119 results on '"Baks, C."'
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2. SLAVERY AS A SYSTEM OF PRODUCTION IN TRIBAL SOCIETY
3. A 60GHz packaged switched beam 32nm CMOS TRX with broad spatial coverage, 17.1dBm peak EIRP, 6.1dB NF at < 250mW
4. Design and Experimental Validation of Compact Common Mode Filter Based on EBG Technology
5. Monolithic Silicon Photonics at 25 Gb/s
6. An integrated silicon photonics technology for O-band datacom
7. Slavery as a System of Production in Tribal Society
8. Anthropologica VIII
9. A WDM 4×28Gbps Integrated Silicon Photonic Transmitter driven by 32nm CMOS driver ICs
10. A WDM-Compatible 4 × 32-Gb/s CMOS-Driven Electro-Absorption Modulator Array
11. 30Gbps Optical Link Utilizing Heterogeneously Integrated III-V/Si Photonics and CMOS Circuits
12. 64Gb/s Transmission over 57m MMF using an NRZ Modulated 850nm VCSEL
13. Exploring the limits of high-speed receivers for multimode VCSEL-based optical links
14. A 56.1Gb/s NRZ Modulated 850nm VCSEL-Based Optical Link
15. Electrical interconnect design for testing of high-speed IC transceivers
16. A 55Gb/s directly modulated 850nm VCSEL-based optical link
17. A 25-Gb/s 49-mW CMOS-driven equalized optical link
18. Multicore fiber link demonstrating large bandwidth density for future multimode optical interconnects
19. Transmitter Predistortion for Simultaneous Improvements in Bit Rate, Sensitivity, Jitter, and Power Efficiency in 20 Gb/s CMOS-Driven VCSEL Links
20. A 40-Gb/s, 850-nm, VCSEL-Based Full Optical Link
21. Terabit/sec VCSEL-Based Parallel Optical Module Based on Holey CMOS Transceiver IC
22. Increasing bandwidth density in future optical interconnects
23. Novel multiport probing fixture for high frequency measurements in dense via arrays
24. 225 Gb/s Bi-Directional Integrated Optical PCB Link
25. Transmitter Pre-Distortion for Simultaneous Improvements in Bit-Rate, Sensitivity, Jitter, and Power Efficiency in 20 Gb/s CMOS-driven VCSEL Links
26. Bringing Optics Inside the Box: Recent Progress and Future Trends
27. Multimode transceiver for interfacing to multicore graded-index fiber capable of carrying 120-Gb/s over 100-m lengths
28. 120-Gb/s 100-m transmission in a single multicore multimode fiber containing six cores interfaced with a matching VCSEL array
29. Communication technologies for exascale systems
30. Terabus: Chip-to-chip board-level optical data buses
31. Chip-to-chip board-level optical data buses
32. Terabus: A 160-Gb/s Bidirectional Board-Level Optical Data Bus
33. Determination of transmission line parameters in time- and frequency domain for product related packaging structures
34. 160-Gb/s, 16-Channel Full-Duplex, Single-Chip CMOS Optical Transceiver
35. Terabus: a chip-to-chip parallel optical interconnect
36. Terabus: A Waveguide-Based Parallel Optical Interconnect
37. 120-Gb/s VCSEL-Based Parallel-Optical Interconnect and Custom 120-Gb/s Testing Station
38. Electrical performance of a multiport interposer for measurements of dense via arrays.
39. Novel multiport probing fixture for high frequency measurements in dense via arrays.
40. Terabit/sec-class board-level optical interconnects through polymer waveguides using 24-channel bidirectional transceiver modules.
41. Techniques for de-embedding a high port count connector to PCB via interposer.
42. A low-cost ceramic BGA package for 50 Gb/s multiplexing circuit
43. A Study on crosstalk analysis in aggregative transmission lines with turning vias.
44. Fast full wave analysis of PCB via arrays with model-to-hardware correlation.
45. The viability of 25 Gb/s on-board signalling.
46. 160-Gb/s Bidirectional Parallel Optical Transceiver Module for Board-Level Interconnects Using a Single-Chip CMOS IC.
47. Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology.
48. Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz.
49. Electrical / optical high speed scalability link implementation.
50. End-to-End Multicore Multimode Fiber Optic Link Operating up to 120 Gb/s.
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