1. High Density TSV-Free Interposer (TFI) Packaging with Submicron Cu Damascene RDLs for Integration of CPU/GPU and HBM
- Author
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Hongyu Li, Masaya Kawano, Chum-Mei Wang, Teck-Guan Lim, Sharon Pei Siang Lim, Mian-Zhi Ding, Zi-Hao Chen, and Fa Xing Che
- Subjects
010302 applied physics ,Packaging engineering ,Computer science ,Cost effectiveness ,business.industry ,Graphics processing unit ,Power integrity ,High Bandwidth Memory ,01 natural sciences ,Embedded system ,0103 physical sciences ,Interposer ,Redistribution layer ,Signal integrity ,business - Abstract
TSV-Free Interposer (TFI) packaging technology was developed for central/graphics processing unit (CPU/GPU) and stacked memory system-in-package (SiP) applications. TFI package is targeting to accommodate thick module as High Bandwidth Memory (HBM) and wide-bus interconnections between CPU/GPU and HBM in a package with cost-effective process. The redistribution layer structure was studied based on inter-chip connectivity between CPU/GPU and HBM as well as signal integrity and power integrity. This study demonstrated capability of TFI package in view of electrical performance, cost effectiveness and process challenges. The process challenges were overcome by co-design modeling and process optimizations.
- Published
- 2018