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77 results on '"Circuit printing -- Equipment and supplies"'

1. Integrating compact printed antennas onto small diversity/MIMO terminals

Author

Karaboikis, Manos P., Papamichael, Vasileios C., Tsachtsiris, George F., Soras, Constantine F., and Makios, Vasileios T.

Subjects
Antennas (Electronics) -- Design and construction, MIMO communications -- Equipment and supplies, Circuit printing -- Equipment and supplies, Printed circuits -- Equipment and supplies, Circuit design -- Evaluation, Printed circuit board, Circuit designer, Integrated circuit design, Business, Computers, Electronics, Electronics and electrical industries
Abstract

The integration of compact printed multielement antenna (MEA) systems on small diversity and multiple input multiple output (MIMO) terminal devices operating in the 5.2 GHz Industrial, Scientific and Medical (ISM) band is presented. The investigated MEA systems comprise up to six printed elements (inverted F and Minkowski monopole antennas) and their performance is evaluated by means of the effective diversity gain (EDG) and the 1% outage MIMO capacity. The role of the propagation environment (both outdoor and indoor) on EDG is examined, proving that the uniform scenario is a good approximation to many real environments. The tradeoff study between system's performance and number of integrated antenna elements indicates that both diversity and MIMO performance saturate when placing more than five closely spaced elements. Even the least efficient 6-element system however, can be advantageously used as a reconfigurable 2-element array under the concept of receive antenna selection, since it provides significantly improved MIMO performance over a conventional 2-element fixed one. The paper concludes with a summary of useful guidelines for the MEA design optimization procedure that emanated from this study. Index Terms--Antenna diversity, antenna selection, diversity gain, multiple input multiple output (MIMO) capacity, monopole antennas, printed circuit antennas.

Published
2008

2. Direct-referencing two-dimensional-array digital microfluidics using multilayer printed circuit board

Author

Gong, Jian and Kim, Chang-Jin

Subjects
Circuit printing -- Equipment and supplies, Printed circuits -- Equipment and supplies, Embedded systems -- Design and construction, Fluidic devices -- Design and construction, Microelectromechanical systems -- Research, Printed circuit board, Embedded system, System on a chip, Engineering and manufacturing industries, Science and technology
Abstract

Digital (i.e., droplet-based) microfluidics, by the electrowetting-on-dielectric (EWOD) mechanism, has shown great potential for a wide range of applications, such as lab-on-a-chip. While most reported EWOD chips use a series of electrode pads essentially in 1-D line pattern designed for specific tasks, the desired universal chips allowing user-reconfigurable paths would require the electrode pads in 2-D pattern. However, to electrically access the electrode pads independently, conductive lines need to be fabricated underneath the pads in multiple layers, raising a cost issue particularly for disposable chip applications. In this paper, we report the building of digital microfluidic plates based on a printed circuit board (PCB), in which multilayer electrical access lines were created inexpensively using the mature PCB technology. However, due to its surface topography and roughness and resulting high resistance against droplet movement, the as-fabricated PCB surfaces require high (~500 V) voltages unless coated with or immersed in oil. Our goal is the EWOD operations of droplets not only on oil-covered surfaces but also on dry ones. To meet the varying levels of performances, three types of gradually complex post-PCB microfabrication process are developed and evaluated. By introducing land-grid-array sockets in the packaging, a scalable digital microfluidic system with a reconfigurable and low-cost chip is also demonstrated. [2007-0049] Index Terms--Electrowetting, electrowetting on dielectric (EWOD), lab-on-a-chip, microfluidics, micro total analysis system, printed circuit board (PCB).

Published
2008

3. Reliability of BGA and CSP on metal-backed printed circuit boards in harsh environments

Author

Lall, Pradeep, Islam, Nokibul, Evans, John, and Suhling, Jeff

Subjects
Circuit printing -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic packaging -- Research, Reliability (Engineering) -- Evaluation, Circuit components -- Properties, Printed circuit board, Semiconductor device, Electronics
Abstract

Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. Increased shock, vibration, and higher temperatures necessitate the fundamental understanding of damage mechanisms, which will be active in these environments. Electronics typical of office benign environments uses FR-4 printed circuit boards (PCBs). Automotive applications typically use high glass-transition temperature laminates such as FR4-06 glass/epoxy laminate material ([T.sub.g] = 164.9[degrees]C). In application environments, metal backing of printed circuit boards is being targeted for thermal dissipation, mechanical stability, and interconnections reliability. In this study, the effect of metal-backed boards on the interconnect reliability has been evaluated. Previous studies on electronic reliability for automotive environments have addressed the damage mechanics of solder joints in plastic ball-grid arrays on non-metal-backed substrates (Lall et al., 2003, 'Model for BGA and CSP in Automotive Underhood Environments,' Electronic Components and Technology Conference, New Orleans, LA, May 27-30, pp. 189196; Syed, A. R., 1996, 'Thermal Fatigue Reliability Enhancement of Plastic Ball Grid Array (PBGA) Packages,' Proceedings of the 1996 Electronic Components and Technology Conference, Orlando, FL, May 28-31, pp. 1211-1216; Evans et al., 1997, 'PBGA Reliability for Under-the-Hood Automotive Applications,' Proceedings of InterPACK '97, Kohala, HI, Jun. 15-19, pp. 215-219; Mawer et al., 1999, 'Board-Level Characterization of 1.0 and 1.27 mm Pitch PBGA for Automotive Under-Hood Applications,' Proceedings of the 1999 Electronic Components and Technology Conference, San Diego, CA, Jun. 1-4, pp. 118-124) and ceramic ball-grid arrays (BGAs) on non-metal-backed substrates (Darveaux, R., and Banerji, K., 1992, 'Constitutive Relations for Tin-Based Solder Joints,' IEEE Trans-CPMT-A, Vol. 15, No. 6, pp. 1013-1024; Darveaux et al., 1995, 'Reliability of Plastic Ball Grid Array Assembly,' Ball Grid Array Technology, Lau, J., ed., McGraw-Hill, New York, pp. 379-442; Darveaux, R., 2000, 'Effect of Simulation Methodology on Solder Joint Crack Growth Correlation,' Proceedings of 50th ECTC, May, pp. 1048-1058). Delamination of PCBs from metal backing has also been investigated. The test vehicle is a metal-backed FR4-06 laminate. The printed circuit board has an aluminum metal backing, attached with pressure sensitive adhesive (PSA). Component architectures tested include plastic ball-grid array devices, C2BGA devices, QFN, and discrete resistors. Reliability of the component architectures has been evaluated for HASL. Crack propagation and intermetallic thickness data have been acquired as a function of cycle count. Reliability data have been acquired on all these architectures. Material constitutive behavior of PSA has been measured using uniaxial test samples. The measured constitutive behavior has been incorporated into nonlinear finite element simulations. Predictive models have been developed for the dominant failure mechanisms for all the component architectures tested. [DOI: 10.1115/1.2804086]

Published
2007

4. Design and performance investigation of a dual-element PIFA array at 2.5 GHz for MIMO terminal

Author

Gao, Yue, Chen, Xiaodong, Ying, Zhinong, and Parini, Clive

Subjects
Antenna arrays -- Design and construction, MIMO communications -- Research, Circuit printing -- Equipment and supplies, Printed circuits -- Equipment and supplies, Printed circuit board, Business, Computers, Electronics, Electronics and electrical industries
Abstract

A study is described of a modified planar inverted-F antenna (PIFA) operating in 2.5 GHz band on a printed circuit board (PCB) of a mobile phone handset. The antenna dimension is reduced substantially with a miniature ground plane and capacitive loading. While inheriting the attractive features of PIFAs, such as low profile, easy fabrication and low cost, the proposed antenna exhibits low coupling to the PCB. A dual-element PIFA array is implemented on a mobile handset PCB and the diversity performance of the dual-element PIFA array is evaluated in both simulation and measurement. Index Terms--Diversity gain, multiple input multiple output (MIMO), mutual coupling, planar inverted-F antenna (PIFA).

Published
2007

5. Vertical thermopiles embedded in a polyimide-based flexible printed circuit board

Author

Yousef, Hanna, Hjort, Klas, and Lindeberg, Mikael

Subjects
Circuit printing -- Equipment and supplies, Printed circuits -- Equipment and supplies, Polyimides -- Properties, Thermoelectricity -- Research, Printed circuit board, Engineering and manufacturing industries, Science and technology
Abstract

A fabrication process for vertical thermopiles embedded in a 75-[micro]m-thick polyimide foil has been developed for flexible printed circuit boards (flex PCBs). The vertical connections consist of electrodeposited antimony- and nickel-plated through-hole vias. The plated through-hole vias consist of multiple wires, with a total metal content that is 1% of the total via volume. The via fabrication technique is similar to standard flex PCB wet etch and metallization processes. The main difference is that the foils are pretreated with ion irradiation to induce highly selective vertical etch rates. The thermopiles were characterized by measuring their voltage response to an applied temperature difference across the foil thickness. [2007-0133] Index Terms--Flexible printed circuit boards (flex PCBs), plated through-hole vias, polyimide foils, thermoelectricity.

Published
2007

6. Development of an automatic stencil inspection system using modified hough transform and fuzzy logic

Author

Choi, Kyung-Jin, Lee, Young-Hyun, Moon, Jong-Woo, Park, Chong-Kug, and Harashima, Fumio

Subjects
Transformations (Mathematics) -- Evaluation, Circuit printing -- Equipment and supplies, Printed circuits -- Equipment and supplies, Industrial electronics -- Research, Fuzzy algorithms -- Research, Fuzzy logic -- Research, Fuzzy systems -- Research, Printed circuit board, Fuzzy logic, Business, Computers, Electronics, Electronics and electrical industries
Abstract

In this paper, the authors present a system to inspect metal stencil that is used to print solder paste on pads of surface-mounted device on printed circuit board. The developed inspection system is composed of a moderately precise X--Y robot and a vision system. To correct a position error caused by the X--Y robot, the authors define position error vector and apply modified Hough transform to determine the dominant position error vector. Using this extracted dominant position error vector, the reference image is modified. This transformed reference image is compared with the camera image. Fuzzy logic is utilized to judge the correctness of the holes on the stencil. The input variables are the ratio of the overlapped area of two holes and the distance between the centroid of them. The output variable is the grade of the identity of the hole. These methods are verified by a simulation and applied to the inspection system. Index Terms--Automatic inspection system, fuzzy logic, modified Hough transformation (MHT), stencil (metal mask).

Published
2007

7. Job release policy and printed circuit board assembly

Author

Magazine, Michael J. and Polak, George G.

Subjects
Pick and place robots -- Usage, Circuit printing -- Equipment and supplies, Printed circuits -- Equipment and supplies, Printed circuit board, Business, Engineering and manufacturing industries
Abstract

A pick-and-place machine assembles printed circuit boards from electronic components. Programmed instructions control the storage and retrieval of these components from replaceable feeders. Since component requirements differ among board types, each change of feeders can improve processing time but indicates a machine setup. For the special case in which the jobs are released to the shop floor in a sequence fixed upstream, we show that an optimal setup policy can be determined efficiently by solving a shortest path problem. We then use constraint programming to model the general assembly problem and conclude by investigating a significant extension of this model.

Published
2003

8. Lithography at a wavelength of 193 nm

Author

Rothshchild, M., Forte, A.R., Kunz, R.R., Palmateer, S.C., and Sedlacek, J.H.C.

Subjects
Photolithography -- Research, Microelectronics -- Equipment and supplies, Circuit printing -- Equipment and supplies, Semiconductor preparation -- Equipment and supplies, Excimer lasers -- Usage
Abstract

The trend in microelectronics toward printing features 0.25 [[micro]meter] and below has motivated the development of lithography at the 193-nm wavelength of argon fluoride excimer lasers. This technology is in its early stages, but a picture is emerging of its strengths and limitations. The change in wavelength from 248 to 193 nm requires parallel progress in projection systems, optical materials, and photoresist chemistries and processes. This paper reviews the current status of these various topics, as they have been engineered under a multiyear program at MIT Lincoln Laboratory.

Published
1997

9. A fast and flexible circuit board plotter. (Product Feature)

Subjects
Printed circuits -- Equipment and supplies, Electronic components industry -- Management -- Equipment and supplies, Circuit printing -- Equipment and supplies, Business, Electronics and electrical industries, Engineering and manufacturing industries, Telecommunications industry, Company business management, Printed circuit board, Management, Equipment and supplies
Abstract

When employing circuit board plotters for product development the main requirement is for fast, efficient and flexible operation. Consequently, the high costs incurred by the long waiting periods inherent when [...]

Published
2002

10. Reviving the pcb market

Author

Goering, Richard

Subjects
CAE software, Electronic design automation, Printed circuit board, Electronic design automation, Circuit printing -- Equipment and supplies, Printed circuits
Published
2003

11. Rosenathal Manufacturing keeps Business in the Family

Subjects
Company business management, Printed circuit board, Rosenthal Manufacturing Corp. -- Management -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Management -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Northbrook, IL--Rosenthal Manufacturing, a maker of sheeting systems for the PCB industry, is something of a rarity these days, as it remains a family-owned company amid the merger mania in […]

Published
2001

12. Vantico, WestMark Enter California Distribution Agreement

Subjects
Contract agreement, Printed circuit board, WestMark Corp. -- Contracts, Vantico Inc. -- Contracts -- Equipment and supplies, Industrial equipment and supplies industry -- Contracts -- Equipment and supplies, Solder and soldering -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies -- Contracts, Metalworking machinery -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Los Angeles, CA--In a joint release, Vantico Inc. and WestMark Corp. announced that WestMark will assume responsibility for all Northern California sales, service and distribution activities for Vantico's Probimer 77 […]

Published
2001

13. Polyclad, Rexam Sign Global Agreement

Subjects
Contract agreement, Printed circuit board, Rexam Image Products Inc. -- Contracts, Rexam CFP Ltd. -- Contracts, Polyclad Laminates Inc. -- Contracts -- Equipment and supplies, Copper foil -- Equipment and supplies, Composite materials industry -- Contracts -- Equipment and supplies, Printed circuits -- Equipment and supplies, Copper industry -- Contracts -- Equipment and supplies, Electronic components industry -- Equipment and supplies -- Contracts, Circuit printing -- Equipment and supplies
Abstract

Londonderry, NH--Polyclad Laminates Inc., Rexam Image Products Inc. and Rexam CFP Ltd. (Rexam) have signed a global agreement to supply the electronics market with resin coated copper foil for use […]

Published
2001

14. OEM Press Systems, R&D Circuits Sign Deal

Subjects
Contract agreement, Printed circuit board, R and D Circuits -- Contracts, OEM Press Systems Inc. -- Contracts -- Equipment and supplies, Industrial equipment and supplies industry -- Contracts -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Contracts -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Orange, CA--OEM Press Systems Inc. is designing and manufacturing a specialty high-temperature press system for R&D Circuits (Edison, NJ). The OEM lamination press system will give R&D Circuits the capacity […]

Published
2001

15. Pentium III drives dual Ultra 3 SCSI

Subjects
Printed circuit board, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Pentium III drives dual Ultra 3 SCSI and dual Ethernet controllers on Trenton Technology's new ULE single-board computer. The ULE is ideal for routers or redundant network embedded file servers. […]

Published
2001

16. New Material: Driven by Necessity

Author

FEINBERG, DAN

Subjects
Printed circuit board, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Most of the revolutionary new material research over the last decade has been driven by HDI processes needs. Yes, there has been much evolutionary material development, such as improved solder […]

Published
2001

17. In Brief

Subjects
Aegis Industrial Software Corp. -- Buildings and facilities -- Human resource management -- Contracts -- Equipment and supplies -- Names, Waterfall Technologies -- Contracts, Global Stencil -- Names, Global Stencil Inc. -- Names -- Human resource management -- Contracts -- Equipment and supplies -- Buildings and facilities, Automated Learning Corp. -- Contracts, Computer software industry -- Buildings and facilities -- Contracts -- Human resource management -- Equipment and supplies, Software -- Equipment and supplies, Distance education -- Equipment and supplies, Printed circuits -- Equipment and supplies, Educational services industry -- Contracts -- Equipment and supplies -- Human resource management -- Buildings and facilities, Electronic components industry -- Human resource management -- Contracts -- Equipment and supplies -- Buildings and facilities, Circuit printing -- Equipment and supplies, Software quality, Contract agreement, Printed circuit board, Company personnel management, Business, Electronics and electrical industries, Engineering and manufacturing industries
Abstract

Automated Learning Corp. (Ottawa, Ontario, Canada) has announced an alliance to enable Waterfall Technologies (Toronto, Ontario, Canada), an international technical training provider, to resell Automated Learning Corp.'s e-Learning courseware. As [...]

Published
2001

18. Caledon Controls to Represent Excellon

Subjects
Company marketing practices, Printed circuit board, Microcomputer industry, Computer industry, Excellon Automation Co. -- Marketing -- Equipment and supplies, Caledon Controls Ltd. -- Marketing, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Computer industry -- Marketing -- Equipment and supplies, Circuit printing -- Equipment and supplies, Control equipment industry -- Marketing -- Equipment and supplies
Abstract

Torrance, CA--Caledon Controls Ltd. will represent Excellon Automation for machine sales in Canada. Caledon Controls was founded in 1990 and has been solely dedicated to the PCB industry since […]

Published
2001

19. Eidschun Sells System to Volunteer Circuits

Subjects
Contract agreement, Printed circuit board, Volunteer Circuits -- Equipment and supplies, Eidschun Engineering Inc. -- Contracts -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies -- Contracts, Circuit printing -- Equipment and supplies
Abstract

Clearwater, FL--Eidschun Engineering Inc. announced that Volunteer Circuits (Bells, TN) chose to conveyorize its solder strip operation with the purchase of an Eidschun/ASI 9025 solder strip system. For more complete […]

Published
2001

20. Orbotech Receives Order from Nan Ya, Selected by American Standard

Subjects
Contract agreement, Printed circuit board, Nanya PCB Corp. -- Equipment and supplies, American Standard Circuits Inc. -- Equipment and supplies, Orbotech Ltd. -- Contracts -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Contracts -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Yavne, Israel--Orbotech Ltd. received a repeat order from Nanya PCB Corp., Intel's 2000 Preferred Quality Supplier, for additional ICP-8060™ automated inspection systems. The systems do final inspection of integrated circuit […]

Published
2001

21. Mania Releases Latest Sales

Subjects
Contract agreement, Printed circuit board, Viasystems -- Equipment and supplies -- Contracts, Mania Technologie USA Inc. -- Contracts -- Equipment and supplies, Testing equipment -- Contracts -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies -- Contracts, Circuit printing -- Equipment and supplies
Abstract

Santa Clara, CA--Mania Technologie (USA) Inc. announced that an MPP 43256 Mega Cube large-grid double-density test system was sold to Viasystems (Point Claire, Quebec, Canada); a Probot Omega eight-probe flying […]

Published
2001

22. Gould Continues Consolidation of Distribution

Subjects
Company marketing practices, Printed circuit board, Gould Electronics Inc. -- Marketing -- Equipment and supplies, Insulectro Corp. -- Marketing -- Equipment and supplies, Copper foil -- Equipment and supplies, Copper industry -- Marketing -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Eastlake, OH--Gould Electronics' wholly owned subsidiary, JJA, awarded exclusive eastern U.S. sales representation and product distribution responsibilities for GAG (copper-aluminum-copper) foil and related products to Insulectro (Lake Forest, CA). Insulector […]

Published
2001

23. TTI Sells Test System

Subjects
Printed circuit board, Test Technology International -- Equipment and supplies, Advanced Circuits Inc. -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Carson City NV--Test Technology International Inc. announced that Advanced Circuit Services (Scarborough, Canada) recently purchased a TTI Model 6000 100-mil, 19.2' x 16.0' universal grid bare board test […]

Published
2001

24. AOI vs. AFI

Author

YANUKA, MOTI and PINHASSI, YOSSI

Subjects
Printed circuit board, Printed circuits -- Equipment and supplies, Optical instruments industry -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

IN PCB DEFECT DETECTION This article addresses the major differences between Automatic Optical Inspection (AOI) and Automatic Final Inspection (AFI). AOI is currently used in several stages of the PCB […]

Published
2001

25. Non-FR-4 Materals

Author

DUPRIEST, DON

Subjects
Printed circuit board, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

MATERIALS WITH ENHANCED THERMAL PROPERTIES Modern ML-PWBs often operate at elevated temperatures due to the heat output from seim-conductor devices. When the system is turned off, the board sees a […]

Published
2001

26. Circuit World Invests $2.6 Million in New Technology, Signs $8M Supply Agreement

Subjects
Contract agreement, Printed circuit board, Excellon Automation Co. -- Contracts -- Equipment and supplies, Circuit World Corp. -- Contracts -- Equipment and supplies, Printed circuits -- Equipment and supplies, Machinery industry -- Contracts -- Equipment and supplies, Electronic components industry -- Equipment and supplies -- Contracts, Metalworking machinery -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Toronto, Canada--Circuit World Corp. took delivery of two additional six-head micro drilling systems and one high precision routing machine from Excellon Automation (Torrance, CA). The new drilling systems, in conjunction […]

Published
2001

27. PPG, Nan Ya to Build Chinese Fiber Glass Plant

Subjects
Printed circuit board, Nan Ya Plastics Corp. -- Buildings and facilities -- Equipment and supplies, PPG Industries Inc. -- Buildings and facilities -- Equipment and supplies, Printed circuits -- Equipment and supplies, Glass fibers -- Equipment and supplies, Electronic components industry -- Equipment and supplies -- Buildings and facilities, Synthetic fibers industry -- Buildings and facilities -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Shanghai, China--PPG Industries (NYSE:PPG) and Nan Ya Plastics Corp. plan to build a plant at Kunshan, in mainland China, to make fiber glass yarns primarily for electronics customers for use […]

Published
2001

28. Camtek Announces $3.5 Million in Orders

Subjects
Contract agreement, Printed circuit board, Camtek Ltd. -- Contracts -- Equipment and supplies, Toppan Electronics Inc. -- Equipment and supplies -- Contracts, Petasys -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Contracts -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Migdal Ha'emek, Israel--Camtek Ltd. (Nasdaq: CAMT) announced the receipt of orders totaling approximately $3.5 million from Petasys, Korea and Toppan Electronics Inc. Petasys placed a repeat order for multiple Orion-604 […]

Published
2001

29. Christopher Associates to Distribute Metronelec Line in U.S

Subjects
Company marketing practices, Printed circuit board, Christopher Associates Inc. -- Marketing -- Equipment and supplies, Metronelec S.A. -- Marketing, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Analytical instruments -- Equipment and supplies, Instrument industry -- Marketing -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Le Pecq, France--Metronelec S.A. appointed Christopher Associates Inc. (Santa Ana, CA) as distributor in North America for its range of solderability testers and related equipment. Other Metronelec products to be […]

Published
2001

30. ASI Posts Equipment Sales

Subjects
Contract agreement, Printed circuit board, Printed Circuits of America -- Equipment and supplies, ASI -- Contracts, TTM Pacific Circuits -- Equipment and supplies, Quick Turn Circuits -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies -- Contracts, Circuit printing -- Equipment and supplies
Abstract

Clearwater, FL--ASI announced sales of various equipment systems. Quick Turn Circuits (Salt Lake City, UT) ordered two ASI TT24 Systems for Primary Image and LPI Soldermask Development. Printed Circuits of […]

Published
2001

31. Eidschun Reveals New Equipment Sales

Subjects
Contract agreement, Printed circuit board, Eidschun Engineering Inc. -- Contracts -- Equipment and supplies, AIT -- Contracts -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies -- Contracts, Circuit printing -- Equipment and supplies
Abstract

Clearwater, FL--Eidschun Engineering Inc. announced that AIT (Manteca, CA) purchased an E3000 Discrete Parts Processor for coating IC packages. The E3000 processor employs a continuous porous conveyor to transport material, […]

Published
2001

32. Kyocera Inks Merger Agreement with Tycom

Subjects
Company business management, Company acquisition/merger, Printed circuit board, Kyocera Corp. -- Management -- Equipment and supplies -- Mergers, acquisitions and divestments, Kyocera International Inc. -- Mergers, acquisitions and divestments -- Equipment and supplies -- Management, Kyocera Tycom Corp. -- Mergers, acquisitions and divestments -- Equipment and supplies -- Management, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies -- Mergers, acquisitions and divestments, Tool industry -- Mergers, acquisitions and divestments -- Equipment and supplies, Instrument industry -- Mergers, acquisitions and divestments -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

San Diego, CA--Kyocera Corp. (NYSE:KYO) announced that its wholly-owned U.S. headquarters, Kyocera International Inc. (KII), has reached a definitive agreement to acquire privately-held Tycom Corp. The acquisition will be effected […]

Published
2001

33. Marconi Selects Valor's Enterprise 3000 System for PCB DFM Verification

Subjects
Software quality, Contract agreement, Printed circuit board, Marconi Company Ltd. -- Equipment and supplies -- Contracts, Valor Computerized Systems NV -- Contracts, Software -- Equipment and supplies, Computer software industry -- Contracts -- Equipment and supplies, Computer-aided design -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Contracts -- Equipment and supplies, Applications software -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Yavne, Israel--Valor Computerized Systems NV announced that the communications division of Marconi has purchased 12 Enterprise 3000 software systems for PCB design-for-manufacturability (DFM) verification. The Enterprise 3000 products will be […]

Published
2001

34. Mask Technology Awarded Patent

Subjects
Printed circuit board, Mask Technology Inc. -- Intellectual property, Printed circuits -- Equipment and supplies, Machinery industry -- Intellectual property -- Equipment and supplies, Electronic components industry -- Equipment and supplies -- Intellectual property, Metalworking machinery -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Santa Ana, CA--Mask Technology Inc. announced they have been awarded a 5th patent associated with their PPT Solid Solder Deposit technology. PPT is a method of forming metal deposits for […]

Published
2001

35. Park/Nelco, EIS-Circuit Supply Division Announce Distributor Agreement

Subjects
Company marketing practices, Printed circuit board, Park Electrochemical Corp. -- Marketing -- Equipment and supplies, EIS Inc. -- Marketing -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Lake Success, NY--Park Electrochemical Corp. (NYSE-PKE) announced the execution of a major U.S. distributor agreement with EIS Inc., Circuit Supply Division. Under this agreement, Park/Nelco has assigned EIS Inc. as […]

Published
2001

36. Vantico, Grimes Enter into Distribution Agreement

Subjects
Company marketing practices, Printed circuit board, Grimes Distribution Inc. -- Marketing, Vantico Inc. -- Marketing -- Equipment and supplies, Specialty chemicals industry -- Marketing -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Specialty chemicals -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Los Angeles, CA--Vantico Inc. (the former Performance Polymers Division of Ciba Specialty Chemicals Inc.) and Grimes Distribution Inc. (GDI) announced that Grimes will assume responsibility for all West Coast sales, […]

Published
2001

37. ASI Posts Equipment Sales

Subjects
Printed circuit board, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Clearwater, FL--Gold Coast Circuits (Riviera Beach, FL) added to its ASI process equipment with the purchase of a new Ninety25 LPI Developer. The Ninety25 system has been redesigned to feature […]

Published
2001

38. SMTC, Alcatel Sign Multi-Year Supply Agreement

Subjects
Contract agreement, Printed circuit board, Newbridge Networks Corp. -- Equipment and supplies -- Contracts, SMTC Corp. -- Contracts -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Contracts -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Toronto, Canada--SMTC Corp. was selected by Alcatel Canada (formerly Newbridge Networks) as the primary manufacturer for a selection of high complexity PCB assemblies. The two companies value this long-term supply […]

Published
2001

39. Dexter Sells Unit to Cookson

Subjects
Vesuvius PLC -- Mergers, acquisitions and divestments -- Equipment and supplies, Dexter Corp. -- Mergers, acquisitions and divestments -- Equipment and supplies, Lead products -- Equipment and supplies, Lead industry -- Mergers, acquisitions and divestments -- Equipment and supplies, Paint -- Equipment and supplies, Printed circuits -- Equipment and supplies, Paint industry -- Mergers, acquisitions and divestments -- Equipment and supplies, Electronic components industry -- Equipment and supplies -- Mergers, acquisitions and divestments, Coatings -- Equipment and supplies, Circuit printing -- Equipment and supplies, Company acquisition/merger, Printed circuit board, Business, Chemicals, plastics and rubber industries
Abstract

DEXTER CORPORATION has sold its printed wiring board business to Cookson Group PLC for $33 million Dexter is a global specialty materials supplier with three operating segments: life sciences, nonwovens [...]

Published
1999

40. Standoffs and spacers

Subjects
Printed circuit board, Printed circuits -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

These printed circuit board utilities are available in aluminum, brass, steel, stainless steel and plastics, with a variety of metal finishes. A large inventory of styles and sizes, as well […]

Published
1999

41. Drivers and material sets: in the first of a regular column, we take a look at the embedded materials landscape

Author

Snogren, Richard

Subjects
Printed circuits -- Design and construction, Printed circuits -- Equipment and supplies, Printed circuits -- Economic aspects, Circuit printing -- Design and construction, Circuit printing -- Equipment and supplies, Circuit printing -- Economic aspects, Electronics engineers -- Personal narratives, Electronic circuits -- Design and construction, Printed circuit board, Business, Business, international, Computers and office automation industries, Engineering and manufacturing industries
Abstract

THIS IS THE first in a series of monthly columns on embedded passives, embedding discrete passive components and functions (primarily resistors and capacitors) directly into the PCB structure. I want [...]

Published
2003

42. New angles on X-ray inspection: X-ray systems can be used in-line to identify errors prior to drilling and electrical test and trimming. (PCB Process Control)

Author

Hadland, Nick

Subjects
Printed circuits -- Equipment and supplies, Circuit printing -- Equipment and supplies, Printed circuit board, Business, Business, international, Computers and office automation industries, Engineering and manufacturing industries
Abstract

Until a few years ago electrical testing and visual inspection were deemed sufficient for quality control of bare-board PCB manufacturing, with x-ray inspection reserved only for inspection of assembled boards. [...]

Published
2003

43. The future of PCB printing? An introduction to ink jet printing: Why ink jet printing could prove revolutionary for the PCB production process

Author

Branthwaite, Giles

Subjects
Printed circuit board, Printed circuits -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

INK JET printing is no longer a technology limited to plastic boxes sitting on your desk that quickly produce cheap color pictures from your computer. The technology, particularly the print-heads, […]

Published
2003

44. When is the right time to buy a laser tool? (Seeing the Light)

Author

Schaeffer, Ronald

Subjects
Printed circuit board, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Everybody has heard that the market is down, and a booming recovery is not near. Furthermore, volume production is moving to Asia. So, what is left for the shops in […]

Published
2002

45. Intel all around

Author

Rice, Valerie

Subjects
Microprocessor, Company marketing practices, Microprocessor upgrade, Motherboard, Microcomputer industry, Printed circuit board, Market entry, Computer industry, Intel Corp. -- Marketing -- Equipment and supplies, Central processing units -- Equipment and supplies, Motherboards -- Marketing -- Equipment and supplies, Microprocessors -- Equipment and supplies, Printed circuits -- Equipment and supplies, Computer industry -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

When they talk about Intel Inside, Intel executives mean it --literally. Want proof? Pop the hood of more than half the Pentium boxes on the market and you'll see an […]

Published
1994

46. Orbotech Releases Additional Details of $18 Million Purchase Agreement for PCB-AOI Equipment; Discovery(TM) Strengthens Its Position as the Best-Selling AOI System in the Industry

Subjects
Printed circuits -- Equipment and supplies, Circuit printing -- Equipment and supplies, Printed circuit board, Business, Business, international
Abstract

YAVNE, Israel -- ORBOTECH LTD. (NASDAQ/NM SYMBOL: ORBK) today released details of the previously announced, largest frame agreement ever with a single electronics manufacturer, for the purchase of multiple automated [...]

Published
2006

47. Circuit acts: the electronic chemicals industry has made bold advances in purity and service, but higher expenses are leading to consolidation

Author

Adam, Peter S.

Subjects
Chemical industry -- Economic aspects, Semiconductor preparation -- Equipment and supplies, Circuit printing -- Equipment and supplies, Advertising, marketing and public relations, Business, Chemicals, plastics and rubber industries
Abstract

The electronic chemicals industry is a highly competitive, technologically demanding field that is undergoing a major transformation. As the US semiconductor industry loses market share, the domestic market for electronic chemicals is shrinking. Electronic manufacturers are also demanding higher purity chemicals and more services, such as process monitoring and chemical recycling, from chemical makers. The competitive pressures have forced several firms out of the electronic chemicals business and prompted others to seek mergers.

Published
1992

48. Kyoden installs new production line in Thailand

Subjects
Printed circuit board, Kyoden Co. -- Equipment and supplies, Printed circuits -- Equipment and supplies, Electronic components industry -- Equipment and supplies, Circuit printing -- Equipment and supplies
Abstract

Japanese Kyoden Co. installed a $5.4 million PCB production line in Thailand. Kyoden's subsidiary Toei Denshi manages the Thai factory where the PCB line was installed. With the new line, […]

Published
2006

49. IMI chooses Coherent laser system

Subjects
Contract agreement, Printed circuit board, IMI Inc. -- Contracts, IMI Inc. -- Equipment and supplies, Laser Advantage LLC -- Contracts, Printed circuits -- Contracts, Printed circuits -- Equipment and supplies, Circuit printing -- Contracts, Circuit printing -- Equipment and supplies, Laser industry -- Contracts
Abstract

Haverhill, MA -- IMI Inc. purchased and installed a Coherent model K150, 150 Watt Class One, Diamond 64[per thousand] sealed C[O.sub.2] laser system from Laser Advantage (Nashua, NH). IMI will […]

Published
2003

50. Intel eyes the telecom business

Author

Alpert, Bill

Subjects
Intel Corp. -- Product development, Circuit printing -- Equipment and supplies, Printed circuits -- Equipment and supplies, Wi-Fi -- Usage, Semiconductor industry -- Product development, Printed circuit board, Semiconductor industry, Banking, finance and accounting industries, Business
Abstract

Intel is planning to put wireless radios in every computer and consumer electronics gadget where PCs and powerful handheld devices would handle data, voice calls and even entertainment programming. Intel will catch up with wireless rivals, by increasing the speed of its WiFi chips from 11 million bits per second to 54 million and hopes to make WiFi a standard feature on PC circuit boards, as WiFi and a longer range wireless technology called WiMax reaches 30 miles.

Published
2003

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