1. Advanced microelectromechanical systems-based nanomechanical testing: Beyond stress and strain measurements
- Author
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UCL - SST/IMMC/IMAP - Materials and process engineering, Bruker Nano Inc. - n/a, Northwestern University - McCormick School of Engineering and Applied Sciences, Center for Integrated Nanotechnologies - n/a, Georgia Institute of Technology - Woodruff School of Mechanical Engineering, Bhowmick, Sanjit, Espinosa, Horacio, Jungjohann, Katherine, Pardoen, Thomas, Pierron, Olivier, UCL - SST/IMMC/IMAP - Materials and process engineering, Bruker Nano Inc. - n/a, Northwestern University - McCormick School of Engineering and Applied Sciences, Center for Integrated Nanotechnologies - n/a, Georgia Institute of Technology - Woodruff School of Mechanical Engineering, Bhowmick, Sanjit, Espinosa, Horacio, Jungjohann, Katherine, Pardoen, Thomas, and Pierron, Olivier
- Abstract
The fi eld of in situ nanomechanics is greatly benefi ting from microelectromechanical systems (MEMS) technology and integrated microscale testing machines that can measure a wide range of mechanical properties at nanometer scales, while characterizing the damage or microstructure evolution in electron microscopes. This article focuses on the latest advances in MEMS-based nanomechanical testing techniques that go beyond stress and strain measurements under typical monotonic loadings. Specifi cally, recent advances in MEMS testing machines now enable probing key mechanical properties of nanomaterials related to fracture, fatigue, and wear. Tensile properties can be measured without instabilities or at high strain rates, and signature parameters such as activation volume can be obtained. Opportunities for environmental in situ nanomechanics enabled by MEMS technology are also discussed.
- Published
- 2019