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This work investigated the Vickers hardness and compressive properties of 0–30 % ZrMgMo 3 O 12p /2024Al composites with controlled thermal expansion. The composites exhibited superior Vickers hardness and compressive properties, highly dependent on the ZrMgMo 3 O 12 content. Under identical preparation conditions, an increase in ZrMgMo 3 O 12 content allows for adjusting the Vickers hardness from 163 to 280 HV and the compressive yield strength from 330 to 702 MPa. Additionally, the 5 % and 10 % ZrMgMo 3 O 12 composites exhibited 23 % and 8 % compressive strains, respectively. The Orowan strengthening effect of the ZrMgMo 3 O 12 particles and the thermal mismatch stress at the particle-matrix interface were identified as the key strengthening mechanisms for the composites. However, excessive stress can lead to interfacial debonding and composite failure. Agglomeration of the ZrMgMo 3 O 12 particles was observed beyond 10 % content. At 30 %, the thermal mismatch stress exceeded the binding strength, causing interfacial debonding and composite failure. The controlled mechanical properties of the 0–30 % ZrMgMo 3 O 12p /2024Al composites indicate a promising potential for application in the aerospace and automotive industries and electronics and optical instruments sectors. [ABSTRACT FROM AUTHOR]

The integrity of the 12 V dc power distribution system on a vehicle is essential to guarantee continuous power supply to safety-relevant consumers. Safety-relevant consumers are critical loads, for example, electric power steering, braking systems with functionalities like Anti-Lock Braking or Electronic Stability Control, and autonomous drive systems. To prevent insufficient power supply for safety-relevant consumers due to an increased wiring harness resistance, a novel diagnostic approach is developed to determine the condition of the power distribution, especially the electrical resistance. The influence of measurement errors and bus commutation on the estimation is investigated by using a simulation. By using the diagnostic, a resistance determination in the milliohm range with a standard deviation of σ = 0.3 m Ω can be achieved under realistic conditions. This ensures that failures in the wiring harness can be identified, avoiding cascading effects and minimizing recalls. Compared to the state of the art, redundancies, costs, and weight can be saved with the proposed diagnostic system based on electrical resistance estimation. [ABSTRACT FROM AUTHOR]

Due to its superior reliability and performance, thick film technology is extensively employed in various applications, including automotive electronics, consumer electronics, communication engineering, and aerospace. However, a challenge arises from the mutual diffusion during the electronic paste production process, which leads to a decline in insulation performance and hinders the production of three-dimensional equipment. Inspired by the principles of low-temperature co-fired ceramic technology, a multi-layered ceramic structure has been successfully bonded using thick film technology by introducing a borosilicate glass-ceramics layer. To further enhance the properties of this multi-layered ceramic structure, approximately 8 wt% SiO 2 was incorporated into the borosilicate glass-ceramics. This addition effectively inhibits silver diffusion and reduces the diffusion depth within the glass-ceramic film. The key mechanisms behind this improvement are the increased activation energy for crystallization, resulting in a slower crystallization rate due to the addition of SiO 2. Moreover, the multi-layered ceramic with a sandwich structure exhibits remarkable properties. Notably, the dielectric strength of this system has been significantly enhanced to 13.9 kV/mm, accompanied by a high adhesion strength of 790 N. These enhanced properties of the optimized system indicate promising characteristics for multi-layer circuit applications. [ABSTRACT FROM AUTHOR]

Structural adhesives that do not require heating are in high demand in the automotive and electronics industries. However, it remains a challenge to develop robust adhesives that rapidly achieve super adhesion near ambient temperature. Herein, a room‐temperature curable, fast‐bonding, and super strong epoxy‐based structural adhesive was designed from the perspective of cross‐scale structure, which lies in threefold pivotal aspects: (i) high branching topology of glycerol carbonate‐capped polyurethane (PUGC) increases the kinetics of the ring‐opening reaction, contributing to fast crosslinking and the formation of abundant urethane and hydroxyl moieties; (ii) asynchronous crosslinking of epoxy and PUGC synergistically induces phase separation of PUGC within the epoxy resin and the resulting PUGC domains surrounded by interpenetrated shell serves to efficiently toughen the matrix; (iii) abundant dynamic hydrogen bonds including urethane and hydroxyl moieties, along with the elastomeric PUGC domains, dissipate energy of shearing force. As a result, the adhesive strength rapidly grows to 16 MPa within 4 hours, leveling off to 21 MPa after 7 hours, substantially outperforming commercial room‐temperature curable epoxy adhesives. The results of this study could advance the field of high‐performance adhesives and provide valuable insights into designing materials for efficient curing at room temperature. [ABSTRACT FROM AUTHOR]

Technological advancements necessitate efficient electronic heat management, driving the need for effective cooling solutions. This study investigates the application of MXene-based nanofluids across varying concentrations in microchannel heat sinks to enhance electronic cooling performance. Utilizing numerical simulations, we analyze nanofluid concentrations, flow dynamics, and performance evaluation criteria (PEC) using an Eulerian model to characterize the inhomogeneous flow properties. Concentrations ranging from 0.01 to 0.04 vol% are incrementally examined, with validation against experimental data to ensure accuracy. Key findings reveal that at a Reynolds number (Re) of 300, a 0.04 vol% nanofluid fraction yields a 20.1% reduction in thermal resistance compared to pure water. Moreover, at Re 1000, the heat transfer coefficient improves by 29.4% compared to the 0.04 vol% concentration. These results underscore the potential of MXene nanoflakes as adequate heat sink working fluids for electronics cooling. Applications of this research extend to various electronic devices and systems requiring efficient cooling mechanisms. By leveraging MXene nanofluids, manufacturers can enhance thermal management in microelectronic components, such as integrated circuits, LEDs, and power electronics. Additionally, this study's insights can inform the design and optimization of cooling systems in high-performance computing, automotive electronics, and aerospace applications, where heat dissipation is critical for maintaining device reliability and performance. [ABSTRACT FROM AUTHOR]

To respond to the ever-increasing requirements of automotive electronics, universities need to adapt and play an active role in creating a new research environment and provide proper education to the young generation, which will face challenging tasks in this rapidly developed field. Vehicular technology education is crucial for the next generation of automotive electronics developers and engineers. Several education models, such as problem- and project-based learning (PPBL), academia–academia collaboration, and academia–industry collaboration, are highlighted as successful examples. [ABSTRACT FROM AUTHOR]

Network-based architectures provide accessibility to various hardware elements and information. The Vehicle to Vehicle (V2V) protocol is a Wi-Fi-based communication that potentially exposes the system to a variety of vulnerabilities. Automotive electronics is a rapidly evolving field that combines numerous machine learning algorithms, dependable communication protocols, and precise image processing techniques to create a user-friendly and self-driving autonomous car. A generic network communication vulnerability assessment method is used to undertake a navigational attack against connected vehicles using GPS falsification. This study emphasizes the security risks of using Wi-Fi for V2V (vehicle 2 vehicle) communication without suitable access control measures in place. The tool used for establishing V2V Communication is based on Kali Linux. The breakdown of vulnerabilities within each layer, such as eavesdropping, spoofing, and Malevolent intermediary strike, highlights the diverse range of potential threats vehicles might face. The focus on the communication layer, both within the vehicle and with external infrastructure (V2X communication), aligns with the current trend of connectivity in automotive technology. Providing a state-of-the-art review of attacks and suggesting countermeasures demonstrates a proactive approach to mitigating potential risks. It's essential not only to identify vulnerabilities but also to propose effective solutions to safeguard vehicular communications and, ultimately, the control layer responsible for critical vehicle functions. [ABSTRACT FROM AUTHOR]

Purpose: In this paper, we investigate the coevolution of the supply network and procurement strategies in the context of semiconductors and electronics for the automotive industry over 3 decades. We aim to explain how procurement strategy interrelates with changes in supply network structure and what the implications of a hub-centric structure network structure are for procurement in supply. Design/methodology/approach: We collected in-depth primary and secondary data that stretched back to 1996 from a leading automotive European original equipment manufacturer (OEM) and its network. Using social network analysis (SNA), we identified OEMs' procurement focus and mapped the evolution of the supply network, the links in the network, and the environmental forces impacting the strategies and the network. Findings: Our findings describe the supply network for semiconductor and electronic components to the automotive industry. The findings suggest that a focus on cost can lead to a Tier 1-centric network structure with many tiers that can fail to assure supply or capture innovation when the external environment is marked by high uncertainty. In such situations, increasing complexity by creating more links in the network can improve transparency and contribute to supply assurance and innovation. Practical implications: The findings indicate that managers should consider the role of the supply network in selecting their strategy to attain objectives of cost, innovation, and supply assurance. Originality/value: This paper presents empirical-based insights into the automotive semiconductor and electronic component supply chain (SC), the unexpected implications of hub-centric supply networks, and the use of SNA in the SC in context. [ABSTRACT FROM AUTHOR]

Reductions in automobile weight and carbon dioxide emission are critical for the further development of the automobile industry. Aluminum is a lightweight material that can replace copper in automobile electronic equipment; therefore, laser welding of aluminum and copper is a subject of extensive research. This study investigates the influence of the laser strategy on the laser welding of aluminum and copper while preventing the formation of brittle Al–Cu intermetallic compounds. Aluminum and copper plates with a length of 20 mm and thickness of 0.3 and 1 mm, respectively, are used for the experiment. A continuous-wave laser with a power of 500 W and a spot beam radius of 150 μm is employed to irradiate the aluminum surface at different scan speeds. An electroless-plated nickel layer is used as a buffer between aluminum and copper, and the experimental results show that it can prevent copper surface damage and the formation of Al–Cu compounds during laser welding. In addition, the simulation and experimental results reveal that the residual thermal stress after laser welding can be reduced by heat treatment at different temperatures prior to laser irradiation. [Display omitted] • Al–Cu compound can be avoided during the laser welding process by the electroless nickel layer. • Residual thermal stress can be decreased by controlling the pre-heat treatment temperature for the metal before the laser weld. • Tension strength of welded joint will be decided by the laser scan speed in the welding process. • The contact area of the Al–Cu interface will affect the residual thermal stress after laser welding. [ABSTRACT FROM AUTHOR]

With the escalating integration of Electronic Control Units (ECUs) in contemporary vehicles, the intricacy of vehicle networks is incessantly advancing. Diagnostic communication, as a pivotal facet within these networks, grapples with protracted development cycles and heightened intricacies. In a bid to augment software reusability and portability, this study meticulously scrutinized pertinent research and proffered an electric vehicle fault diagnosis system predicated on the Controller Area Network (CAN) bus, leveraging the diagnostic communication architecture advocated by the AUTOSAR standard. The integration of AUTOSAR seeks to pioneer an innovative software development paradigm for automotive fault diagnosis systems, thereby remedying extant limitations. The communication and diagnostic module of this study were instantiated using AUTOSAR, thereby obviating the necessity for developers to immerse themselves in hardware intricacies and communication implementations. This allows developers to focalize their efforts on crafting software features for fault diagnosis. Empirical results illustrate that the single-core CPU utilization rate of the proposed method in this article stands at 40.68%, with a fault detection time of 0.0217. The success rate of fault detection is 98.70%, indicating an increase of 12.97% and 8.98% when compared to the CAN bus and structural analysis methods, respectively. Testing indicators are significantly mitigated, yielding more precise fault detection outcomes. The exploration of this avant-garde software development methodology in automotive electronic products markedly amplifies the efficiency of automotive troubleshooting system software, underscoring its potential for academic contribution and application in real-world scenarios. [ABSTRACT FROM AUTHOR]

The reliability and durability of integrated circuits (ICs), present in almost every electronic system, from consumer electronics to the automotive or aerospace industries, have been and will continue to be critical concerns for IC chip makers, especially in scaled nanometer technologies. In this context, ICs are expected to deliver optimal performance and reliability throughout their projected lifetime. However, real-time reliability assessment and remaining lifetime projections during in-field IC operation remain unknown due to the absence of trustworthy on-chip reliability monitors. The integration of such on-chip monitors has recently gained significant importance because they can provide real-time IC reliability extraction by exploiting the fundamental physics of two of the major reliability degradation phenomena: bias temperature instability (BTI) and hot carrier degradation (HCD). In this work, we present an extensive study of ring oscillator (RO)-based degradation and annealing monitors designed on our latest 28 nm versatile array chip. This test vehicle, along with a dedicated test setup, enabled the reliable statistical characterization of BTI- and HCD-stressed as well as annealed RO monitor circuits. The versatility of the test vehicle presented in this work permits the execution of accelerated degradation tests together with annealing experiments conducted on RO-based reliability monitor circuits. From these experiments, we have constructed precise annealing maps that provide detailed insights into the annealing behavior of our monitors as a function of temperature and time, ultimately revealing the usage history of the IC. [ABSTRACT FROM AUTHOR]

The additive manufacturing (AM) of functional copper (Cu) parts is a major goal for many industries, from aerospace to automotive to electronics, because Cu has a high thermal and electrical conductivity as well as being ~10× cheaper than silver. Previous studies on AM of Cu have concentrated mainly on high-energy manufacturing processes such as Laser Powder Bed Fusion, Electron Beam Melting, and Binder Jetting. These processes all require high-temperature heat treatment in an oxygen-free environment. This paper shows an AM route to multi-layered microparts from novel nanoparticle (NP) Cu feedstocks, performed in an air environment, employing a low-power (<10 W) laser sintering process. Cu NP ink was deposited using two mechanisms, inkjet printing, and bar coating, followed by low-power laser exposure to induce particle consolidation. Initial parts were manufactured to a height of approximately 100 µm, which was achieved by multi-layer printing of 15 (bar-coated) to 300 (inkjetted) layers. There was no evidence of oxidised copper in the sintered material, but they were found to be low-density, porous structures. Nonetheless, electrical resistivity of ~28 × 10−8 Ω m was achieved. Overall, the aim of this study is to offer foundational knowledge for upscaling the process to additively manufacture Cu 3D parts of significant size via sequential nanometal ink deposition and low-power laser processing. [ABSTRACT FROM AUTHOR]

Nanotechnology is a new field of science that produces extremely small structures from organic or inorganic materials. These nanoparticles can be used in many fields: medicine, foods, cosmetics, clothing, constructions, furniture, not only in the making of electronics or in the automotive industry. Because of their special properties nanoparticles, also known as nanomaterials, can revolutionize all fields in which they are used. But the domain in which they can bring the most important benefits for human life is medicine. Nanoparticles can be used in the medicine field in the production of drugs and vaccines, and also in diagnostic and investigative tools, etc. Nanomaterials are used with great success in imaging and in the construction of medical devices. Many European citizens have legitimate concerns about the safe use of nanoparticles in medicines. All these concerns can be put aside only through thoroughly testing all the medicines that contain nanoparticles before they will be put on the market for general use. [ABSTRACT FROM AUTHOR]

Abstract A 1 × 4 magneto‐electric dipole (ME dipole) antenna array for 77 GHz automotive radar is proposed. The ME dipole is fed by a fork‐shaped microstrip line coupling through a dog‐bone slot. To meet the requirements aimed at automotive radar applications, the beamwidths of the proposed antenna are well‐designed. Specially, a method of adding passive elements on both sides of the array is proposed to increase the 3 dB beamwidth from ±34° to ±52° in azimuth. Additionally, in elevation, a 3 dB beamwidth of ±10° is achieved by designing the spacing between array elements. Moreover, based on low‐loss printed circuit board substrates, radiation efficiency of the proposed array can reach approximately 90% at 77 GHz. Furthermore, a 4 × 4 array is established by arranging four 1 × 4 subarrays spacing 1.95 mm (half a free‐space wavelength at 77 GHz) to study the interactions between subarrays for multiple input multiple output scenarios. A 1 × 4 and a 4 × 4 antenna prototypes are fabricated and measured to validate the correctness of this design. The results show that the proposed antenna is an eligible candidate for the medium‐ and short‐range automotive radars.

The integrity of the 12Vdc power distribution system on a vehicle is essential to guarantee continuous power supply to safety-relevant consumers. Safety-relevant consumers are critical loads, for example, electric power steering, braking systems with functionalities like Anti-Lock Braking or Electronic Stability Control, and autonomous drive systems. To prevent insufficient power supply for safety-relevant consumers due to an increased wiring harness resistance, a novel diagnostic approach is developed to determine the condition of the power distribution, especially the electrical resistance. The influence of measurement errors and bus commutation on the estimation is investigated by using a simulation. By using the diagnostic, a resistance determination in the milliohm range with a standard deviation of σ=0.3mΩ can be achieved under realistic conditions. This ensures that failures in the wiring harness can be identified, avoiding cascading effects and minimizing recalls. Compared to the state of the art, redundancies, costs, and weight can be saved with the proposed diagnostic system based on electrical resistance estimation.

Adapting sheets to doubly curved surfaces is a longstanding challenge in various engineering disciplines, from flexible and stretchable electronics to the automotive industry. However, current understanding often focuses on specific scenarios and neglects the diverse range of substrate conditions encountered in nature. This study investigates the pattern formation in confined core‐shell structures by modulating the levels of stiffness and curvature of the substrate. Beginning with the Föppl–von Kármán equation, this theory uncovers how the degree of confinement determines the location of wrinkles within confined sheets. Furthermore, the synchronization of patterns is observed: the formation of dimple or buckyball patterns on curved surfaces simultaneously with hierarchical wrinkles due to boundary constraints. The analytical models elucidate these phenomena, and both macroscopic and microscopic features can be systematically engineered to align with quantitative predictions. This research expands the current understanding of the sheet conformation problem and paves the way for pattern engineering across a range of curved structures. [ABSTRACT FROM AUTHOR]

In the field of ASIC and FPGA, Machine Learning (ML) techniques play a major role and become predominant for accurate results for different applications like big data analysis and automotive electronics, and driverless vehicles which are required speed and power savings. Due to increasing the demand for higher accuracy, low power, low area consumption, and higher throughput for the complexity of the designs in the latest technology, the proposed system is fulfilling these demands in ASIC and FPGA domains, reconfigurable hardware architecture has been proposed it consists of an ML-based Support Vector Machine (SVM), high-speed AHB protocol and Floating point (FP) operations and also the system has the flexibility to communicate with I2C and I2S protocols. In order to increase throughput with minimal latency, the proposed architecture with AHB protocol and AHB to APB bridge is incorporated between the fabric dynamically reconfigurable multi-processor (FDPM) and peripherals along with security algorithms using SHA-256bits and AES. In order to perform ML-based applications, the proposed system is incorporated double-precision floating point (DPFP) arithmetic operations. The overall proposed architecture is developed in Verilog HDL and quality checking using the LINT tool and Clock Domain Crossing (CDC) using Spyglass tool and synthesized using DC compiler for ASIC and Vivado Design Suite 2018.1 for FPGA implementation and verification. The entire design is interfaced with the Zynq processor and SDK tool to verify data transfer between hardware and software. The obtained results show the generated custom accelerator is able to compute any complex ML classifiers for a larger amount of data. The obtained results are compared with existing state-of-art results and found that 18 % improvement in throughput, a 21 % improvement in power consumption savings, and a 34 % reduction in latency. [ABSTRACT FROM AUTHOR]

The lifecycles of vehicular resistor lead in random vibration environment were analyzed in this technical note and the finite element model of a vehicular printed circuit board (PCB) was established. It is with two short edges of PCB fixed for boundary condition to simulate the actual working conditions of the vehicle driving on the road, the constrained modal analysis was simulated and experimental verification were carried out. Both the PCB and the vehicular resistor which soldered on PCB were excited vertically according to Standard GJB150. Based on simulated vibration excitation environment, the power spectral density (PSD) stress value of the resistor lead was calculated. The lifecycles of the resistor lead were calculated theoretically and were verified by following failure-oriented accelerated testing (FOAT). Finally, in order to extend the lifecycles of resistor lead, an improved solution for PCB is put forward. [ABSTRACT FROM AUTHOR]

Automobiles have undergone a transformation during the past two decades due to the merger of the electronics and automotive industries. The combination of autos and electronic sensors has resulted in a new generation of vehicles known as autonomous vehicles (AVs). These AVs have a few hundred thousand sensors, producing an enormous amount of raw data for computation. Data from the vehicular network can be offloaded to existing telecommunication infrastructure to address the problem of processing resources. In order to address vehicular network requirements, large-capacity servers deployed in major telecommunications networks are first used to offload resource-intensive tasks. Mobile Cloud Computing (MCC) is a critical enabling technology for 5 G networks, which has a key feature of offloading to divide application tasks into local and cloud server execution components. This paper proposes a novel Three TierEdge cloud computing (T2 EC2) system which uses an Energy-aware Dynamic Task offloading and collaborative task execution algorithm (EA-DTOCTE) for multilayer vehicular cloud computing networks. The EA-DTOCTE algorithm is included in the decision-making engine in the proposed system, which selects whether to offload the task to the remote environment or implement it locally. EA-DTOCTE focuses on consumption of energy by tasks both locally and remotely since its goal is to efficiently and dynamically split the application into tasks and schedule them on local devices and cloud resources. The proposed T2 EC2 has been evaluated in terms of parameters such as energy consumption, completion time, and throughput. Experimental results indicate that the proposed T2EC2 can save up to 28% of system energy consumption compared with other state-of-art techniques. [ABSTRACT FROM AUTHOR]

Capacitive micromachined ultrasonic transducer (CMUT) has been widely studied due to its excellent resonance characteristics and array integration. This paper presents the first study of the CMUT electrostatic stiffness resonant accelerometer. To improve the sensitivity of the CMUT accelerometer, this paper innovatively proposes the CMUT ring-perforation membrane structure, which effectively improves the acceleration sensitivity by reducing the mechanical stiffness of the elastic membrane. The acceleration sensitivity is 10.9 (Hz/g) in the acceleration range of 0–20 g, which is 100% higher than that of the conventional CMUT structure. This research contributes to the acceleration measurement field of CMUT and can effectively contribute to the breakthrough of vibration acceleration monitoring technology in aerospace, medical equipment, and automotive electronics. [ABSTRACT FROM AUTHOR]

Commercial adhesives typically fall into two categories: structural or pressure sensitive. Structural glues rely on covalent bonds formed during curing and provide high tensile strength whilst pressure‐sensitive adhesives use physical bonding to provide weaker adhesion, but with considerable convenience for the user. Here, a new class of adhesive is presented that is also reversible, with a bond strength intermediate between those of pressure‐sensitive and structural adhesives. Complementary water‐based formulations incorporating oppositely charged polyelectrolytes form electrostatic bonds that may be reversed through immersion in a low or high pH aqueous environment. This electrostatic adhesive has the advantageous property that it exhibits good adhesion to low‐energy surfaces such as polypropylene. Furthermore, it is produced by the emulsion copolymerization of commodity materials, styrene and butyl acrylate, which makes it inexpensive and opens the possibility of industrial production. Bio‐based materials have been also integrated into the formulations to further increase sustainability. Moreover, unlike other water‐based glues, adhesion does not significantly degrade in humid environments. Because such electrostatic adhesives do not require mechanical detachment, they are appropriate for the large‐scale recycling of, e.g., bottle labels or food packaging. The adhesive is also suitable for dismantling components in areas as varied as automotive parts and electronics. [ABSTRACT FROM AUTHOR]

Automotive electronics and related software market is growing significantly and expected to gain high demand of skilled employees in the next decade. The market drivers being the customer preferences, government regulations, technology adoption and recent participants like autonomous and electric vehicle technologies. Hence, industries are showing lot of interest in collaborations with academia for technology innovations and for getting industry ready employees. This paper presents the experiences and outcomes of collaborations with automotive industries in automotive embedded systems courses like, Automotive electronics, AUTOSAR, Multicore core architecture and programming, and Human-Machine-Interface offered to the students of Electronics and Communication Engineering program at KLE Technological University. These courses involve core technical concepts, computing, and design of hardware/ software architecture. The traditional mode of teaching is found to be less effective and hence, innovative pedagogical techniques are used with the help of industries for teaching these courses. The techniques helped to enhance students' ability to solve complex engineering problems and to build higher cognitive learning ability. The collaborative contributions from both industry experts and academic faculty in design and delivery of automotive embedded courses have resulted in building industry specific skills among students which in turn resulted into a greater number of in campus placements and reduction in on job training. [ABSTRACT FROM AUTHOR]

Automated Vehicles are becoming more and more prevalent in the modern world. Although these vehicles are not without drawbacks, they are predicted to have numerous benefits to society and are here to stay. However, as society progresses towards a more computer-controlled and less human-operated vehicle world, U.S. laws have been unable to keep up with these scientific developments. The federal and state governments have yet to achieve uniformity in their automated vehicle laws and regulations. The former has only provided voluntary guidance. For the latter, some states have taken progressive approaches, while others have taken more conservative ones. Taking into consideration that the current and upcoming automated vehicle technologies will create difficulties for claimants to successfully bring claims under the existing state product liability laws, this Note will explore potential solutions and propose a solution to address the current flaws. This Note will examine what the European Union has achieved in this area of law and what solutions other legal scholars have proposed to address the issue. Finally, this Note will propose that the United States enact a unified federal automated vehicle regulation with a private cause of action for automated vehicle product liability. [ABSTRACT FROM AUTHOR]

In recent decades the market share of electrical cars has increased significantly, which has paved the way for the development of automotive electronics. Some of the most important parts of modern electrical vehicles are motor drives, which are used in car training and mechanization. Electrical drives are used in powertrains for traction, in air conditioning systems to cool cars and their parts, in doors for opening/closing as well as window movements, etc. The most popular motor type in electrical vehicles is synchronous motors with permanent magnets, which are compact and provide high torque. However, these motors require the development of control systems for proper operation. This system has to have the capacity to implement several state-of-the-art techniques, which can fully utilize motor potential, increase its efficiency, and decrease battery usage. One of these techniques is field-weakening, which overcomes speed limitations due to a lack of supply voltage and increases the motor's speed operation range. This paper discusses the most popular approaches to field-weakening, including a new method proposed by the author. It considers both the pros and cons of each approach and provides recommendations for their usage. After that, this manuscript demonstrates the experimental results of each field-weakening technique obtained in the same motor drive, compares their performance, and discusses their strengths and weaknesses. Finally, the experimental part demonstrates that the proposed field-weakening approach demonstrates similar dynamics in load transients but provides 10 times less load to the microcontroller. [ABSTRACT FROM AUTHOR]

Operation speed, data retention, thickness variation, and resistance drift are main shortages for conventional Ge2Sb2Te5 based phase change memory (PCM). In this Letter, we propose a type of ultrathin amorphous carbon (a-C)/Sb2Te multilayer nanostructures with semiconductor process compatibility, which has high speed and excellent reliability in terms of data retention (131 °C for 10-year), thickness variation (1.52%), and resistance drift (0.0095). The PCM devices based on [a-C (1 nm)/Sb2Te (7 nm)]5 multilayer nanostructures exhibit a fast operation speed of 5 ns. The SET/RESET resistance ratio remains constant over 105 cycles by more than two orders of magnitude. The excellent performance of a-C/Sb2Te multilayer nanostructures makes it a promising storage medium to expand the applications of PCM, such as automotive electronics. [ABSTRACT FROM AUTHOR]

Polyurethane and polyurea-based adhesives are widely used in various applications, from automotive to electronics and medical applications. The adhesive performance depends strongly on its composition, and developing the formulation–structure–property relationship is crucial to making better products. Here, we investigate the dependence of the linear viscoelastic properties of polyurea nanocomposites, with an IPDI-based polyurea (PUa) matrix and exfoliated graphene nanoplatelet (xGnP) fillers, on the hard-segment weight fraction (HSWF) and the xGnP loading. We characterize the material using scanning electron microscopy (SEM) and dynamic mechanical analysis (DMA). It is found that changing the HSWF leads to a significant variation in the stiffness of the material, from about 10 MPa for 20% HSWF to about 100 MPa for 30% HSWF and about 250 MPa for the 40% HSWF polymer (as measured by the tensile storage modulus at room temperature). The effect of the xGNP loading was significantly more limited and was generally within experimental error, except for the 20% HSWF material, where the xGNP addition led to about an 80% increase in stiffness. To correctly interpret the DMA results, we developed a new physics-based rheological model for the description of the storage and loss moduli. The model is based on the fractional calculus approach and successfully describes the material rheology in a broad range of temperatures (−70 °C–+70 °C) and frequencies (0.1–100 s−1), using only six physically meaningful fitting parameters for each material. The results provide guidance for the development of nanocomposite PUa-based materials. [ABSTRACT FROM AUTHOR]

Copyright of European Journal of Management & Business Economics is the property of Emerald Publishing Limited and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Aluminium can be essential in reducing climate impacts as weight reduction is critical. Rheocasting is getting more and more attention from the electronics and automotive industries. The solid fraction in Rheocasting determines the processing outcome. The RheoMetal process is one of the leading processes with the most significant deviation from equilibrium, making presetting the slurry-making parameters difficult. A deeper analysis of the physics of the solid fraction deviation from equilibrium is made based on literature data using a simplistic mathematical model. The developed model confirms that the process is far from equilibrium and that the growth conditions of the freeze-on layer on the cooling agent used in the process determine the slurry temperature and cause the formation of excess solid fraction. [ABSTRACT FROM AUTHOR]

Copyright of Tunnel Construction / Suidao Jianshe (Zhong-Yingwen Ban) is the property of Tunnel Construction Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

The paper presents a synthesis of the author contributions in developing a new class of DC-DC hybrid converters (HDC) with large voltage conversion ratio. The HDC structures are obtained by introducing commutated inductive and capacitive cells in the classical DC-DC converters. With these topologies, the voltage conversion ratio is larger, at the same duty cycle, compared with the classical converters. The paper presents some of the developed configurations, with unidirectional and bidirectional power flow, and some corresponding applications in renewable energy conversion and automotive industries. [ABSTRACT FROM AUTHOR]

This tutorial paper focuses on the physical origin of thermal droop, i.e., the decrease in the luminescence of light-emitting diodes (LEDs) induced by increasing temperature. III-nitride-based LEDs are becoming a pervasive technology, covering several fields from lighting to displays, from automotive to portable electronics, and from horticulture to sensing. In all these environments, high efficiency is a fundamental requirement, for reducing power consumption and system cost. Over the last decade, a great deal of effort has been put in the analysis of the efficiency droop, the decrease in LED internal quantum efficiency (IQE) induced by high current density. On the other hand, an IQE decrease is observed also for increasing temperature, a phenomenon usually referred to as thermal droop. For commercial LEDs, the IQE decrease related to thermal droop can be comparable to that of efficiency droop: for this reason, understanding thermal droop is a fundamental step for making LEDs capable of operating at high temperature levels. In several fields (including street lighting, automotive, photochemical treatments, projection, entertainment lighting, etc.), compact and high-flux light sources are required: typically, to reduce the size, weight, and cost of the systems, LEDs are mounted in compact arrays, and heat sinks are reduced to a minimum. As a consequence, LEDs can easily reach junction temperatures above 85–100 °C and are rated for junction temperatures up to 150–175 °C (figures from commercially available LED datasheets: Cree XHP70, Osram LUW HWQP, Nichia NVSL219CT, Samsung LH351B, and LedEngin LZP-00CW0R) and this motivates a careful analysis of thermal droop. This paper discusses the possible physical causes of thermal droop. After an introduction on the loss mechanisms in junctions, we will individually focus on the following processes: (i) Shockley–Read–Hall (SRH) recombination and properties of the related defects; (ii) Auger recombination and its temperature dependence, including the discussion of trap-assisted Auger recombination; (iii) impact of carrier transport on the thermal droop, including a discussion on carrier delocalization, escape, and freeze out; (iv) non-SRH defect-related droop mechanisms. In addition, (v) we discuss the processes that contribute to light emission at extremely low current levels and (vi) the thermal droop in deep ultraviolet LEDs, also with reference to the main parasitic emission bands. The results presented within this paper give a tutorial perspective on thermal droop; in addition, they suggest a pathway for the mitigation of this process and for the development of LEDs with stable optical output over a broad temperature range. [ABSTRACT FROM AUTHOR]

Rhodium is one of the scarcest, most valuable, and useful platinum group metals, a strategically important material relied on heavily by automotive and electronics industries. The limited finite natural sources of Rh and exponentially increasing demands on these supplies mean that new sources are being sought to stabilise supplies and prices. Spent nuclear fuel (SNF) contains a significant quantity of Rh, though methods to recover this are purely conceptual at this point, due to the differing chemistry between SNF reprocessing and the methods used to recycle natural Rh. During SNF reprocessing, Rh partitions between aqueous nitric acid streams, where its speciation is complex, and insoluble fission product waste streams. Various techniques have been investigated for Rh recovery during SNF reprocessing for over 50 years, including solvent extraction, ion exchange, precipitation, and electrochemical methods, with tuneable approaches such as impregnated composites and ionic liquids receiving the most attention recently, assisted by more the comprehensive understanding of Rh speciation in nitric acid developed recently. The quantitative recovery of Rh within the SNF reprocessing ecosystem has remained elusive thus far, and as such, this review discusses the recent developments within the field, and strategies that could be applied to maximise the recovery of Rh from SNF. [ABSTRACT FROM AUTHOR]

The increasing number of electrical components and sensors in modern vehicles makes network design more challenging. The development of automotive electronics through multiple communication protocols brings out the importance of a hybrid network that is both optimal and fault-tolerant. In order for a vehicle to communicate with electronic components like engine management systems, stability control units, braking systems, and door functions, a CAN (controller area network) is developed. In order to create a hierarchical vehicle network gateway for quality fortification and cost reduction of vehicles, the CAN and LIN (local interconnect network) are considered. This standardisation will reduce the variety of low-end multiplex solutions currently available for automotive electronics' development costs, production rates, service fees, and logistics costs. The implementation of a gateway in these electronic devices is made possible with the proposed hybrid architecture. This system effectively shows the high-speed and low-speed applications relevant to crucial ECUs in the network by using two distinct CAN and LIN gateways to send sensor data between the ECUs (electronic control units). [ABSTRACT FROM AUTHOR]

Noble metals (NM) such as gold, platinum, palladium, and rhodium are widely applied in the electronics and automotive industries. Thus, the search for cheap and selective sorbents for noble metals is economically justified. Nitrolite does not sorb noble metal ions. A new impregnated sorbent was prepared. The natural sorbent Nitrolite was impregnated with Aliquat 336 using a new warm impregnation method. After the impregnation process, Nitrolite adsorbed platinum(IV), palladium(II), and gold(III) ions from the chloride solutions. The values of the sorption capacity for palladium(II) and platinum(IV) ions were 47.63 mg/g and 51.39 mg/g, respectively, from the 0.1 M HCl model solution. The sorption capacity for gold(III) ions was estimated to be 73.43 mg/g from the 0.1 M HCl model solution. An exhausted catalytic converter was leached, and platinum(IV), palladium(II), and rhodium(III) were transferred to the chloride solution. The impregnated sorbent Nitrolite–Aliquat 336 was used in the investigations of the platinum(IV), palladium(II), and rhodium(III) ions' sorption from a real solution. The impregnated sorbent Nitrolite–Aliquat 336 proved to be suitable for the recovery of platinum(IV) and palladium(II) ions, whereas rhodium ions were not sorbed from the leached solutions. Notably, 1 M thiourea in the 1 M HCl solution desorbed platinum(IV), palladium(II), and gold(III) above 94%. [ABSTRACT FROM AUTHOR]

This research questions the mirroring hypothesis in the context of digital convergence. The mirroring hypothesis suggests that the organization of innovation activities tends to mirror the technical architecture of products. When the architecture is modular, such mirroring optimizes the management of innovation activities. But it can also limit the ability of incumbent firms to adapt to technological discontinuities. Digital convergence is a source of discontinuities that transform the conditions of value creation and capture within industries. It leads to new complementarities that push incumbents to collaborate with firms coming from other industries within emerging ecosystems. How does the mirroring between product architecture and organization evolve in the face of the new challenges of value creation and capture brought by digital convergence? This question is addressed through a qualitative case study of the organization of innovation activities between Renault and its partners in the field of embedded automotive electronics. The results show that the automaker ‘breaks the mirror’ through a strategy of selective mirroring that allows it to collaborate with new complementors and to reconfigure its mechanisms of value creation and capture. [ABSTRACT FROM AUTHOR]

An ultrasensitive single-axis in-plane micro-optical-electro-mechanical-system (MOEMS) accelerometer based on the Talbot effect of dual-layer gratings is proposed. Based on the Talbot effect of gratings, the acceleration can be converted into the variation of diffraction intensity, thus changing the voltage signal of photodetectors. We investigated and optimized the design of the mechanical structure; the resonant frequency of the accelerometer is 1878.9 Hz and the mechanical sensitivity is 0.14 μm/g. And the optical grating parameters have also optimized with a period of 4 μm and a grating interval of 10 μm. The experimental results demonstrated that the in-plane MOEMS accelerometer with an optimal design achieved an acceleration sensitivity of 0.74 V/g (with better than 0.4% nonlinearity), a bias stability of 75 μg and an acceleration resolution of 2.0 mg, suggesting its potential applications in smartphones, automotive electronics, and structural health detection. [ABSTRACT FROM AUTHOR]

Copper-aluminium composites are widely used in the power transmission, telecommunications, aviation, automotive and electronics industries. The review is devoted to the analysis of manufacturing technologies of bimetallic copper-aluminium composites. It is shown that two metallurgical methods for the production of Cu‒Al composite blanks have been used — continuous casting with vertical core filling and continuous casting (VCFC) with horizontal core filling (HCFC). The last of the methods is most suitable for industrialization. The features of phase transformations at the Cu/ Al interface during casting of bimetallic composites, their thermomechanical deformation, and welding are considered. It is shown that the interface between the Al-core and the Cu-shell is a multilayer structure consisting of layers of phases γ1 (Cu9 Al4 ), δ(Cu3 Al2 ), η2 (CuAl), ε2 (Cu3 Al2 +x), θ(CuAl2 ), and eutectic α(Al)/θ(CuAl2 ) layers. For the production of copper-clad aluminium (CCA) wire from bimetallic blanks, methods of rolling, drawing and welding are used. The final goal of the review is to determine the initial data and technical solutions for the development of an effective technology for butt welding of copper-aluminium blanks in the production of CCA composites. 32 Ref., 1 Tabl., 6 Fig. [ABSTRACT FROM AUTHOR]

To cope with the megatrends electrification, automated driving, and connectivity, new functionalities and electric and/or electronic systems must be developed, which require a safe power supply. This leads to increased functional safety requirements for the power supply system, particularly regarding availability. Fault tolerance measures can be implemented to comply with a safety goal (SG) specifying a safety-related availability requirement. To verify an architecture concerning the residual risk of an SG violation, several quantitative target values are provided in ISO 26262. This technical elaboration presents a systematic and holistic approach how to gain benefit in the quantitative evaluation from cyclic safety mechanisms (SMs)– in a fault tolerant item– which have a fault handling time interval (FHTI) longer than the fault tolerant time interval. Modelling cyclic SMs only based on conventional AND-gates is not sufficient. Instead, the fault sequence is differentiated to enable ISO 26262-compliance. Within this paper, an innovative approach including its mathematical background is presented how cyclic SMs can be modelled in a fault tree analysis– with focus on multiple-point faults. The results are verified by a Monte-Carlo-Simulation. Besides the scalability of the approach regarding the number of considered cyclic SMs, the relevant FHTI of each cyclic SM can be considered in a traceable and comprehensible manner.