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ABSTRACT Robust quantification of the prograde P–T trajectories of eclogite exhumed from subduction zones is fundamental for deciphering the thermal structure evolution and understanding the geodynamic processes during continental subduction. In this study, we investigate four metabasites located in Hong'an within the western Dabie HP/UHP metamorphic belt. Based on detailed petrographic observations and mineral chemistry analyses, combined with phase equilibrium modelling, average‐T calculation and conventional thermobarometry, we quantify the prograde to peak P–T paths for each of the four metabasites and the retrograde P–T conditions for two samples. The results show that three of the four metabasites have similar prograde P–T paths evolving from 15.5–18.5 kbar, 440–485 °C (M0 stage) to 18.5–20.5 kbar, 500–525 °C (M1 stage). On the other hand, although the fourth sample shares a similar P–T evolution for a segment of the late prograde stage from 18.0–19.0 kbar, ~500 °C to 20.0–22.0 kbar, ~550 °C, it attains Pmax at a notably higher pressure of ~26.0 kbar at 550–560 °C (M2 stage). During exhumation, we identify an early retrograde stage occurring at 9.0–12.5 kbar, 545–580 °C (M3 stage), followed by a later retrograde stage at 3.5–8.0 kbar, 540–580 °C (M4 stage). In combination with previous studies, we propose a common dual‐segmented P–T path for the late prograde evolution of the HP/UHP rocks in western Dabie. The initial segment exhibits a gentle slope with apparent geotherms of 7–8 °C/km, whereas the subsequent segment displays a steeper slope with apparent geotherms of 5–6 °C/km. We interpret the turning point at 20.0–23.0 kbar (corresponding to depths of 70–80 km) as marking the maximum decoupling depths (MDD) between the subducting slab and the overlying mantle wedge. Notably, this prograde dual‐segmented geotherm for eclogite in western Dabie and the corresponding MDD are similar to computational geodynamic models. [ABSTRACT FROM AUTHOR]

The design of system architecture that incorporates a System‐on‐chip (SoC) and a co‐processor, has emerged as a prevailing trend in the realm of Mixed‐Reality (MR) devices. The interconnection between such two chips is critical for the performance and reliability of MR devices, but it faces challenges from high bandwidth requirement and various channel losses in different chip placements. In this paper, we present a typical chip‐to‐chip interconnect model that can support 32Gbps bandwidth and adapt to various channel loss and transmission line lengths in different system designs. The interconnect model incorporates each typical element in packages, PCB and FPC. We optimize the interconnect model in signal integrity, use the model to simulate the interconnection up to 400mm‐length with calibrated material properties and analyze its performance in time‐domain and frequency‐domain. Our model can offer valuable insight for interconnect design when incorporating a co‐processor approach into MR devices. [ABSTRACT FROM AUTHOR]

High‐resolution RGBA format images are widely used in X‐Reality for rendering, which makes RGBA image compression an indispensable part of data transmission process. As current majority of commonly used compression standards not supporting RGBA format and simple RGBA to RGB format conversion introduces irreversible Alpha channel information loss, we propose an image compression method. By extracting alpha channel information and concatenating it with the RGB part, combined with any general compression algorithm, the method showed effective RGBA image compression ability in experiment with lightly Alpha channel information loss. [ABSTRACT FROM AUTHOR]

In order to reduce the damage of apples during transportation, the influence of packing structure of fruit box on the damage characteristics of apples was studied. Fushi apples with a diameter of about 70 mm and a weight of about 200 g were used as test subjects, and number of partition zones, buffer material and number of stacking layers of the apples were taken as the influence factors. The damage volume was taken as the evaluation index. The influence rule of each factor on the evaluation index was determined through single factor test. On the basis of single factor test, response surface test was used to optimize the test. The results show that the apple damage volume decreases with the increase of the number of partition zones, but increases with the increase of the number of stacking layers. When the buffer material is pearl wool, the apple damage volume is relatively small. The optimal packing structure combination obtained by response surface optimization test is as follows: the number of partition zones is four, the buffer material is pearl wool, and the number of apple stacking layers is one, and the average value of apple damage volume at 5, 10 and 20Hz is 49.27, 63.38, 81.46 mm3, respectively. The experimental results show that the errors are less than 5%. The results can provide reference for the study of apple damage during transportation. [ABSTRACT FROM AUTHOR]

Thermoplastic starch (TPS) was prepared by twin-screw extruder with benzophenone as a photoinitiator and glycerin as a plasticizer, and the effect of UV irradiation time on the mechanical properties, dynamic thermo-mechanical properties, thermal stabilities and water resistance of the resulting TPS were investigated. The results indicated that an optimum crosslinked network structure was formed with UV irradiation for 15 min, which led to an effective enhancement in mechanical properties and water resistance. The tensile strength, bending strength and impact strength of TPS were 4.57 MPa, 7.1 MPa, 69.39 kJ/m², respectively, and its storage modulus was also improved. Moreover, the glass transition temperature reached a maximum value at this condition with a Tβ of - 35.63 °C and a Tα of 53.96 °C. The peak temperature of TPS corresponding to the maximum decomposition rate increased from 317.81 °C to 330.48 °C, and its contact angle increased from 42.3 ° to 77.2 °, indicating the water resistance and water absorption of TPS were improved effectively. [ABSTRACT FROM AUTHOR]