digital circuit (5). In addition, the RFID circuit can be attached to an RFID antenna (7), which can even be manufactured simultaneously with the rectifier circuit (3), thus making up an RFID tag (6)., [FR] Les circuits intégrés RFID comprennent un circuit analogique (2), avec un circuit redresseur (3) et d'autres étapes électroniques, et un circuit numérique (5). Le procédé de l'invention repose sur la séparation de la fabrication du circuit redresseur (3) du reste des composants du circuit intégré RFID (1) et comprend les étapes de fabrication du circuit redresseur (3) du circuit analogique (2), d'élaboration des étapes électroniques supplémentaires (4, 9, 10, 11) du circuit analogique (2), de fabrication du circuit numérique (5), et de liaison du circuit redresseur (3), des étapes électroniques supplémentaires (4, 9, 10, 11) et du circuit numérique (5). En outre, le circuit RFID peut être relié à une antenne (7) RFID qui peut être fabriquée simultanément au circuit redresseur (3), constituant ainsi une étiquette RFID (6).

Organic and printed electronics (OE) is a promising technology for reducing the waste and the price of electronic systems for new devices. OE offers technological advantages not available in conventional silicon processes such as physical flexibility, large area fabrication, mask-less deposition, low process temperatures and fully additive manufacturing—processes that all enable low-cost and low-waste fabrication techniques. Despite these advantages, important difficulties remain for developing compact models for transistors due to intrinsic variability in the manufacturing process and the behaviour of organic materials, which make it difficult to match the model and the experimental data. Due to disparity in the fabrication methodologies and the different topologies of transistors used, the diversity in compact models is noticeable. These different models provide specific solutions for particular devices and require various process design kits (PDKs) for each manufacturing process. This review covers the different PDKs developed in the OE field and compares them with the electric models used for simulation purposes. Both simulated and fabricated systems are included with the aim of providing the reader with a clear state-of-the-art of the OE situation.

It is well known that organic thin film transistor (OTFT) parameters can be shifted depending on the geometry of the device. In this work, we present two different transistor geometries, interdigitated and Corbino, which provide differences in the key parameters of devices such as threshold voltage (VT), although they share the same materials and fabrication procedure. Furthermore, it is proven that Corbino geometries are good candidates for saturation-mode current driven devices, as they provide higher ION/IOFF ratios. By taking advantage of these differences, circuit design can be improved and the proposed geometries are, therefore, particularly suited for the implementation of logic gates. The results demonstrate a high gain and low hysteresis organic monotype inverter circuit with full swing voltage at the output