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31 results on '"Cheng, Weizheng"'

3. Phototaxis Flight of Microdroplets in a Laser

Author

Cheng, Weizheng, primary, Zhu, Hanrui, additional, Zheng, Feiyu, additional, Chu, Ben, additional, Wang, Ruitong, additional, Tao, Jinran, additional, Zhang, Wanli, additional, Tao, Peng, additional, Song, Chengyi, additional, Shang, Wen, additional, Fu, Benwei, additional, and Deng, Tao, additional

Published
2024
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12. Manipulation of Convection Using Infrared Light Emitted from Human Hands

Author

Zhu, Hanrui, primary, Luo, Zhen, additional, Zhang, Lifu, additional, Shen, Qingchen, additional, Yang, Runheng, additional, Cheng, Weizheng, additional, Zhang, Yingyue, additional, Jiang, Modi, additional, Guo, Chunzhi, additional, Fu, Benwei, additional, Song, Chengyi, additional, Tao, Peng, additional, An, Shun, additional, Shang, Wen, additional, and Deng, Tao, additional

Published
2024
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16. Lightweight All Graphene‐Based Two‐Phase Heat Transport Devices

Author

Zheng, Feiyu, primary, Shen, Qingchen, additional, Wang, Zhiying, additional, Cheng, Weizheng, additional, Wang, Ruitong, additional, Fang, Cheng, additional, Chu, Ben, additional, Tao, Jinran, additional, Zhang, Wanli, additional, Tao, Peng, additional, Song, Chengyi, additional, Shang, Wen, additional, Fu, Benwei, additional, and Deng, Tao, additional

Published
2023
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17. Recent progress in films with nanoengineered surfaces via bubble-induced self-assembly for energy applications.

Author

Chu, Ben, Fu, Benwei, Wang, Ruitong, Cheng, Weizheng, Tao, Peng, Song, Chengyi, Shang, Wen, and Deng, Tao

Abstract

Films with nanoengineered surfaces have been extensively utilized in a variety of energy-related applications such as water desalination, thermal management and solar steam generation. To generate high-quality films, various generation methods including chemical vapor deposition (CVD), electrodeposition and microlithography have been studied. Compared to these methods, however, bubble-induced self-assembly (BISA) has been developed as an alternative strategy due to the advantages of being simple and cost-effective, and has generated considerable research efforts. In this paper, we review the recent advances in the development of films with nanoengineered surfaces via the BISA of nanomaterials. The mechanism and regulation of the BISA to generate high-performance films with the desired surface characteristics are discussed in detail. We also highlight the application of the BISA strategy for use in enhanced phase-change heat transfer. In addition, other applications of the BISA strategy are described, which range from effective thermal management of electronics and concentrated photovoltaics, to advanced energy storage and conversion. Finally, we discuss the current challenges and potential research directions in the field. It is expected that this review will provide a comprehensive understanding of the design, generation, applications and perspectives of films with nanoengineered surfaces generated by the BISA. [ABSTRACT FROM AUTHOR]

Published
2023
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26. Hybrid graphene oxide/crumpled graphene film via subcooled boiling-induced self-assembly for highly efficient boiling heat transfer

Author

Cheng Weizheng, Cheng Fang, Ruitong Wang, Chu Ben, Wanli Zhang, Tao Deng, Peng Tao, Wen Shang, Jinran Tao, Huai Lei, Chengyi Song, Benwei Fu, and Feiyu Zheng

Subjects
Materials science, Renewable Energy, Sustainability and the Environment, Critical heat flux, Graphene, Materials Science (miscellaneous), Disjoining pressure, Oxide, Energy Engineering and Power Technology, Nanotechnology, Heat transfer coefficient, law.invention, Subcooling, chemistry.chemical_compound, Fuel Technology, Nuclear Energy and Engineering, chemistry, law, Boiling, Heat transfer
Abstract

Graphene-based films generated on a substrate can modify surface structure and chemistry to enable the improvement in heat transfer capacity for many important boiling-related applications. Current methods for preparing these films, however, require additional processing equipment and involve relatively complex processes. Achieving simple and controllable generation of these films remains a great challenge. In this work, we develop a facile subcooled boiling-induced self-assembly (SBISA) method for generating graphene-based films. We first explore the SBISA mechanism and demonstrate the formation of graphene-based films under the action of a combined force induced by the capillary pressure, structural disjoining pressure, and vapor recoil force. In addition, using the SBISA process, we generate a tunable hybrid graphene oxide (GO)/crumpled graphene (CG) film with mixed wettability. The hybrid GO/CG film enables large performance enhancements for boiling with a 150.0% increase in the critical heat flux (CHF) and a 163.9% increase in the maximum heat transfer coefficient (HTC) over a pristine copper surface. This SBISA strategy provides an alternative approach for fabricating tunable films with a hierarchical structure and mixed wettability on various substrates, and it may also help produce surfaces with different micro/nanostructures for enhancing phase-change-based heat transfer.

Published
2021

29. Quasi-ballistic thermal transport and temperature jumps in nanostructures

Author

Alkurdi, Ali, Cheng, Weizheng, Abs da Cruz, Carolina, Nghiem, Trang, Randrianalisoa, Jaona, Nefzaoui, E., Chapuis, P.-O., Centre d'Energétique et de Thermique de Lyon (CETHIL), Centre National de la Recherche Scientifique (CNRS)-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Université de Lyon-Institut National des Sciences Appliquées (INSA)-Université Claude Bernard Lyon 1 (UCBL), Université de Lyon, Université de Reims Champagne-Ardenne (URCA), Electronique, Systèmes de communication et Microsystèmes (ESYCOM), Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris-Conservatoire National des Arts et Métiers [CNAM] (CNAM), European Project: 766853,H2020-FETOPEN-1-2016-2017,EFINED(2018), Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS), Conservatoire National des Arts et Métiers [CNAM] (CNAM), HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-HESAM Université - Communauté d'universités et d'établissements Hautes écoles Sorbonne Arts et métiers université (HESAM)-Université Paris-Est Marne-la-Vallée (UPEM)-ESIEE Paris, Chapuis, Pierre-Olivier, and Energy Filtering Non-Equilibrium Devices - EFINED - 2018-01-01 - 2021-06-30 - 766853 - VALID

Subjects
[SPI.MECA.THER]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Thermics [physics.class-ph], ComputingMilieux_MISCELLANEOUS, [SPI.MECA.THER] Engineering Sciences [physics]/Mechanics [physics.med-ph]/Thermics [physics.class-ph]
Abstract

International audience

Published
2019

30. Low thermal expansion metal composite-based heat spreader for high temperature thermal management

Author

Peng Tao, Cheng Weizheng, Huanbei Chen, Wen Shang, Benwei Fu, Feiyu Zheng, Tao Deng, and Chengyi Song

Subjects
Materials science, Thermal resistance, Alloy, 02 engineering and technology, engineering.material, Heat sink, 010402 general chemistry, 01 natural sciences, Thermal expansion, Thermal conductivity, Water cooling, General Materials Science, Composite material, Materials of engineering and construction. Mechanics of materials, Vapor chamber, Mechanical Engineering, High operation temperature, Metal composite materials, 021001 nanoscience & nanotechnology, 0104 chemical sciences, Mechanics of Materials, Heat transfer, Heat spreader, TA401-492, engineering, Thermal management, 0210 nano-technology
Abstract

The electronic industry is facing pressing needs for cooling system with high-performance in heat transfer and matched coefficient of thermal expansion (CTE) with the chips. Metal composite materials (MCMs) with low CTE can be used in cooling chips to overcome the thermal expansion mismatch between the cooling substrate and chips. However, low thermal conductivity of MCMs limits their application in electronic cooling systems. Increasing the percentage of components with high thermal conductivity can enhance the thermal conductivity of MCMs, but it often leads to increase CTE as well. Here, we demonstrate that vapor–liquid phase change can improve the heat transfer performance of tungsten-copper (W-Cu) alloy-based MCMs while maintain their low CTEs. Such strategy reduces the maximum temperature and thermal resistance of MCMs, and also allows for heat spreading from concentrated heat source with high power density. The W-Cu alloy-based vapor chamber (VC) has low thermal resistance of 0.38 K/W at 100 W and high lateral thermal conductivity of ~1727 W/(m·K). The W-Cu alloy-based VC can be readily integrated with the chip and heat sink to serve as cooling substrates for dissipating the heat and simultaneously lowering the thermal expansion mismatch by using its high thermal conductivity and low CTE.

Published
2021

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