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263 results on '"Chen, Kuang-Chao"'

1. Development of a Wearable Sleep Airway Optical Monitor

Author

Lin, Yen-Tsung, Chu, Woei-Chyn, Chen, Kuang-Chao, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Li, Yong, Series Editor, Liang, Qilian, Series Editor, Martín, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Oneto, Luca, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zamboni, Walter, Series Editor, Zhang, Junjie James, Series Editor, Tan, Kay Chen, Series Editor, Hung, Jason C., editor, Yen, Neil, editor, and Chang, Jia-Wei, editor

Published
2024
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10. Endoscopic Versus Microscopic Type I Tympanoplasty: An Updated Systematic Review and Meta‐analysis.

Author

Wang, Tang‐Chuan, Shih, Tzu‐Ching, Chen, Chin‐Kuo, Hsieh, Vivian Chia‐Rong, Lin, Dan‐Jae, Tien, Hui‐Chi, Chen, Kuang‐Chao, Tsai, Ming‐Hsui, Lin, Chia‐Der, and Tsai, Chon‐Haw

Abstract

Objective: Our objective was to perform a systematic review and meta‐analysis comparing the clinical outcomes after endoscopic and microscopic type I tympanoplasty. Study Design: Randomized controlled trials, two‐arm prospective studies, and retrospective studies were included. Setting: Medline, Cochrane, EMBASE, and Google Scholar databases were searched until March 1, 2022 using the combinations of search terms: "endoscopic," "microscopic," and "tympanoplasty." Methods: Two independent reviewers utilized the abovementioned search strategy to identify eligible studies. If any uncertainty existed regarding eligibility, a third reviewer was consulted. Primary outcome measures were graft success rate, air‐bone gap (ABG) improvement, and operative time. Secondary outcomes were the rate of need for canalplasty, the proportion of self‐rated excellent cosmetic results, and pain visual analog scale (VAS). Results: Forty‐three studies enrolled a total of 3712 patients who were undergoing type I tympanoplasty and were finally included. The pooled result showed endoscopic approach was significantly associated with shorter operative time (difference in means: −20.021, 95% confidence interval [CI]: −31.431 to −8.611), less need for canalplasty (odds ratio [OR]: 0.065, 95% CI: 0.026‐0.164), more self‐rated excellent cosmetic results (OR: 87.323, 95% CI: 26.750‐285.063), and lower pain VAS (difference in means: −2.513, 95% CI: −4.737 to −0.228). No significant differences in graft success rate or ABG were observed between the two procedures. Conclusion: Endoscopic type I tympanoplasty provides a similar graft success rate, improvement in ABG, and reperforation rate to microscopic tympanoplasty with a shorter operative time, better self‐rated cosmetic results, and less pain. Unless contraindicated, the endoscopic approach should be the procedure of choice in type I tympanoplasty. [ABSTRACT FROM AUTHOR]

Published
2024
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12. Post-Etch Yield Killer Defects in 3D NAND High Aspect Ratio Etching Process

Author

Chang, Chih-Chin, primary, Hsiao, Ching-Hung, additional, Chen, Yi-Che, additional, Wang, Ching-Hung, additional, Chung, Yao-An, additional, Wang, Li-Wei, additional, Lee, Hong-Ji, additional, Lian, Nan-Tzu, additional, Lee, Shih-Chin, additional, Han, Tzung-Ting, additional, Yang, Tahone, additional, Chen, Kuang-Chao, additional, and Lu, Chih-Yuan, additional

Published
2023
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26. Hearing Features and Cochlear Implantation Outcomes in Patients With PathogenicMYO15AVariants: a Multicenter Observational Study

Author

Chen, Pey-Yu, primary, Tsai, Cheng-Yu, additional, Wu, Jiunn-Liang, additional, Li, Yi-Lu, additional, Wu, Che-Ming, additional, Chen, Kuang-Chao, additional, Hwang, Chung-Feng, additional, Wu, Hung-Pin, additional, Lin, Hung-Ching, additional, Cheng, Yen-Fu, additional, Lo, Ming-Yu, additional, Liu, Tien-Chen, additional, Yang, Ting-Hua, additional, Chen, Pei-Lung, additional, Hsu, Chuan-Jen, additional, and Wu, Chen-Chi, additional

Published
2021
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37. CMP Process Optimization Engineering by Machine Learning

Author

Lin Chih-Chen, Chen Kuang-Chao, Yu Hsiang-Meng, Hsu Min-hsuan, Yang Tahone, Chen Kuang-Wei, Chen Yen-Ting, Yang Ling-Wu, and Tuung Luoh

Subjects
Artificial neural network, Page layout, Computer science, Chemical-mechanical planarization, Process (computing), Process control, Process optimization, computer.software_genre, Network topology, Chip, computer, Simulation
Abstract

Advanced Chemical-mechanical polishing (CMP) process not only needs to maintain stable run-to-run thickness control but also achieve better within wafer/within chip planarization performance. Furthermore, slurries or other consumable parts, like PAD and Disks selection are also the keys for CMP process optimization. The most difficult thing in CMP process is to have capability to predict and cover the various topologies and layout densities patterned wafers and preventing the hot spots occurrences. In this study, different Neural-Network algorithm with data pre-processing models are implemented to the in-line CMP CLC tuning and dishing/erosion prediction at various topology/pattern density test vehicle pattern wafers. Transfer learning technique is implemented on the original Neural -Network algorithm model, the behavior of real product can be simulated and predicted based on the knowledge of test vehicle database successfully. With the aid of multiple layer erosion/ dishing Neural-Network algorithm model prediction, the potential high risky hot spots can be highlighted at the initial layout design stage, then further shorten the turn-around time of design layout validation.

Published
2020

43. Applications of single-wafer thermal processing to 0.15-[micro]m high-density MROM

Author

Hsu, Shu-Ya, Wang, Tzu-Yu, Shih, Hsueh-Hao, Chen, Kuang-Chao, Hwang, Yaw-Lin, Hsueh, Cheng-Chen, Chung, Henry, Pan, Sam, and Lu, Chih-Yuan

Subjects
Integrated circuit fabrication -- Methods, Semiconductor wafers -- Design and construction, Read-only memory -- Design and construction, Integrated circuit fabrication, Business, Computers, Electronics, Electronics and electrical industries
Abstract

Feasibility of single-wafer rapid-thermal process as an alternative to the conventional batch-type furnace process is evaluated on a 0.15-[micro]m 128-Mb mask read only memory (MROM) product. Excellent gate oxide integrity and device characteristics are achieved with a single-wafer rapid-thermal process. Superior yield and product reliability by using single-wafer process tool have also been achieved. Shortened process cycle time and better thermal process uniformity by using single-wafer rapid-thermal processing are demonstrated. Index Terms--Integrity, ISSG, mask ROM, single-wafer.

Published
2003

44. Single-wafer polysilicon engineering for the improvement of over erase in a 0.18-[micro]m floating-gate flash memory

Author

Luoh, Tuung, Han, Tzung-Ting, Yang, Yun-Chi, Chen, Kuang-Chao, Shih, Hsueh-Hao, Hwang, Yaw-Lin, Hsueh, Cheng-Chen, Chung, Henry, Pan, Sam, and Lu, Chih-Yuan

Subjects
Integrated circuit fabrication -- Methods, Flash memory -- Design and construction, Integrated circuit fabrication, Flash memory, Business, Computers, Electronics, Electronics and electrical industries
Abstract

A new polysilicon grain engineering technology for the improvement of over erase in 0.18-[micro]m floating-gate flash memory has been developed with the use of single-wafer polysilicon processing, which makes it practical to use hydrogen as a process variable. The addition of hydrogen in polysilicon deposition significantly alters the reaction kinetics and produces polysilicon thin film of smooth surface, fine and uniformly distributed grains. Such a micrograin polysilicon possesses show excellent high-temperature stability. The benefits of the micrograin polysilicon are to be demonstrated through its improvement in over erase of a 0.18-[micro]m floating-gate flash memory. Index Terms--Flash memory, grain size, over erase, polysilicon, single-wafer.

Published
2003

45. Applications of single-wafer rapid-thermal processing to the manufacture of advanced flash memory

Author

Chen, Kuang-Chao, Shih, Hsueh-Hao, Hwang, Yaw-Lin, Hsueh, Cheng-Chen, Chung, Henry, Pan, Sam, and Lu, Chih-Yuan

Subjects
Integrated circuit fabrication -- Methods, Flash memory -- Design and construction, Integrated circuit fabrication, Flash memory, Business, Computers, Electronics, Electronics and electrical industries
Abstract

The application of single-wafer processing in semiconductor manufacturing has long been touted as the most effective way in reducing cycle time in a production environment as well as shortening the learning cycle for process development. However, one of the bottle neck areas is in the diffusion module in which conventional furnace processes are difficult to replace due to their superior film quality and high throughput. Recently, significant progress has been made in the areas of rapid thermal oxidation (RTO) and low-pressure chemical vapor deposition (LPCVD) such that high quality films of oxide, nitride, and polysilicon were achieved with great improvement in manufacturing cycle time. In this paper, nonvolatile memory devices such as flash EPROM will be used as examples to illustrate the effective applications of RTO and single-wafer LPCVD processes. Index Terms--Flash, floating gate, reliability, single-wafer processing (SWP), tunnel oxide.

Published
2003

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