118 results on '"Derakhshandeh, Jaber"'
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2. Chemical mechanical polishing for indium bond pad damascene processing
3. Process Challenges During CVD Oxide Deposition on the Backside of $20-\mu m$ Thin 300-mm Wafers Temporarily Bonded to Glass Carriers
4. Developing TSV wet cleaning chemistry for quantum computing application
5. Thiol-Based Self-Assembled Monolayers (SAMs) as an Alternative Surface Finish for 3D Cu Microbumps
6. Integrating Low-Temperature Carbon Nanotubes as Vertical Interconnects in Si Technology
7. Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects
8. High-ohmic resistors fabricated by PureB layer for silicon drift detectors applications
9. (Digital Presentation) Electrochemical Deposition of Sn-Cu Alloys for Applications in 3D Stacking in Microelectronics Industry
10. Confined IMCs for low temperature and high throughput D2W bonding
11. Fundamental study of IMC grains at low anneal temperature
12. Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
13. Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
14. Electrodeposition of Indium for Low Temperature 3D Stacking
15. Thiol-Based Self-Assembled Monolayers (SAMs) as an Alternative Surface Finish for 3D Cu Microbumps
16. A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps
17. Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
18. Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
19. A Novel Method for Characterization of Ultralow Viscosity NCF Layers Using TCB for 3D Assembly
20. Process development and characterization of 3D multi-die stacking
21. ELD NiB for microbumps passivation and wirebonding
22. Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB
23. A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly
24. A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking
25. 10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
26. Electrochemical Deposition of Sn-Cu Alloys for Applications in 3D Stacking in Microelectronics Industry
27. A Novel Intermetallic Compound Insertion Bonding to Improve Throughput for Sequential 3-D Stacking
28. A Novel Resistance Measurement Methodology for $In~Situ$ UBM/Solder Interfacial Reaction Monitoring
29. Single Grain Si TFTs for RF and 3D ICs
30. Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering
31. Process Complexity and Cost Considerations of Multi-Layer Die Stacks
32. New approach to apply 1,2,3-benzotriazole as a capping layer on UBMs for 3D TCB stacking and investigation of oxidation protection and solder wetting
33. Monolithic 3D Integration of Single-Grain Si TFTs
34. Nano-Scale MOSFET Devices Fabricated Using a Novel Carbon-Nanotube-based Lithography
35. TCB optimization for stacking large thinned dies with 40 and 20 μm pitch microbumps
36. An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking
37. Low Temperature Metal-Free Fabrication of polycrystalline Si and Ge TFTs by PECVD Hydrogenation
38. (Invited) Electrochemical Deposition for Applications in the Semiconductor Industry.
39. Polymer and Bump Planarization for Fine Pitch Micro-Bump Stacking
40. Study on 3D self-aligned assembly using chips with etched edge and SAM for liquid confinement
41. Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders Joints
42. A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks
43. Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatings
44. SAMs (self-assembled monolayers) passivation of cobalt microbumps for 3D stacking of Si chips
45. Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn
46. 3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
47. Die to wafer 3D stacking for below 10um pitch microbumps
48. Liquid mediated direct bonding and bond propagation
49. FORMATION, PROCESSING AND CHARACTERIZATION OF Co-Sn INTERMETALLIC COMPOUNDS FOR POTENTIAL INTEGRATION IN 3D INTERCONNECTS
50. Fine Pitch Rapid Heat Self-Aligned Assembly and Liquid-Mediated Direct Bonding of Si Chips
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