50 results on '"Burghartz, J. N."'
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2. Processing and Chracterisation of an Ultra-thin Image Sensor Chip in flexible Foil System
3. Frequency-Characterization and Modeling of AlGaN/GaN HEMTs for High-Power Applications
4. Ultra-thin Image Sensor Chip Embeded Foil
5. Evaluation of High-Temperature High-Frequency GaN-Based LC-Oscillator Components
6. Analysis of an AlGaN/AlN Super-Lattice Buffer Concept for 650-V Low-Dispersion and High-Reliability GaN HEMTs
7. BiCMOS process integration and device optimization: Basic concepts and new trends
8. Ultra‐thin smart electronic skin based on hybrid system‐in‐foil concept combining three flexible electronics technologies
9. Shape-induced ultrahigh magnetic anisotropy and ferromagnetic resonance frequency of micropatterned thin Permalloy films
10. Comprehensive compact electro-thermal GaN HEMT model
11. 600 V, low-leakage AlGaN/GaN MIS-HEMT on bulk GaN substrates
12. Micro-hybrid system in polymer foil based on adaptive layout
13. A programmable energy efficient readout chip for a multiparameter highly integrated implantable biosensor system
14. Shape-induced ultrahigh magnetic anisotropy and ferromagnetic resonance frequency of micropatterned thin Permalloy films.
15. Magnetic properties of electroplated nano/microgranular NiFe thin films for rf application.
16. Wafer-level packaging fo RF applications : using high resistivity polycrystalline silicon substrate technology
17. Air-stable, low-voltage organic transistors: High-mobility thienoacene derivatives for unipolar and complementary ring oscillators on flexible substrates
18. Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
19. Folded-patch chip-size antennas for wireless microsystems
20. Integrated chip-size antenna for wireless microsystems : fabrication and design considerations
21. Extraction of glass-wafers electrical properties based on S-parameters measurements of coplanar waveguides
22. Integrated 5.7 GHz chip-size antenna for wireless sensor networks
23. Analysis of chip-size antennas on lossy substrates for short-range wireless micro systems
24. Low-temperature refill process for through-silicon-vias (TSVs) in stacked ultra-thin chip-on-wafer by Aerosol Jet printed silver.
25. Microbolometer technology using serial pn-diodes
26. Ultra-thin Si chips for flexible electronics Process technology, characterization, assembly and applications
27. Contact properties of high-mobility, air-stable, low-voltage organic n-channel thin-film transistors based on a naphthalene tetracarboxylic diimide
28. A flexible stress sensor using a sub-10μm silicon chip technology
29. Ultra-thin chips for flexible electronics
30. You can't be too thin or too flexible
31. Low-cost CMOS compatible sintered porous silicon technique for microbolometer manufacturing
32. Monocrystalline thin-film waferlevel encapsulation of microsystems using Porous Silicon
33. Approaches for III∕V Photonics on Si
34. Submicron low-voltage organic transistors and circuits enabled by high-resolution silicon stencil masks
35. Top-contact organic transistors and complementary circuits fabricated using high-resolution silicon stencil masks
36. High-voltage (100 V) ChipfilmTM single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displays
37. Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications
38. Design of a Folded-Patch Chip-Size Antenna for Short-Range Communications
39. Device Design Issues for a High-Performance Bipolar Technology with Si or SiGe Epitaxial Base.
40. High-voltage (100V) Chipfilm single-crystal silicon LDMOS transistor for integrated driver circuits in flexible displays.
41. Status and trends of silicon RF technology
42. Magnetic-Multilayered Interconnects Featuring Skin Effect Suppression.
43. Thermal Effects in Suspended RF Spiral Inductors.
44. Design and analysis of a 6 GHz chip antenna on glass substrates for integration with RF/wireless microsystems
45. Novel very small dual-band chip-size antenna for wireless sensor networks
46. Size reduction and tuning of integrated folded patch antennas using slots
47. SELECTIVE EPITAXY BASE FOR BIPOLAR TRANSISTORS
48. Approaches for III/V Photonics on Si.
49. High-resistivity polycrystalline silicon as RF substrate in wafer-level packaging.
50. Novel Bipolar Transistor Isolation Structure Using Combined Selective Epitaxial Growth and Planarization Technique
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