1. SELBST verwalten!: Wie Ehrenamtliche unser Gesundheitswesen mitgestalten
137 results on '"Braun, Tanja"'
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2. Unlocking the True Power of Additive Manufacturing for EMI Shielding
3. Unlocking the True Power of Additive Manufacturing for EMI Shielding.
4. List of contributors
5. Fan-out wafer-level packaging as packaging technology for MEMS
6. A novel FOWLP method to integrate delicate MEMS components
7. 3D Freeform Antenna-in-Package Approach for FOWLP
8. A novel hybrid method to integrate delicate MEMS components into a FOWLP
9. History of Embedded and Fan-Out Packaging Technology
10. A Closer Look to Fan-out Panel Level Packaging
11. Positioning Hartlepool and Stockton-on-Tees Borough Councils to be ready for a future Health Determinants Research Collaboration bid: Final Report
12. SiC Fan-out Wafer Level Package for High Power Application
13. Type of vaccine and immunosuppressive therapy but not diagnosis critically influence antibody response after COVID-19 vaccination in patients with rheumatic disease
14. High-Resolution Printing of Redistribution Layers for Fan-Out Wafer-Level Packaging by using Ultra-Precise Micro-deposition Technology
15. In-situ infrared spectroscopy for chemical analysis in electronic packaging processes
16. Mold based D-band slotted SIW bandpass filter
17. Potentials of a SiC Fan-out Wafer Level Package for High Power Application
18. Packaging Platform for low to medium Power Packages
19. Design, Fabrication and Measurement of FOWLP-based Series-Fed Antennas for 6G D-Band MIMO Applications
20. The erythropoietin‐derived peptide ARA 284 reduces tissue wasting and improves survival in a rat model of cancer cachexia
21. Panel Level Packaging – Where are the Technology Limits?
22. The biocompatibility of materials used in printed circuit board technologies with respect to primary neuronal and K562 cells
23. Hydroxychloroquine in patients with inflammatory and erosive osteoarthritis of the hands: results of the OA-TREAT study—a randomised, double-blind, placebo-controlled, multicentre, investigator-initiated trial
24. Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments
25. Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach
26. (Invited) Heterogeneous Integration As Enabler for Future Applications and Products
27. Effects of biomaterials for Lab-on-a-chip production on cell growth and expression of differentiated functions of leukemic cell lines
28. Chapter 33 - Fan-out wafer-level packaging as packaging technology for MEMS
29. Lamination and laser structuring for a microwell array
30. Fork-Coupled Resonators for Characterization of Mold Material for 5G Applications
31. Dual-Band 5G Antenna Array in Fan-Out Wafer-Level Packaging (FOWLP) Technology
32. Induction therapy with adalimumab plus methotrexate for 24 weeks followed by methotrexate monotherapy up to week 48 versus methotrexate therapy alone for DMARD-naïve patients with early rheumatoid arthritis: HIT HARD, an investigator-initiated study
33. Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications
34. Experimental Study of Panel Level Packaging Warpage
35. Simulation challenges of warpage for wafer- and panel level packaging
36. Fan-out Wafer Level Packaging of GaN Components for RF Applications
37. On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
38. Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging
39. COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELING
40. Process Optimization and Implementation of Online Monitoring Process in the Transfer Molding for Electronic Packaging
41. Simultaneous flip chip underfill and encapsulation
42. A Novel Hybrid Method to Integrate Delicate MEMS Components into a FOWLP.
43. First responders occupancy, activity and vital signs monitoring - SAFESENS
44. Process Flow and Cost Modelling for Fan-Out Panel Level Packaging
45. Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
46. Investigation and Methods Using Various Release and Thermoplastic Bonding Materials to Reduce Die Shift and Wafer Warpage for eWLB Chip-First Processes
47. A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages
48. The Realization of Redistribution Layers for FOWLP by Inkjet Printing
49. Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes
50. Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
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