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1. Flux dependence of helium retention in clean W(110): Experimental evidence for He self-trapping

3. Wall conditions in WEST during operations with a new ITER grade, actively cooled divertor

4. Changeover between helium and hydrogen fueled plasmas in JET and WEST

6. Overview of the EUROfusion Tokamak Exploitation programme in support of ITER and DEMO

10. Overview of T and D-T results in JET with ITER-like wall

15. Comparison of ion cyclotron wall conditioning discharges in hydrogen and helium in JET

21. Operating a full tungsten actively cooled tokamak: overview of WEST first phase of operation

25. Corrigendum to “Tritium retention in w plasma-facing materials: Impact of the material structure and helium irradiation” [Nucl. Mater. Energy 2019; 19: 403–410]

34. Peculiar release kinetics of deuterium in tungsten revealed by an in situ laser induced-desorption technique

36. Long discharges in a steady state with D2 and N2 on the actively cooled tungsten upper divertor in WEST.

38. Comment on “Angular distributions of H-induced HD and D2 desorptions from the Si(100) surfaces” [J. Chem. Phys. 124, 054715 (2006)].

39. Cavity ring-down spectroscopy of jet-cooled silane isotopologues in the Si–H stretch overtone region.

40. Publisher's Note: "Laser temperature programmed desorption: A flexible technique to study ion-surface interaction" [Rev. Sci. Instrum. 95, 033004 (2024)].

43. State-resolved reactivity of C[H.sub.4](2[v.sub.3]) on Pt(111) and Ni(111): effects of barrier height and transition state location

45. Plasma–wall interaction studies within the EUROfusion consortium: progress on plasma-facing components development and qualification

46. Retention and release of hydrogen isotopes in tungsten plasma-facing components: the role of grain boundaries and the native oxide layer from a joint experiment-simulation integrated approach

48. Comparison of the rates of joint arthroplasty in patients with severe factor VIII and IX deficiency: an index of different clinical severity of the 2 coagulation disorders

49. The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps

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