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1. Impact of gate-level clustering on automated system partitioning of 3D-ICs

11. The Challenges and Solutions of Cu/SiCN Wafer-to-Wafer Hybrid Bonding Scaling Down to 400nm Pitch

13. Detection of bonding voids in multi-tier stacks with scanning acoustic microscope

15. Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Jet Impingement.

20. RIE dynamics for extreme wafer thinning applications

31. A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

35. NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips

37. NimbleAI: towards neuromorphic sensing-processing 3D-integrated chips

39. Modeling-Based Improvement of Microscale Liquid Jet Impingement Cooling

40. Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN–SiCN Wafer-to-Wafer Hybrid-Bonding Technologies

45. 700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding

46. NimbleAI: towards neuromorphic sensing-processing 3D-integrated chips

47. Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer Bonding.

49. Interconnect Modeling using a Surface Admittance Operator Derived with the Fokas Method

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