1. An approach for the prediction of interfacial delamination of an a-Si3N4 /Si bilayer system
- Author
-
Pamela Lin, Ming Xue, Chee Meng Chai, Huan Xu, and Kun Zhou
- Subjects
010302 applied physics ,Work (thermodynamics) ,Materials science ,Acoustics and Ultrasonics ,Bilayer ,Delamination ,Constitutive equation ,02 engineering and technology ,Nanoindentation ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,01 natural sciences ,Finite element method ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,Molecular dynamics ,0103 physical sciences ,Integrated circuit packaging ,Composite material ,0210 nano-technology - Abstract
The prediction of interfacial delamination in multi-layered IC packaging has been a rather complex process as it is challenging to quantify the critical energies of interfacial adhesion experimentally. In this study, a combined approach based on molecular dynamics (MD) and finite element method (FEM) simulations is adopted to characterize and predict delamination in an a-Si3N4/Si bilayer system. The necessary material parameters that are required for the interfacial cohesive constitutive relation in FEM simulation are derived by MD simulation rather than experiment. The work of interfacial fracture obtained by the FEM simulation is about 0.11 J m−2. To validate the presented approach, an experimental nanoindentation test is also conducted to measure the work of interfacial fracture which is obtained to be about 0.085 J m−2. The results obtained by the MD-FEM simulations and the experiment show very good agreement. Therefore, the combined approach can also be applied to investigate other bi-materials or even multi-layered systems, thus facilitating the prediction of interfacial delamination and helping to improve the stability and reliability of the 3D multi-layered IC packaging.
- Published
- 2016