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1. Solid State Detectors and Tracking for Snowmass

6. DC-coupled resistive silicon detectors for 4D tracking

8. Characterisation of 3D trench silicon pixel sensors irradiated at 1 ⋅1017 1 MeV neq cm-2.

9. Beam test results of 25 and 35 μm thick FBK ultra-fast silicon detectors

14. A prototype 4D-tracking demonstrator based on the TimeSPOT developments

20. A 2D imager for X-ray FELs with a 65 nm CMOS readout based on per-pixel signal compression and 10 bit A/D conversion

22. The INFN–FBK “Phase-2” R&D program

25. Beam test results of 25 and 35 $$\mu$$m thick FBK ultra-fast silicon detectors

27. 10 ps timing with highly irradiated 3D trench silicon pixel sensors

28. Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip

33. The second production of RSD (AC-LGAD) at FBK

35. Latest results of the R&D on CMOS MAPS for the Layer0 of the SuperB SVT

36. Advances in the development of pixel detector for the SuperB Silicon Vertex Tracker

37. Scribe–cleave–passivate (SCP) slim edge technology for silicon sensors

39. Performance of CMS 3D silicon pixel detectors before and after irradiation

41. 3D-FBK pixel sensors with CMS readout: First test results

42. The front-end chip of the SuperB SVT detector

43. Recent developments on CMOS MAPS for the SuperB Silicon Vertex Tracker

44. Beam test results for the SuperB-SVT thin striplet detector

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