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1. Packaging Approach for Integrating 40/45-nm ELK Devices Into Wire Bond and Flip-Chip Packages

2. Design for reliability of Hi-density Leadless Array (HLA™) package

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3. Thru silicon via stacking & numerical characterization for multi-die interconnections using full array & very fine pitch micro C4 bumps

4. Reliability design for exposed pad and low-profile leadframe package

5. Bis[(E)-1-methyl-4-styrylpyridinium] 4-bromo-benzene-sulfonate iodide.

6. 1-Methyl-4-[(1E,3E)-4-phenyl-buta-1,3-dien-yl]pyridinium iodide monohydrate.

7. (E)-1-Methyl-4-styrylpyridinium iodide monohydrate.

8. Bis[(E)-1-methyl-4-styrylpyridinium] 4-chloro-benzene-sulfonate iodide.

9. 1,1'-Dimethyl-4,4'-[(2,4-diphenyl-cyclo-butane-1,3-di-yl)dipyridinium-(E)-1-methyl-4-styrylpyridinium-benzene-sulfonate (0.15/1.70/2).