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5 results on '"Bent sensors"'

1. ALICE silicon tracker upgrades for LHC Run 4 and beyond.

Author

Aglietta, Luca

Subjects
*SOLID state detectors, *VERTEX detectors, *DETECTORS, *HADRONS, *PIXELS
Abstract

During the Long Shutdown 3 of the LHC (2026–2028) the ALICE experiment foresees an upgrade of the inner barrel of its Inner Tracking System: the ITS3. This new vertex detector is based on Monolithic Active Pixel Sensors produced in a commercial 65 nm CMOS technology. Each half-layer is realized with a single stitched sensor of 26 cm long and less than 50 µm thick, bent to form a half-cylinder, and held in place with carbon foam supports. The detector is air cooled allowing for an extremely low material budget of 0.09 X/X˙0 per layer. With respect to the current ALICE vertex detector, ITS3 will improve the pointing resolution by 50% and the tracking efficiency by 30% for hadrons of low transverse momentum. Parallelly, ALICE is designing a next generation heavy-ion experiment for LHC Run 5 and 6 (beyond 2035). Its tracking system will be based on a vertex detector, integrated in a retractable structure inside the beam pipe to achieve the best possible pointing resolution, and a large-area outer tracker, surrounding the vertex detector and covering the pseudorapidity range − 4 < η < 4. Both systems will be based on the same MAPS technology developed for ITS3 and will have to satisfy stringent requirements: the innermost vertex detector layer, placed at 5 mm from the interaction point, must withstand an integrated radiation load of 9 × 1 0 15 1 MeV n˙eq/cm2 NIEL and 2.88 MGy TID; the outer tracker, extending from the beam pipe to a maximum radius of about 80 cm, covers almost 60 m2 of area. This proceeding will cover both the ITS3 upgrade and the projects for ALICE3 silicon tracker, highlighting their requirements, sensor specifications, mechanics and integration. It will showcase the results achieved during the ITS3 R&D and outline the challenges expected for the implementation of the ALICE 3 tracking system. [ABSTRACT FROM AUTHOR]

Published
2024
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2. ALICE ITS3: A truly cylindrical vertex detector based on bent, wafer-scale stitched CMOS sensors.

Author

Liu, Jian

Subjects
*VERTEX detectors, *SILICON detectors, *COMPLEMENTARY metal oxide semiconductors, *DETECTORS, *CARBON foams, *PARTICLE detectors, *SYSTEM integration
Abstract

The new inner tracking system (ITS2) of the ALICE experiment at the LHC, upgraded during the LHC Long Shutdown 2 (2019–2021) with CMOS monolithic active pixel sensors (ALPIDE), is currently taking data and demonstrating excellent performance in the LHC Run 3. A replacement of the three innermost layers of the ITS2, called ITS3, is foreseen during the LHC Long Shutdown 3 (2026–2028) to further improve its tracking precision and efficiency, particularly at very low transverse momentum down to p T = 0.1 GeV/ c. The ITS3 is a cylindrically bent silicon vertex detector based on stitched wafer-scale monolithic active pixel sensors with 65 nm CMOS technology. The large stitched sensors are 26.6 cm in length and can be thinned down to below 50 μ m, where the sensors are flexible to be bent to form truly cylindrical detector half-barrels. An extremely low material budget of 0.05% X/X 0 per layer can be achieved in combination with air-cooling and lightweight carbon foam spacers as support structures. In this article, an overview of the ALICE ITS3 and the R&D achievements including detector concept, sensor design and technology qualification, sensor bending, detector mechanics and cooling, and system integration will be given. [ABSTRACT FROM AUTHOR]

Published
2024
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3. Developments of stitched monolithic pixel sensors towards the ALICE ITS3.

Author

Aglieri Rinella, G.

Subjects
*FLEXIBLE printed circuits, *CARBON foams, *DETECTORS, *DETECTOR circuits, *AIR flow
Abstract

The ALICE collaboration is pursuing the development of a novel and considerably improved vertexing detector called ITS3, to replace the three innermost layers of the Inner Tracker System during the LHC Long Shutdown 3. The primary goals are to reduce the material budget to the unprecedented value of 0.05% X 0 per layer, and to place the first layer at a radial distance of 18 mm from the interaction point. These features will boost the impact parameter resolution by a factor two over all momenta and drastically enhance the tracking efficiency at low transverse momentum. The new detector will consist of true cylindrical layers. Each half-cylinder is based on curved wafer-scale monolithic pixel sensors. The bending radii are 18, 24 and 30 mm, and the length of the sensors in the beam direction is 27 cm. The sensors will be produced using a commercial 65 nm CMOS Imaging technology and a recent technique called stitching. This allows to manufacture chips reaching the dimensions of 27 cm × 9 cm on silicon wafers of 300 mm diameter. The sensors will be thinned down to 50 µm or below. The ITS3 concept foresees cooling by air flow, ultra-light carbon foam support elements and no flexible printed circuits in the active area. This demands a power density limit of 20 mW/cm2 for the sensor, and the need to distribute supply and transfer data over the entire sensors towards circuits located at the short edges of the chip. This contribution summarises the status of the microelectronic developments and presents selected results from the characterisation of the first prototype chips. Furthermore, it describes the ongoing efforts on the design of a first wafer-scale stitched sensor prototype, the MOSS (Monolithic Stitched Sensor) chip. [ABSTRACT FROM AUTHOR]

Published
2023
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4. First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors

Author

Rinella, G. Aglieri, Agnello, M., Bagno, Alessandro, Agnese, F., Akram, R. S., Alme, J., Anderssen, E., Andreou, D., Antinori, F., Apadula, N., Atkinson, P., Baccomi, R., Badala, A., Balbino, A., Bartels, C., Barthel, R., Baruffaldi, F., Belikov, I, Beole, S., Becht, P., Bhatti, A., Bhopal, M., Bianchi, N., Blidaru, M. B., Boca, G., Bok, J., Bonomi, G., Bonora, M., Borri, M., Borshchov, V, Botta, E., Bruno, G. E., Buckland, M., Bufalino, S., Cai, M., Camerini, P., Cariola, P., Catalano, F., Sanchez, C. Ceballos, Chakaberia, I, Chartier, M., Colamaria, F., Colella, D., Collu, A., Concas, M., Contin, G., Costanza, S., Cui, P., Dainese, A., Dainton, J. B., De Cilladi, L., De Martin, C., De Robertis, G., Deng, W., Di Mauro, A., Ding, Y., Durkac, M., Elia, D., Ersdal, M. R., Faggin, M., Fan, F., Fantoni, A., Fecchio, P., Feliciello, A., Feofilov, G., Ferk, A., Ferencei, J., Fiorenza, G., Flores, A. N., Fragiacomo, E., Gajanana, D., Gal, A., Gao, C., Gargiulo, C., Gianotti, P., Giubilato, P., Grant, A., Greiner, L., Grelli, A., Groettvik, O. S., Grosa, F., C. Guo, Hu, Hannigan, R., Hasenbichler, J. A., Helstrup, H., Hillemanns, H., Hills, C., Hindley, P., Hippolyte, B., Hofman, B., Hong, G. H., Huang, G., Iddon, J. P., Ilyas, H., Imhoff, M. A., Isakov, A., Jadlovska, A., Jadlovska, S., Jadlovsky, J., Jaelani, S., Johnson, T., Junique, A., Kalinak, P., Kalweit, A., Keil, M., Khabanova, Z., Khan, H., Kim, B., Kim, C., Kim, J., Kim, T., Klein, J., Kluge, A., Kobdaj, C., Kotliarov, A., Kralik, I, Krizek, F., Kugathasan, T., Kuhn, C., Kuijer, P. G., Kushpil, S., Kweon, M. J., Kwon, J. Y., Kwon, Y., La Rocca, P., Lakrathok, A., Langoy, R., Larionov, P., Laudi, E., Lazareva, T., Lea, R., Lemmon, R. C., X. L., Li, Lien, J., Lim, B., Lim, S. H., Lindsay, S., Liu, A., Liu, J., Lunardon, M., Luparello, G., Lupi, M., Mager, M., Maire, A., Malik, Q. W., Mandaglio, G., Manzari, V, Mao, Y., Margagliotti, G., V, Markert, C., Marras, D., Martinengo, P., Masciocchi, S., Masera, M., Masoni, A., Mastroserio, A., Matuoka, P. F. T., Mazza, G., Mazzaschi, F., Mazzoni, M. A., Morel, F., Muccifora, V, Mulliri, A., Musa, L., Nesbo, S., Nesterov, D., Norman, J., Park, J., Patra, R. N., Pastore, C., Pei, H., Peng, X., Piano, S., Pinto, C., Pisano, S., Politano, S., Prakasa, E., Prino, F., Protsenko, M., Puccio, M., Rachevski, A., Ramello, L., Rami, F., Ravasenga, I, Rehman, A., Reidt, F., Riggi, F., Roed, K., Rohrich, D., Ronchetti, F., Rosano, A., Rossewij, M. J., Rossi, A., Rui, R., Russo, R., Sadikin, R., Sarritzu, V, Schambach, J., Senyukov, S., Seo, J. J., Shahoyan, R., Shaukat, S., Siddhanta, S., Sitta, M., Snellings, R. J. M., Snoeys, W., Songmoolnak, A., Sonneveld, J., Soramel, F., Suljic, M., Sumowidagdo, S., Sun, D., Sun, X., Tambave, G. J., Tersimonov, G., Tkacik, M., Toppi, M., Trifiro, A., Trogolo, S., Trubnikov, V, Turrisi, R., Tveter, T. S., Tymchuck, I, Ullaland, K., Urioni, M., Usai, G. L., Valle, N., Vandoremalen, L. V. R., Vanat, T., Van Hoorne, J. W., Varga-Kofarago, M., Velure, A., Wang, D., Wang, Y., Wikne, J., Wright, J. R., Xu, R., Yang, P., Yin, Z., Yoo, I-K, Yoon, J. H., Yuan, S., Zaccolo, V, Zhang, E., Zhang, X., Zherebchevskii, V, Zhou, D., Zhu, J., Zhu, Y., Zinovjev, G., Zurlo, N., Aglieri Rinella, G., Agnello, M., Alessandro, B., Agnese, F., Akram, R. S., Alme, J., Anderssen, E., Andreou, D., Antinori, F., Apadula, N., Atkinson, P., Baccomi, R., Badalà, A., Balbino, A., Bartels, C., Barthel, R., Baruffaldi, F., Belikov, I., Beole, S., Becht, P., Bhatti, A., Bhopal, M., Bianchi, N., Blidaru, M. B., Boca, G., Bok, J., Bonomi, G., Borri, M. Bonora M., Borshchov, V., Botta, E., Bruno, G. E., Buckland, M., Bufalino, S., Cai, M., Camerini, P., Cariola, P., Catalano, F., Ceballos Sanchez, C., Chakaberia, I., Chartier, M., Colamaria, F., Colella, D., Collu, A., Concas, M., Contin, G., Costanza, S., Cui, P., Dainese, A., Dainton, J. B., De Cilladi, L., De Martin, C., De Robertis, G., Deng, W., Di Mauro, A., Ding, Y., Durkac, M., Elia, D., Ersdal, M. R., Faggin, M., Fan, F., Fantoni, A., Fecchio, P., Feliciello, A., Feofilov, G., Ferk, A., Ferencei, J., Fiorenza, G., Flores, A. N., Fragiacomo, E., Gajanana, D., Gal, A., Gao, C., Gargiulo, C., Gianotti, P., Giubilato, P., Grant, A., Greiner, L., Grelli, A., Groettvik, O. S., Grosa, F., Guo Hu, C., Hannigan, R., Hasenbichler, J. A., Helstrup, H., Hillemanns, H., Hills, C., Hindley, P., Hippolyte, B., Hofman, B., Hong, G. H., Huang, G., Iddon, J. P., Ilyas, H., Imhoff, M. A., Isakov, A., Jadlovska, A., Jadlovska, S., Jadlovsky, J., Jaelani, S., Johnson, T., Junique, A., Kalinak, P., Kalweit, A., Keil, M., Khabanova, Z., Khan, H., Kim, B., Kim, C., Kim, J., Kim, T., Klein, J., Kluge, A., Kobdaj, C., Kotliarov, A., Králik, I., Krizek, F., Kugathasan, T., Kuhn, C., Kuijer, P. G., Kushpil, S., Kweon, M. J., Kwon, J. Y., Kwon, Y., La Rocca, P., Lakrathok, A., Langoy, R., Larionov, P., Laudi, E., Lazareva, T., Lea, R., Lemmon, R. C., Li, X. L., Lien, J., Lim, B., Lim, S. H., Lindsay, S., Liu, A., Liu, J., Lunardon, M., Luparello, G., Lupi, M., Mager, M., Maire, A., Malik, Q. W., Mandaglio, G., Manzari, V., Mao, Y., Margagliotti, G. V., Markert, C., Marras, D., Martinengo, P., Masciocchi, S., Masera, M., Masoni, A., Mastroserio, A., Matuoka, P. F. T., Mazza, G., Mazzaschi, F., Mazzoni, M. A., Morel, F, Muccifora, V., Mulliri, A., Musa, L., Nesbo, S. V., Nesterov, D., Norman, J., Park, J., Patra, R. N., Pastore, C., Pei, H., Peng, X., Piano, S., Pinto, C., Pisano, S., Politano, S., Prakasa, E., Prino, F., Protsenko, M., Puccio, M., Rachevski, A., Ramello, L., Rami, F., Ravasenga, I., Rehman, A., Reidt, F., Riggi, F., Røed, K., Röhrich, D., Ronchetti, F., Rosano, A., Rossewij, M. J., Rossi, A., Rui, R., Russo, R., Sadikin, R., Sarritzu, V., Schambach, J., Senyukov, S., Seo, J. J., Shahoyan, R., Shaukat, S., Siddhanta, S., Sitta, M., Snellings, R. J. M., Snoeys, W., Songmoolnak, A., Sonneveld, J., Soramel, F., Suljic, M., Sumowidagdo, S., Sun, D., Sun, X., Tambave, G. J., Tersimonov, G., Tkacik, M., Toppi, M., Trifiró, A., Trogolo, S., Trubnikov, V., Turrisi, R., Tveter, T. S., Tymchuck, I., Ullaland, K., Urioni, M., Usai, G. L., Valle, N., van Doremalen, L. V. R., Vanat, T., Van Hoorne, J. W., Varga-Kofarago, M., Velure, A., Wang, D., Wang, Y., Wikne, J., Wright, J. R., Xu, R., Yang, P., Yin, Z., Yoo, I. -K., Yoon, J. H., Yuan, S., Zaccolo, V., Zhang, E., Zhang, X., Zherebchevskii, V., Zhou, D., Zhu, J. Zhu Y., Zinovjev, G., Zurlo, N., Institut Pluridisciplinaire Hubert Curien (IPHC), Institut National de Physique Nucléaire et de Physique des Particules du CNRS (IN2P3)-Université de Strasbourg (UNISTRA)-Centre National de la Recherche Scientifique (CNRS), ALICE ITS project, and Nuclear Physics Group, STFC Daresbury Laboratory, Daresbury, United Kingdom

Subjects
Nuclear and High Energy Physics, Physics - Instrumentation and Detectors, Bent, Bent sensors, Monolithic Active Pixel Sensors (MAPS), Solid state detectors, vertex detector, detector: geometry, FOS: Physical sciences, Instrumentation and Detectors (physics.ins-det), fabrication, sensors, semiconductor detector: pixel, efficiency, Bent sensor, mechanical engineering, electron: irradiation, [PHYS.PHYS.PHYS-INS-DET]Physics [physics]/Physics [physics]/Instrumentation and Detectors [physics.ins-det], Detectors and Experimental Techniques, Instrumentation, physics.ins-det, performance
Abstract

A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$\mu$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$\mu$m, they can be successfully bent to radii of about 2cm without any signs of mechanical or electrical damage. During a subsequent characterisation using a 5.4 GeV electron beam, it was further confirmed that they preserve their full electrical functionality as well as particle detection performance. In this article, the bending procedure and the setup used for characterisation are detailed. Furthermore, the analysis of the beam test, including the measurement of the detection efficiency as a function of beam position and local inclination angle, is discussed. The results show that the sensors maintain their excellent performance after bending to radii of 2cm, with detection efficiencies above 99.9% at typical operating conditions, paving the way towards a new class of detectors with unprecedented low material budget and ideal geometrical properties. A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20–40 μm. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5cm×3cm ALPIDE chips. Already with their thickness of 50µm, they can be successfully bent to radii of about 2cm without any signs of mechanical or electrical damage. During a subsequent characterisation using a 5.4GeV electron beam, it was further confirmed that they preserve their full electrical functionality as well as particle detection performance. In this article, the bending procedure and the setup used for characterisation are detailed. Furthermore, the analysis of the beam test, including the measurement of the detection efficiency as a function of beam position and local inclination angle, is discussed. The results show that the sensors maintain their excellent performance after bending to radii of 2cm, with detection efficiencies above 99.9% at typical operating conditions, paving the way towards a new class of detectors with unprecedented low material budget and ideal geometrical properties.

Published
2022

5. First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors.

Subjects
*VERTEX detectors, *SOLID state detectors, *DETECTORS, *PIXELS
Abstract

A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20–40 μ m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5 cm × 3 cm ALPIDE chips. Already with their thickness of 50 µm, they can be successfully bent to radii of about 2 cm without any signs of mechanical or electrical damage. During a subsequent characterisation using a 5.4 GeV electron beam, it was further confirmed that they preserve their full electrical functionality as well as particle detection performance. In this article, the bending procedure and the setup used for characterisation are detailed. Furthermore, the analysis of the beam test, including the measurement of the detection efficiency as a function of beam position and local inclination angle, is discussed. The results show that the sensors maintain their excellent performance after bending to radii of 2 cm, with detection efficiencies above 99.9% at typical operating conditions, paving the way towards a new class of detectors with unprecedented low material budget and ideal geometrical properties. [ABSTRACT FROM AUTHOR]

Published
2022
Full Text
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