1. Advanced vacuum wafer drying for thermal laser separation dicing assessment results from european collaborative 'SEAL' project
- Author
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Hans Ulrich Zühlke, Magali Davenet, Matthias Koitzsch, Olivier Le Barillec, Martin Schellenberger, Arnaud Favre, Bertrand Bellet, and Dirk Lewke
- Subjects
0209 industrial biotechnology ,Materials science ,Substrate surface ,Mechanical engineering ,02 engineering and technology ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,Laser ,Seal (mechanical) ,Atomic and Molecular Physics, and Optics ,law.invention ,Vacuum drying ,020901 industrial engineering & automation ,law ,Thermal ,Forensic engineering ,General Materials Science ,Wafer dicing ,Wafer ,European commission ,0210 nano-technology - Abstract
Based on recent progress on laser-based wafer dicing equipment and process, the partners adixen, Fraunhofer IISB and JENOPTIK investigated the use of a vacuum based decontamination process to dry and to decontaminate the substrate surface of the diced wafers from water residuals, which are a side-effect of the TLS (thermal laser separation) approach. The decontamination process was achieved by using an adixen vacuum drying module prototype further to the JENOPTIK TLS dicing process. Within the frame of the European collaborative project SEAL, supported by the European Commission, experimental assessment was conducted by Fraunhofer IISB (research institution) together with JENOPTIK and Adixen.
- Published
- 2013
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