431 results on '"Chen, Chuantong"'
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2. Effects of high temperature and high humidity on the reliability of copper/epoxy bond
3. Investigation of the influence of aluminum surficial water on aluminum-plastic hybrids through a combined experimental and simulation approach
4. Temperature and thickness-dependent silver hillock generation mechanism and surface morphology nature of direct plated silver layers onto copper substrates
5. Enhancing thermal-mechanical performance of micron Ag/ZrW2O8 nanorod die-attach paste with low thermal expansion
6. Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging
7. Size effect of nickel-based single crystal superalloy revealed by nanoindentation with low strain rates
8. Effect of thermal-mechanical conditions on strength of silanized Al alloy/CFRTP hybrid joint made by thinning-controlled hot pressing
9. Toward defect-less and minimized work-hardening loss implementation of Al alloy/high-purity Cu dissimilar lap joints by refill friction stir spot welding for battery tab-to-busbar applications
10. Al heat affected zone-less resistance element welded lap joints of Al alloy and 1 GPa class steel: Transition of microstructure and fracture with heat transfer
11. Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations
12. Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering
13. Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
14. Effect of nanosecond pulsed laser parameters on texturing formation of metallic surface: Experiment and modelling
15. Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules
16. Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions
17. Interfacial microstructures and corrosion behavior of tungsten heavy alloy/superalloy dissimilar joints: design, regulation and mechanism
18. Effects of low melting point SnBi58 alloy on the properties of isotropic conductive adhesives
19. Gaussian filtering method of evaluating the elastic/elasto-plastic properties of sintered nanocomposites with quasi-continuous volume distribution
20. Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests
21. Effect of thermal condition on isothermal-pressing joined strength of silanized Al alloy/carbon fiber-reinforced polyamide-6
22. Unveiling the damage evolution of SAC305 during fatigue by entropy generation
23. Improving bonding strength of Al/CFRTP hybrid joint through modifying friction spot joining tools
24. Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature
25. Fourier Enhanced MLP with Adaptive Model Pruning for Efficient Federated Recommendation
26. Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors
27. Effect of Mg remelting and mechanical hooks of steel on the mechanical and fatigue responses of resistance element welded AZ31/DP780 joints: Experimental, FEM and thermodynamic calculation studies
28. Effect of electroless Cu depositions for micro-via structure and thermal cycling reliability
29. Development of Thermal Characteristics Evaluation System for Multi-Chip SiC Power Modules
30. Copper diffusion into epoxy under high temperature
31. Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling
32. Influence of Interfacial Interaction Between Various Metal Substrates and Epoxies on Bonding Reliability Under High Temperture
33. Constitutive, creep, and fatigue behavior of sintered Ag for finite element simulation of mechanical reliability: a critical review
34. Development of anti-oxidation Ag salt paste for large-area (35 [formula omitted] 35 mm2) Cu-Cu bonding with ultra-high bonding strength
35. Effects of rotation tool-induced heat and material flow behaviour on friction stir lapped Al/steel joint formation and resultant microstructure
36. Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests
37. Reliability Evaluation of Ag Sinter-Joining Die Attach Under a Harsh Thermal Cycling Test
38. Robust bonding and microstructure behavior of aluminum/high-strength steel lap joints using resistance element welding process for lightweight vehicles: Experimental and numerical investigation
39. Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock
40. Modified Ni/Pd/Au-finished DBA substrate for deformation-resistant Ag–Au joint during long-term thermal shock test
41. Fourier Enhanced MLP with Adaptive Model Pruning for Efficient Federated Recommendation
42. Development of SiC power module structure by micron-sized Ag-paste sinter joining on both die and heatsink to low-thermal-resistance and superior power cycling reliability
43. Temperature and Thickness-Dependent Silver Hillock Generation Mechanism and Surface Morphology Nature of Direct Plated Silver Layers Onto Copper Substrates
44. The Ʃ3 twin dependence of thermo-mechanical fatigue of a polycrystalline high-purity Cu film
45. Fatigue and Creep Properties of Sintered Ag Paste from Room Temperature to High Temperature
46. High-temperature capable SiC power modules by Ag sintering on various metal interfaces
47. Development of micron-sized Ag-Si composite paste die attach material for highly stable microstructure during high temperate aging
48. Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste
49. Improved thermal cycling reliability of Ag sinter joining by optimized chip mounting speed and push depth
50. Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses
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