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This study shows that the lower limits for manufacturing add-on costs to convert polysilicon to wafers is in the range of $22 to $26/sq m with the cost about equally divided between the crystal growth and wafering processes. However, the $22 to $26/sq m cost limit should be viewed as an asymptote since it is based on multicharge or continuous growth configurations, solidification rates in excess of 2 Kg/hr, multiblade wafering and a slice plus kerf of .045 cm. It should also be emphasized that the results of this study are based on as-sawn wafers, 100% yields (growth and slicing) and no profit. To the first approximation, the limiting cost factors are crucible material and furnace parts for growth and blade material and slurry for slicing.

To meet the need for low cost silicon sheet material in the ERDA/JPL photovoltaics program, JPL has initiated a wide ranging technology development effort in crystal growth that includes several different technology thrusts. They range in scope from innovative ingot growth and multislice wafering, to shaped growth techniques, substrate-related processes and hot forming techniques. In this paper, some salient observations on materials resulting from these processes are reported. Included are multiblade wafering-induced damage studies, interface morphology studies on the heat exchanger cast silicon, some diffusion length measurements in thin silicon layers on ceramic substrates, and results on the equilibrium structure found in laser zone ribbon growth.