4 results on '"Chian, Bow-Tsin"'
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2. Demonstration of an Equivalent Material Approach for the Strain-Induced Reliability Estimation of Stacked-Chip Packaging
3. Development and demonstration of equivalent material characteristics for microbump arrays utilized in failure estimation of chip-on-chip packaging
4. Performance Investigation of Nanoscale Strained Ge pMOSFETs with a GeSn Alloy Stressor
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