276 results on '"Chiang, Kuo-Ning"'
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2. Equation Informed Neural Networks with Bayesian Inference Improvement for the Coefficient Extraction of the Empirical Formulas
3. Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks.
4. Nano-Scale and Atomistic-Scale Modeling of Advanced Materials
5. Electro-thermal finite element analysis and verification of power module with aluminum wire
6. Thermo-electric finite element analysis and characteristic of thermoelectric generator with intermetallic compound
7. Research on the degradation of AlGaInP Ultra High Brightness LEDs influenced by ohmic metal design
8. Investigation of consequent process-induced stress for N-type metal oxide semiconductor field effect transistor with a sunken shallow trench isolation pattern
9. Research on efficiency droop mechanism and improvement in AlGaInP Ultra-High-Brightness LEDs using the transient measurement method
10. Investigation of interconnect design on interfacial cracking energy of Al/TiN barriers under a flexural load
11. Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms
12. Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period
13. Wafer-level packaging solder joint reliability lifecycle prediction using SVR-based machine learning algorithm.
14. Physics-based analysis of minimum quantity lubrication grinding
15. Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique
16. A robust nano-mechanics approach for tensile and modal analysis using atomistic–continuum mechanics method
17. Life prediction of HCPV under thermal cycling test condition
18. Overview and applicability of residual stress estimation of film–substrate structure
19. An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging
20. A General Approach to Nonlinear Dynamic Analysis on Parallel/Vector Computers
21. Study on an Artificial Intelligence Based Kernel Ridge Regression Algorithm for Wafer Level Package Reliability Prediction
22. Thermal Stress–Induced Interfacial Failure Modes of Advanced Electronic Devices
23. Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging
24. Cracking energy estimation of ultra low- k package using novel prediction approach combined with global–local modeling technique
25. Validation of Mechanical Properties of Single Crystal Silicon by Atomic-Level Numerical Model
26. Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications
27. Predicting the liquid formation for the solder joints in flip chip technology
28. Aging study on interfacial microstructure and solder-ball shear strength of a wafer-level chip-size package with Au/Ni metallization on a Cu pad
29. Packaging effect investigation of CMOS compatible pressure sensor using flip chip and flex circuit board technologies
30. Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration
31. Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip
32. Thermal resistance analysis and validation of flip chip PBGA packages
33. Nano-Scale and Atomistic-Scale Modeling of Advanced Materials
34. Prediction of liquid formation for solder and non-solder mask defined array packages
35. From Atomic-Level Lattice Structure to Estimate the Silicon Mechanical Bulk Behaviour Using the Atomistic-Continuum Mechanics
36. Empirical High Cycle Fatigue Assessment Model of MEMS Devices
37. A Novel Prediction Technique for Interfacial Crack Growth of Electronic Interconnect
38. Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging
39. Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology
40. Design and analysis of gasket sealing of cylinder head under engine operation conditions
41. Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application
42. Impact of probing procedure on flip chip reliability
43. Trace line Layout Design of FO-WLCSP
44. Warpage and Simulation Analysis of Panel Level FO-WLCSP Using Equivalent CTE
45. Thermal Modeling of Temperature Distribution in Metal Additive Manufacturing Considering Effects of Build Layers, Latent Heat, and Temperature-Sensitivity of Material Properties
46. Coplanarity analysis and validation of PBGA and T 2-BGA packages
47. Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures
48. Design and reliability assessment of stacked fan-out packaging
49. Feasibility Evaluation of Creep Model for Failure Assessment of Solder Joint Reliability of Wafer-Level Packaging
50. A Modified Acceleration Factor Empirical Equation for BGA Type Package
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