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Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities across diverse fields ranging from fundamental science [1] to medicine [2] and environmental science [3] by leveraging advanced semiconductor chips interconnected in vast distributed networks. However, AI chip development has far outpaced that of the networks that connect them, as chip computation speeds have accelerated a thousandfold faster than communication bandwidth over the last two decades [4, 5]. This gap is the largest barrier for scaling AI performance [6, 7] and results from the disproportionately high energy expended to transmit data [8], which is two orders of magnitude more intensive than computing [9]. Here, we show a leveling of this long-standing discrepancy and achieve the lowest energy optical data link to date through dense 3D integration of photonic and electronic chips. At 120 fJ of consumed energy per communicated bit and 5.3 Tb/s bandwidth per square millimeter of chip area, our platform simultaneously achieves a twofold improvement in both energy consumption and bandwidth density relative to prior demonstrations [10, 11]. These improvements are realized through employing massively parallel 80 channel microresonator-based transmitter and receiver arrays operating at 10 Gb/s per channel, occupying a combined chip footprint of only 0.32 mm2. Furthermore, commercial complementary metal-oxide-semiconductor (CMOS) foundries fabricate both the electronic and photonic chips on 300 mm wafers, providing a clear avenue to volume scaling. Through these demonstrated ultra-energy efficient, high bandwidth data communication links, this work eliminates the bandwidth bottleneck between spatially distanced compute nodes and will enable a fundamentally new scale of future AI computing hardware without constraints on data locality.

The exponential growth of computing needs for artificial intelligence and machine learning has had a dramatic impact on data centre energy consumption, which has risen to environmentally significant levels. Using light to send information between compute nodes can dramatically decrease this energy consumption while simultaneously increasing bandwidth. Through wavelength-division multiplexing with chip-based microresonator Kerr frequency combs, independent information channels can be encoded onto many distinct colours of light in the same optical fibre for massively parallel data transmission with low energy. While previous demonstrations have relied on benchtop equipment for filtering and modulating Kerr comb wavelength channels, data centre interconnects require a compact on-chip form factor for these operations. Here, we demonstrate the first integrated silicon photonic transmitter using a Kerr comb source. The demonstrated architecture is scalable to hundreds of wavelength channels, enabling a fundamentally new class of massively parallel terabit-scale optical interconnects for future green hyperscale data centres.