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36 results on '"Bandari, Vineeth Kumar"'

4. Efficient Energy Management for Intelligent Microrobotic Swarms: Design and Impact.

Author

Zhu, Minshen, McCaskill, John S., Karnaushenko, Daniil, Bandari, Vineeth Kumar, Gemming, Sibylle, Kanoun, Olfa, Arnold, Marlen Gabriele, and Schmidt, Oliver G.

Subjects
ENERGY management, INTELLIGENT buildings, ENVIRONMENTAL impact analysis, SURGICAL robots, PHOTOVOLTAIC cells, ENERGY development, POWER resources, INTELLIGENT tutoring systems
Abstract

Energy serves as the foundational element for all active functions within microrobots. Harvesting devices, such as photovoltaic cells and coils, play a crucial role in converting diverse forms of energy into electricity, while energy storage devices enable uninterrupted operation and liberate microrobots from dependence on external sources. Despite the evident importance of energy, there exists a significant disconnect between the development of energy devices and their integration into microrobotic systems, hampering the deployment of microrobots across diverse fields from agriculture to microsurgery. Here, for transcending the "material for material's sake" focus on simple generic metrics for material optimization, such as energy density, advocating attention to the higher tier transformation of material metrics that determine device‐level performance and so make a meaningful contribution to microrobotic technology is argued. Appropriate metrics for microrobotic swarms challenge the stereotype that tiny energy supplies are impractical; instead, swarms simplify individual microrobotic functions, reducing single energy supply requirements and utilizing swarm energy distribution and management. In addition to essential evaluations of the environmental and social impacts of intelligent microrobotic swarms for their safe and beneficial implementation, research targeting these higher‐tier metrics is crucial to connecting energy material research and microrobot developments effectively. [ABSTRACT FROM AUTHOR]

Published
2024
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8. Microbatteries with twin-Swiss-rolls redefine performance limits in the sub-square millimeter range

Author

Li, Yang, primary, Zhu, Minshen, additional, Karnaushenko, Dmitriy D., additional, Li, Fei, additional, Qu, Jiang, additional, Wang, Jinhui, additional, Zhang, Panpan, additional, Liu, Lixiang, additional, Ravishankar, Rachappa, additional, Bandari, Vineeth Kumar, additional, Tang, Hongmei, additional, Qu, Zhe, additional, Zhu, Feng, additional, Weng, Qunhong, additional, and Schmidt, Oliver G., additional

Published
2023
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14. Self‐Assembled Flexible and Integratable 3D Microtubular Asymmetric Supercapacitors

Author

Li, Fei, primary, Wang, Jinhui, additional, Liu, Lixiang, additional, Qu, Jiang, additional, Li, Yang, additional, Bandari, Vineeth Kumar, additional, Karnaushenko, Daniil, additional, Becker, Christian, additional, Faghih, Maryam, additional, Kang, Tong, additional, Baunack, Stefan, additional, Zhu, Minshen, additional, Zhu, Feng, additional, and Schmidt, Oliver G., additional

Published
2021
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16. Digital Electrochemistry for On-Chip Heterogeneous Material Integration

Author

Bao, Bin, Rivkin, Boris, Akbar, Farzin, Karnaushenko, Dmitriy D., Bandari, Vineeth Kumar, Teuerle, Laura, Becker, Christian, Baunack, Stefan, Karnaushenko, Daniil, and Schmidt, Oliver G.

Subjects
electrochemical depositions, electrochemical actuators, electrochromic displays, heterogeneous integration, indium-gallium-zinc oxide active matrices
Abstract

Many modern electronic applications rely on functional units arranged in an active-matrix integrated on a single chip. The active-matrix allows numerous identical device pixels to be addressed within a single system. However, next-generation electronics requires heterogeneous integration of dissimilar devices, where sensors, actuators, and display pixels sense and interact with the local environment. Heterogeneous material integration allows the reduction of size, increase of functionality, and enhancement of performance; however, it is challenging since front-end fabrication technologies in microelectronics put extremely high demands on materials, fabrication protocols, and processing environments. To overcome the obstacle in heterogeneous material integration, digital electrochemistry is explored here, which site-selectively carries out electrochemical processes to deposit and address electroactive materials within the pixel array. More specifically, an amorphous indium-gallium-zinc oxide (a-IGZO) thin-film-transistor (TFT) active-matrix is used to address pixels within the matrix and locally control electrochemical reactions for material growth and actuation. The digital electrochemistry procedure is studied in-depth by using polypyrrole (PPy) as a model material. Active-matrix-driven multicolored electrochromic patterns and actuator arrays are fabricated to demonstrate the capabilities of this approach for material integration. The approach can be extended to a broad range of materials and structures, opening up a new path for advanced heterogeneous microsystem integration.

Published
2021
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18. Stamping Fabrication of Flexible Planar Micro‐Supercapacitors Using Porous Graphene Inks

Author

Li, Fei, Qu, Jiang, Li, Yang, Wang, Jinhui, Zhu, Minshen, Liu, Lixiang, Ge, Jin, Duan, Shengkai, Li, Tianming, Bandari, Vineeth Kumar, Huang, Ming, Zhu, Feng, and Schmidt, Oliver G.

Subjects
Full Paper, micro‐supercapacitors, areal energy density, lcsh:Q, Full Papers, graphene inks, lcsh:Science, stamping
Abstract

High performance, flexibility, safety, and robust integration for micro‐supercapacitors (MSCs) are of immense interest for the urgent demand for miniaturized, smart energy‐storage devices. However, repetitive photolithography processes in the fabrication of on‐chip electronic components including various photoresists, masks, and toxic etchants are often not well‐suited for industrial production. Here, a cost‐effective stamping strategy is developed for scalable and rapid preparation of graphene‐based planar MSCs. Combining stamps with desired shapes and highly conductive graphene inks, flexible MSCs with controlled structures are prepared on arbitrary substrates without any metal current collectors, additives, and polymer binders. The interdigitated MSC exhibits high areal capacitance up to 21.7 mF cm−2 at a current of 0.5 mA and a high power density of 6 mW cm−2 at an energy density of 5 µWh cm−2. Moreover, the MSCs show outstanding cycling performance and remarkable flexibility over 10 000 charge–discharge cycles and 300 bending cycles. In addition, the capacitance and output voltage of the MSCs are easily adjustable through interconnection with well‐defined arrangements. The efficient, rapid manufacturing of the graphene‐based interdigital MSCs with outstanding flexibility, shape diversity, and high areal capacitance shows great potential in wearable and portable electronics., Highly flexible micro‐supercapacitors are manufactured on a large scale by a cost‐effective stamping strategy with highly conductive graphene inks. The efficient production of the flexible micro‐supercapacitor devices with outstanding shape diversity, high areal capacitance, and excellent cycling stability shows great potential for future applications in portable and wearable electronics.

Published
2020

20. Micro‐Supercapacitors: Stamping Fabrication of Flexible Planar Micro‐Supercapacitors Using Porous Graphene Inks (Adv. Sci. 19/2020)

Author

Li, Fei, primary, Qu, Jiang, additional, Li, Yang, additional, Wang, Jinhui, additional, Zhu, Minshen, additional, Liu, Lixiang, additional, Ge, Jin, additional, Duan, Shengkai, additional, Li, Tianming, additional, Bandari, Vineeth Kumar, additional, Huang, Ming, additional, Zhu, Feng, additional, and Schmidt, Oliver G., additional

Published
2020
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24. Self-Assembled Flexible and Integratable 3D Microtubular Asymmetric Supercapacitors

Author

Li, Fei, Wang, Jinhui, Liu, Lixiang, Qu, Jiang, Li, Yang, Bandari, Vineeth Kumar, Karnaushenko, Daniil, Becker, Christian, Faghih, Maryam, Kang, Tong, Baunack, Stefan, Zhu, Minshen, Zhu, Feng, and Schmidt, Oliver G.

Abstract

The rapid development of microelectronics has equally rapidly increased the demand for miniaturized energy storage devices. On-chip microsupercapacitors (MSCs), as promising power candidates, possess great potential to complement or replace electrolytic capacitors and microbatteries in various applications. However, the areal capacities and energy densities of the planar MSCs are commonly limited by the low voltage window, the thin layer of the electrode materials and complex fabrication processes. Here, a new-type three-dimensional (3D) tubular asymmetric MSC with small footprint area, high potential window, ultrahigh areal energy density, and long-term cycling stability is fabricated with shapeable materials and photolithographic technologies, which are compatible with modern microelectronic fabrication procedures widely used in industry. Benefiting from the novel architecture, the 3D asymmetric MSC displays an ultrahigh areal capacitance of 88.6 mF cm−2 and areal energy density of 28.69 mW h cm−2, superior to most reported interdigitated MSCs. Furthermore, the 3D tubular MSCs demonstrate remarkable cycling stability and the capacitance retention is up to 91.8% over 12 000 cycles. It is believed that the efficient fabrication methodology can be used to construct various integratable microscale tubular energy storage devices with small footprint area and high performance for miniaturized electronics.

Published
2019
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25. Microbatteries with twin-Swiss-rolls redefine performance limits in the sub-square millimeter rangeElectronic supplementary information (ESI) available. See DOI: https://doi.org/10.1039/d2nh00472k

Author

Li, Yang, Zhu, Minshen, Karnaushenko, Dmitriy D., Li, Fei, Qu, Jiang, Wang, Jinhui, Zhang, Panpan, Liu, Lixiang, Ravishankar, Rachappa, Bandari, Vineeth Kumar, Tang, Hongmei, Qu, Zhe, Zhu, Feng, Weng, Qunhong, and Schmidt, Oliver G.

Abstract

To maintain the downscaling of microelectronic devices with footprints less than one square millimeter, next-generation microbatteries should occupy the same area and deliver adequate energy for running a new generation of multi-functional microautonomous systems. However, the current microbattery technology fails in accomplishing this task because the micrometer-sized electrodes are not compatible with on-chip integration protocols and technologies. To tackle this critical challenge, an on-chip Swiss-roll microelectrode architecture is employed that exploits the self-assembly of thin films into ultra-compact device architectures. A twin-Swiss-roll microelectrode on a chip occupies a footprint of 0.045 mm2and delivers an energy density up to 458 μW h cm−2. After packaging, the footprint of a full cell increases to 0.11 mm2with a high energy density of 181 μW h cm−2. The volumetric energy density excluding the chip thickness is 16.3 mW h cm−3. These results open opportunities for deploying microbatteries as energy and power sources to drive smart dust microelectronics and microautonomous systems.

Published
2022
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27. Microscale Organic Transistors: Fully Integrated Microscale Quasi‐2D Crystalline Molecular Field‐Effect Transistors (Adv. Funct. Mater. 36/2019)

Author

Bandari, Vineeth Kumar, primary, Gu, Yue, additional, Shi, Subao, additional, Nan, Yang, additional, He, Keqiang, additional, Li, Yang, additional, Bandari, Nooshin, additional, Moradi, Somayeh, additional, Tian, Hongkun, additional, Zhu, Feng, additional, Geng, Yanhou, additional, Yan, Donghang, additional, and Schmidt, Oliver G., additional

Published
2019
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28. Self‐Assembled Flexible and Integratable 3D Microtubular Asymmetric Supercapacitors

Author

Li, Fei, primary, Wang, Jinhui, additional, Liu, Lixiang, additional, Qu, Jiang, additional, Li, Yang, additional, Bandari, Vineeth Kumar, additional, Karnaushenko, Daniil, additional, Becker, Christian, additional, Faghih, Maryam, additional, Kang, Tong, additional, Baunack, Stefan, additional, Zhu, Minshen, additional, Zhu, Feng, additional, and Schmidt, Oliver G., additional

Published
2019
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29. Self-Assembly of Integrated Tubular Microsupercapacitors with Improved Electrochemical Performance and Self-Protective Function

Author

Wang, Jinhui, primary, Bandari, Vineeth Kumar, additional, Karnaushenko, Daniil, additional, Li, Yang, additional, Li, Fei, additional, Zhang, Panpan, additional, Baunack, Stefan, additional, Karnaushenko, Dmitriy D., additional, Becker, Christian, additional, Faghih, Maryam, additional, Kang, Tong, additional, Duan, Shengkai, additional, Zhu, Minshen, additional, Zhuang, Xiaodong, additional, Zhu, Feng, additional, Feng, Xinliang, additional, and Schmidt, Oliver G., additional

Published
2019
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33. Fully Integrated Organic Nanocrystal Diode as High Performance Room Temperature NO2Sensor

Author

Jalil, Abdur Rehman, primary, Chang, Hao, additional, Bandari, Vineeth Kumar, additional, Robaschik, Peter, additional, Zhang, Jian, additional, Siles, Pablo F., additional, Li, Guodong, additional, Bürger, Danilo, additional, Grimm, Daniel, additional, Liu, Xingyuan, additional, Salvan, Georgeta, additional, Zahn, Dietrich R. T., additional, Zhu, Feng, additional, Wang, Haibo, additional, Yan, Donghang, additional, and Schmidt, Oliver G., additional

Published
2016
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36. Hybrid semiconductor/metal nanomembrane superlattices for thermoelectric application.

Author

Li, Guodong, Grimm, Daniel, Engemaier, Vivienne, Lösch, Sören, Manga, Karthikeyan, Bandari, Vineeth Kumar, Zhu, Feng, and Schmidt, Oliver G.

Subjects
SEMICONDUCTOR doping, SUPERLATTICES, THERMOELECTRIC materials, INTERFACES (Physical sciences), THERMAL conductivity, ELECTRIC conductivity
Abstract

Multilayer systems consisting of periodic hybrid interfaces show promising applications in thermoelectric design in terms of unique phonon blocking and electron conducting features. Universal techniques combining crystalline semiconductors with various categories of metals, oxides, molecules, and polymers have been rarely reported. In this paper, we first briefly review a novel rolled-up and compressing technique based on a strain engineered In0.2Ga0.8As/GaAs semiconducting nanomembrane. Then, the controllable rolling and compressing of a nanomembrane, focused ion beam cutting and the following device fabrication steps are demonstrated for the system of a hybrid In0.2Ga0.8As/GaAs/Cr/Au superlattice. Apart from a considerable reduction of thermal conductivity in a similar system reported by part of us very recently, here our efforts are focused on characterizing the cross-plane electrical conductance of the hybrid superlattice. High electrical conductance of four separated devices show very tight electrical bonding across the hybrid interfaces. [ABSTRACT FROM AUTHOR]

Published
2016
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