296 results on '"Chuang, Tung-Han"'
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2. Low-Temperature Die Bonding of SiC Chips with DBC Ceramic Substrates Using High-Density Ag (111) Nanotwinned Films
3. Ion Bombardment-Induced Stress Mechanism for the Formation of Ag Nanotwinned Films on Si Substrates
4. Formation of Ag Dendrites During the Electrolytic Migration Between Ag-4Pd Wire Couple in Water Under Bias
5. Growth of Cu nanotwinned films on surface activated SiC chips
6. Intermetallic growth and thermal impedance at the In32.5Bi16.5Sn/Cu interface
7. Atomic Migration of Cu on the Surface of Si/Ti/Ni/Cu/Ag Thin Films
8. Optimization of Ag-alloy ribbon bonding — An approach to reliable interconnection for high power IC packaging
9. Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
10. Effects of substrate bias on the sputtering of high density (111)-nanotwinned Cu films on SiC chips
11. Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires
12. Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
13. Improvement of Silver Sintered Die Bonding of SiC/DBC Power Modules through Backside Metallization with High Density (111) Orientation Ag Nanotwinned Films
14. Ultra-Thin Cu Nano-Twinned Films Sputtered On Si Wafers for Low Temperature Hybrid Bonding Of Advanced 3D-IC Packages
15. Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films
16. Grain growth and twin formation in a Ag-4Pd alloy ribbon after annealing treatments
17. Characterization of interfacial structure for low-temperature direct bonding of Si substrates sputtered with Ag nanotwinned films
18. p-type semi-transparent conductive NiO films with high deposition rate produced by superimposed high power impulse magnetron sputtering
19. Sputtering of Ag (111) nanotwinned films on Si (100) wafers for backside metallization of power devices
20. Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging
21. Lattice buffer effect of Ti film on the epitaxial growth of Ag nanotwins on Si substrates with various orientations
22. Study on thermoelectric property optimization of mixed-phase bismuth telluride thin films deposited by co-evaporation process
23. Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization
24. Formation of Cu Nanotwins on Silicon Carbide Wafers with Cr Adhesive Layer under Various Substrate Bias
25. Improvement of Sn-3Ag-0.5Cu Soldered Joints Between Bi0.5Sb1.5Te3 Thermoelectric Material and a Cu Electrode
26. Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization.
27. Formation of Cu Nanotwins on Silicon Carbide Wafers with Cr Adhesive Layer in Different Substrate Bias
28. Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films
29. Deposition of Ag Nanotwinned Films on Graphene/ Si Photoelectrochemical Cell for CO2 Reduction and Hydrogen Production
30. Low Temperature Die Bonding of Ge (111) Chips with DBC Alumina Substrates through High-Density (111) Textured Ag Nanotwinned Films
31. Sputtering of Ultra-thin Cu Nano-twinned Films on Si Wafers for Application in Advanced 3D-IC Packaging
32. Design of diffusion barrier and buffer layers for β-Zn4Sb3 mid-temperature thermoelectric modules
33. Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressing
34. Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires
35. Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires
36. Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires
37. Highly Stable and Enhanced Performance of p–i–n Perovskite Solar Cells via Cuprous Oxide Hole-Transport Layers
38. Characterization and crystallization kinetics of sputtered NiSi thin films for blue laser optical recording application
39. Microstructures and optoelectronic properties of CuxO films deposited by high-power impulse magnetron sputtering
40. Microstructures, electrical and magnetic properties of (Ga, Co)-ZnO films by radio frequency magnetron co-sputtering
41. Electrolytic Migration of Ag-Pd Alloy Wires with Various Pd Contents
42. Low Temperature TSV Interconnection with Ultra-thin Ag Nano-twinned Films Sputtered on Si Wafers for 3D-IC Advanced Packages
43. Characterization of High Density (111)-oriented Ag Nanotwinned Films Deposited on Sapphire Wafers
44. Low Temperature Direct Bonding of Ge Chips with DBC Alumina Substrates using Ag Nanotwinned Films
45. Effects of Sputtering Bias on the Material Characteristics of Ag Nanotwinned Films
46. Investigation of Creep Failure in Ag-4Pd Bonding Wire Under Dynamic Mechanical Analysis Tests
47. Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization
48. Low-Temperature Direct Bonding of 3D-IC Packages and Power IC Modules Using Ag Nanotwinned Thin Films
49. Improvement of the Mechanical Properties of the Diffusion-Bonded 2024 Aluminum Alloy through Post-Weld Heat Treatments
50. Thermal stability of grain structure and material properties in an annealing twinned Ag–4Pd alloy wire
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