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43 results on '"Ciarpi, Gabriele"'

1. Smart Kinetic Floor System for Energy Harvesting and Data Acquisition in High Foot-Traffic Areas

Author

Ciarpi, Gabriele, Noccetti, Ettore, Ceragioli, Luca, Mestice, Marco, Rossi, Daniele, Saponara, Sergio, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Li, Yong, Series Editor, Liang, Qilian, Series Editor, Martín, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Oneto, Luca, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zamboni, Walter, Series Editor, Zhang, Junjie James, Series Editor, Tan, Kay Chen, Series Editor, Bellotti, Francesco, editor, Grammatikakis, Miltos D., editor, Mansour, Ali, editor, Ruo Roch, Massimo, editor, Seepold, Ralf, editor, Solanas, Agusti, editor, and Berta, Riccardo, editor

Published
2024
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2. Wire Bonding: Limitations and Opportunities for High-Speed Serial Communications

Author

Ciarpi, Gabriele, Mestice, Marco, Rossi, Daniele, Saponara, Sergio, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Li, Yong, Series Editor, Liang, Qilian, Series Editor, Martín, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Oneto, Luca, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zamboni, Walter, Series Editor, Zhang, Junjie James, Series Editor, Tan, Kay Chen, Series Editor, Bellotti, Francesco, editor, Grammatikakis, Miltos D., editor, Mansour, Ali, editor, Ruo Roch, Massimo, editor, Seepold, Ralf, editor, Solanas, Agusti, editor, and Berta, Riccardo, editor

Published
2024
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4. Analysis and Design of Integrated VCO in 28 nm CMOS Technology for Aerospace Applications

Author

Prosperi, Paolo, Ciarpi, Gabriele, Saponara, Sergio, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Hirche, Sandra, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Liang, Qilian, Series Editor, Martín, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Möller, Sebastian, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zhang, Junjie James, Series Editor, Saponara, Sergio, editor, and De Gloria, Alessandro, editor

Published
2021
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5. Design and Analysis of RF/High-Speed SERDES in 28 nm CMOS Technology for Aerospace Applications

Author

Cosimi, Francesco, Ciarpi, Gabriele, Saponara, Sergio, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Hirche, Sandra, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Liang, Qilian, Series Editor, Martín, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Möller, Sebastian, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zhang, Junjie James, Series Editor, Saponara, Sergio, editor, and De Gloria, Alessandro, editor

Published
2021
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6. High Power Pulsed LED Driver for Vibration Measurements.

Author

Neri, Paolo, Ciarpi, Gabriele, and Neri, Bruno

Subjects
*VIBRATION measurements, *LED displays, *DISPLACEMENT (Mechanics), *BINOCULAR vision, *DIGITAL cameras, *FREQUENCIES of oscillating systems, *ELECTRIC potential measurement
Abstract

Vibration measurements pose specific experimental challenges to be faced. In particular, optical methods can be used to obtain full-field vibration information. In this scenario, stereo-camera systems can be developed to obtain 3D displacement measurements. As vibration frequency increases, the common approach is to reduce camera exposure time to avoid blurred images, which can lead to under-exposed images and data loss, as well as issues with the synchronization of the stereo pair. Both of these problems can be solved by using high-intensity light pulses, which can produce high-quality images and guarantee camera synchronization since data is saved by both cameras only during the short-time light pulse. To this extent, high-power Light-Emitting Diodes (LEDs) can be used, but even if the LED itself can have a fast response time, specific electronic drivers are needed to ensure the desired timing of the light pulse. In this paper, a circuit is specifically designed to achieve high-intensity short-time light pulses in the range of 1 µs. A prototype of the designed board was assembled and tested to check its capability to respect the specification. Three different measurement methods are proposed and validated to achieve short-time light pulse measurements: shunt voltage measurement, direct photodiode measurement with a low-cost sensor, and indirect pulse measurement through a low-frame-rate digital camera. [ABSTRACT FROM AUTHOR]

Published
2024
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8. Analysis and Simulations of mmW Transceiver for System-in-Package Communications

Author

Saponara, Sergio, Ciarpi, Gabriele, Giannetti, Filippo, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Ruediger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Hirche, Sandra, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Liang, Qilian, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Möller, Sebastian, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zhang, Junjie James, Series Editor, and De Gloria, Alessandro, editor

Published
2019
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9. Fully Digital Low-Power Implementation of an Audio Front-End for Portable Applications

Author

Meoni, Gabriele, Pilato, Luca, Ciarpi, Gabriele, Palla, Alessandro, Fanucci, Luca, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Hirche, Sandra, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Liang, Qilian, Series Editor, Martin, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Möller, Sebastian, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zhang, Junjie James, Series Editor, Saponara, Sergio, editor, and De Gloria, Alessandro, editor

Published
2019
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10. Sound-Based Detection and Ranging System as Example Application of a Rapid Prototyping and Low-Cost Technology for Board-Level Electronic Systems Education

Author

Di Pascoli, Stefano, Ciarpi, Gabriele, Saponara, Sergio, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Hirche, Sandra, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Liang, Qilian, Series Editor, Martin, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Möller, Sebastian, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zhang, Junjie James, Series Editor, Saponara, Sergio, editor, and De Gloria, Alessandro, editor

Published
2019
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11. Radiation Hardness by Design Techniques for 1 Grad TID Rad-Hard Systems in 65 nm Standard CMOS Technologies

Author

Ciarpi, Gabriele, Saponara, Sergio, Magazzù, Guido, Palla, Fabrizio, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Hirche, Sandra, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Liang, Qilian, Series Editor, Martin, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Möller, Sebastian, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zhang, Junjie James, Series Editor, Saponara, Sergio, editor, and De Gloria, Alessandro, editor

Published
2019
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15. Design of Linear and Planar Arrays With Low Sidelobe Levels and High Directivity Using Two-Way Array Factor

Author

Rathod, Rathod, Choudhury, Suvadeep, Subhashini, K. R., Ciarpi, Gabriele, Genovesi, Simone, and Rossi, Daniele

Abstract

Sidelobes (SLs) in the two-way radiation pattern are of serious concern in a radar array. Several techniques have evolved to mitigate the problem, which include amplitude tapering, genetic algorithm (GA) optimization, thinning transceiver aperture, and two-weight amplitude distribution. With such optimization schemes, the SLs can be considerably suppressed but at the cost of a reduction in directivity or taper efficiency. Furthermore, such amplitude tapers require a complex feeding network design. This work alleviates such design restrictions and proposes a systematic approach to lower the SLs in radar two-way shared aperture arrays. The proposed methodology can achieve an SL level (SLL) of below −52 dB in both linear and planar arrays, which is about 18 dB enhancement in SLL compared with uniform transmit and thinned receive arrays. In addition, as a result of the equal transceiver array size in the proposed design, an improvement of approximately 0.44 dB and 0.68 dB in directivity is achieved in linear and planar arrays, respectively. A novel feeding architecture is also illustrated to reduce the cost and complexity of the overall feeding network. A set of full-wave simulations have also been performed to validate the theoretical results.

Published
2024
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23. Design and Experimental Verification of IC Techniques for Harsh Environments: Automotive, Aerospace and HEP case studies

Author

Ciarpi, Gabriele

Abstract

L’odierna incredibile crescita dell’elettronica di consumo è affiancata dalla pervasiva diffusione dei dispositivi elettronici negli ambienti più ostili. In questi contesti, i Circuiti Integrati (ICs) devono fronteggiare condizioni avverse che influiscono sul corretto funzionamento dei dispositivi in silicio. Nonostante gli attuali mondi automotive e aerospace siano due degli ambienti più ostili dove i ICs possono operare, la prossima generazione di veicoli terrestri e spaziali sarà sempre maggiormente gestita da sistemi elettronici. L’attuale tendenza nella gestione della potenza di bordo mostra una coesistenza di diversi domini di tensione per l’alimentazione dei diversi sottosistemi elettronici, come 48 V, 12 V e 5 V. Per queste ragioni, in questo lavoro di tesi, alcune tecniche per affrontare gli effetti derivati da sistemi costituiti da domini multi-tensione sono proposti insieme alla progettazione di un convertitore DC/DC senza induttore. Il convertitore DC/DC, progettato nella tecnologia 0.35 μm HV, è in grado di convertire un ampio range di tensioni in ingresso, da 6 V a 60 V, in due punti di carico, 5 V e 1.65 V, per l’alimentazione di sensori. Dalla conoscenza dell’autore della letteratura e del mercato, questo è il primo convertitore DC/DC senza induttore in grado di convertire un range di ingresso così ampio. Questo ampio range è gestito usando un’architettura multi-stadio con stadi a condensatori commutati riconfigurabili e MOSFETs ad alta tensione. In risposta ai pressanti requisiti per la gestione dell’errore in sistemi critici, un’innovativa e integrabile tecnica tollerante ai faults è proposta in questa tesi. Il convertitore è stato realizzato in un chip 6*6 mm^2, e in risposta alla crescente richiesta di sempre maggiore integrazione, la campagna di misura del convertitore DC/DC si è focalizzata sul confronto tra le prestazioni ottenute da una classica configurazione 2D, con i passivi situati a lato del chip, ed un’innovativa struttura 3D, con condensatori in silicio impilati sopra il chip. Le misure elettriche hanno mostrato la fattibilità dell’utilizzo della struttura 3D al fine di ridurre l’area occupata, mantenendo quasi le stesse prestazioni della configurazione 2D. Per la verifica della compatibilità con l’ambiente spaziale del IC progettato, il convertitore è stato esposto a test di radiazione di dose accumulata e di ioni pesanti, evidenziando la possibilità di un suo impiego per viaggi Terra-Luna. Data la sempre crescente richiesta di sistemi compatti, l’interazione elettromagnetica tra dispositivi differenti è una delle maggiori sfide nell’odierna progettazione elettronica. Essendo il convertitore DC/DC switching uno dei principali generatori di disturbi elettromagnetici, alcune tecniche per mitigare la generazione di questi disturbi sono state adottate in questa tesi, al livello di progettazione del chip. In particolare, tecniche come l’adozione di un filtro d’ingresso e il soft-start sono state implementate per ridurre le interferenze condotte, mentre tecniche come una bassa frequenza di switching, un’architettura senza induttore e l’allargamento dello spettro sono state usate per la mitigazione delle interferenze irradiate. Sul fronte radiazioni, gli esperimenti ad alta energia, usati nella fisica particellare per la verifica di nuove teorie, sono caratterizzati da livelli di radiazione quasi tre ordini di grandezza superi rispetto alle applicazioni spaziali standard. Queste estreme condizioni stressano pesantemente le prestazioni dei dispositivi elettronici dello stato dell’arte usati per la rilevazione delle particelle. Per garantire la corretta operazione dei ICs operanti in questo ambiente, in questa tesi sono state sviluppate alcune tecniche Radiation Hardened By Design (RHBD) per la mitigazione degli effetti sui ICs dovuti alle radiazioni, come la logica current-mode, una lunghezza dei MOSFETs doppia e l’enclosed layout dei transistors. Queste tecniche RHBD sono state utilizzate per la progettazione di drivers per modulatori elettro-ottici ad elevata velocità in tecnologia CMOS 65 nm. I driver multistadio, in aggiunta alle soluzioni per fronteggiare le radiazioni, implementano tecniche di buffer chain e inductive peaking per l’estensione della banda. I driver, realizzati in un chip 1*1 mm^2, sono stati connessi direttamente su una board e testati elettricamente, mostrando buone prestazioni fino a 5 Gbps. I modulatori elettro-ottici usati in questo lavoro sono il modulatore Mach Zehnder ed il Ring Resonator realizzati in tecnologia silicon-photonic, i quali hanno mostrato maggiori proprietà di resistenza alle radiazioni rispetto ai classici VCSEL (Vertical Cavity Surface Emitting Lasers). I test a livello di sistema, eseguiti connettendo il chip in silicio dei drivers ed il chip in silicon-photonics dei modulatori attraverso bonds in alluminio, confermano il raggiungimento di una velocità di trasmissione di 5 Gbps. In risposta al requisito di tolleranza alle radiazioni, il chip dei drivers è stato esposto a raggi X, mostrando la sua abilità ad operare fino a 800 Mrad, livello di radiazione che oggi nessun altro dispositivo elettronico presente in letteratura o industria è in grado di raggiungere.

Published
2020
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31. Testing of DC/DC converters for 48 V electric vehicles

Author

Sisto, Arcangelo, Saponara, Sergio, Ciarpi, Gabriele, Iacopetti, Fabrizio, and Fanucci, Luca

Subjects
Measurement systems, Automotive electronics, Electric/hybrid vehicles, Instrumentation, Industrial and Manufacturing Engineering
Published
2017

32. Integrated Passive Devices and Switching Circuit Design for a 3D DC/DC Converter up to 60 V.

Author

Saponara, Sergio, Ciarpi, Gabriele, Erlbacher, Tobias, and Rattmann, Gudrun

Subjects
*SWITCHING circuits, *PASSIVE components, *DC-to-DC converters, *THROUGH-silicon via, *HYBRID electric vehicles, *ELECTRIC lines, *ELECTRIC current converters
Abstract

This work presents the design and test of a switched-cap 3D DC/DC converter able to work up to 60 V. The switches and the control circuits are integrated single-chip in a high-voltage (HV) MOS technology, and the passive devices are stacked on top of the chip. As an innovation versus the state-of-the-art, the work first presents the design of integrated passive devices, based on through silicon vias (TSV) MOS-compatible technology, which are suitable for switching converter applications up to 60 V. Then, the implementation and experimental characterization of the switched-cap 3D DC/DC is proposed, with the silicon TSV capacitors stacked on top of the 0.35 μ m HV-MOS die. Compared with the state-of-the-art, the proposed 3D DC/DC converter is a compact circuit, able to directly regulate a wide input voltage range (from 6 V to 60 V) to a 5 V, 2 W output. Hence, it is suitable to supply low-power loads, such as control units and/or sensors, directly from the 48 V power line available in hybrid vehicles or telecom and networking systems. [ABSTRACT FROM AUTHOR]

Published
2020
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