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2. MOL patterning challenges in scaled SRAM with vertical Surrounding Gate Transistors (SGT)

4. Recess metrology challenges for 3D device architectures in advanced technology nodes

5. Buried power rail integration for CMOS scaling beyond the 3 nm node

7. Engineering high quality and conformal ultrathin SiNx films by PEALD for downscaled and advanced CMOS nodes

8. Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling

9. Recess metrology challenges for 3D device architectures in advanced technology nodes

11. Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers

13. Enabling CD SEM metrology for 5nm technology node and beyond

14. Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers.

15. Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers

16. Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

18. Ruthenium metallization for advanced interconnects.

19. Enabling CD SEM metrology for 5nm technology node and beyond

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