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A larger space PDP cell with patterned aluminum as the addressing electrode and alumina as the dielectric layer was proposed. The aluminum electrode and the alumina dielectric layer formed on the aluminum electrode were prepared separately by magnetron sputtering and anodic oxidation for plasma display panel. The properties of the aluminum electrode and the alumina dielectric layer were tested and can meet the demand of PDP application. The resistivity of the aluminum electrode is about 5 × 10−8 Ω·m, the voltage withstanding of the alumina dielectric layer exceeds 100 V/μm and the relative permittivity is about 3.5 at 1 MHz. With this structure, the manufacturing cost of PDP could be cut and the addressing discharge formative delay is reduced by 0.67%, which is proved by PIC-MCC simulation.

To control the velocity and one-way flow of fluid in a micro-fluidic system,a novel passive micro-valve was designed base on Micro-electrical-mechanical System(MEMS) technology.By drawing lessons from a human heart valve structure,the deflections and stresses of a valve membrane under different pressures were analyzed with ANSYS by using SU-8 as the passive micro-valve structural materials,then the thickness of the valve membrane was optimized.The valve was fabricated with integrated processing of MEMS technique,so that the process technology for the valve membrane was determined.The performance of the passive valve was tested using deionized water as media and the forward flow velocities obtained are 1.66 ml/min for type A and 1.35 ml/min for type B under a forward pressure of 11.7 kPa.The tested analyzing data indicate that the designed passive valve has the potentiality of linear control,which means that the passive micro-valve made by SU-8 has not only better performance but also better bio-compatibility and can extend the applications of passive micro-valves.

Problem statement: The high aspect-ratio electrodeposition was widely used in the manufacture of non-silicon MEMS devices. The wetting of high aspect-ratio micro-structure in electrolyte was important to the uniformity of micro-structure. Approach: In this study, to enhance the wettability of micro-structures in electrolyte, the effect of Sodium Dodecyl Sulfate (SDS) and O2 plasma surface modification were discussed. Contact Angles (CA) between nickel sulfamate and the micro-structure were investigated to test the effect of two ways mentioned above. We employ the plasma photoresist-removal machine to modify micro-structure made of photoresist and the effects of different modification time were also discussed. The mechanism of O2 plasma treatment was investigated. According to Cassie's law, a new method was proposed to follow the wetting progress of micro-structure. Results: The contact angles between the electrolytes with SDS and smooth photoresist surfaces exposed to O2 plasma surface modification decreased from 90-5.2°) continuously. The maximum SDS concentration was 1g L−1 and the longest modification time was 60s. After 30min’s quiescence, the micro-structure was completely filled by electrolyte, with the size of 50×50×50 µm (width×width×height×). Conclusion/Recommendation: It was possible to promote the wettability by introduction of SDS as wetter and the employment of O2 plasma surface modification. The effect of O2 plasma surface modification could be attributed to the introduction of free and associated hydroxyl.

A novel method for fabricating Cu-based carbon nanofiber (CNF) composite film as contact electrode of MEMS electromagnetic relay is presented in this paper. All the electroplating equipments and electroplating solution including CNFs are all placed in ultrasonic agitation environment during the whole electroplating process to avoid the agglomerating of CNFs on the surface of the MEMS contactor. The tested results shows that CNFs were distributed evenly and few spheric Cu- based CNF particles were discovered. The composition of the electroplating solution is optimized by many experiments. When the concentration of the CNFs is up to the 4g/L, the maximum hardness (208 HV) of Cu-based CNF composite film is achieved with the improvement of 50.9% compared with the one of the pure copper. When the MEMS contactor with Cu-based CNF composite film is applied in an electromagnetic microrelay, the contact resistance is reduced to 200~300m .