361 results on '"Devarajan, Mutharasu"'
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2. CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED
3. Electroless Ni–B sealing on nanoporous anodic aluminum oxide pattern: deposition and evaluation of its characteristic properties
4. Impact of thermal interface material on luminous flux curve of InGaAlP low-power light-emitting diodes
5. Influence of crosslink density on oil bleed of two-part thermal gap filler
6. Fabrication and thermal transient analysis of Ni-P sealed anodic aluminium oxide for electronic packaging
7. Thermal and hydraulic performance of Al alloy-based 3D printed triangular microchannel heatsink governed by rough walls with graphene and alumina nanofluids as working liquid
8. Enhancement of luminous flux of InGaAlP-based low-power SMD LEDs using substrates with different thermal resistances
9. Investigation of surface and mechanical properties of Anodic Aluminium Oxide (AAO) developed on Al substrate for an electronic package enclosure
10. Effect of hybrid filler ratio and filler particle size on thermal conductivity and oil bleed of polydimethylsiloxane/Al2O3/ZnO liquid thermal filler for microelectronics packaging applications
11. Investigation on effects of solder paste voids on thermal and optical performance of white high-power surface-mounted device LEDs
12. Experimental investigation comparing thermal performance of parallel and counter flow in 3D printed triangular cross section dual microchannel heat sink with rough wall surface
13. Optimization of process parameters of anodic aluminium oxide using an orthogonal array technique for thermal management applications
14. Synthesis and analysis of anodic aluminum oxide-nanopore structure on Al substrates for efficient thermal management in electronic packaging
15. Synthesis and characterization of hexagonal boron nitride coating on polyethylene terephthalate
16. Effects of solder paste on thermal and optical performance of high-power ThinGaN white LED
17. Influence of thermal interface material on thermal performance of InGaAlP thin-film SMD LED mounted on different substrate packages
18. Performance of Cu-Al2O3 thin film as thermal interface material in LED package: thermal transient and optical output analysis
19. Variation of thermal resistance with input current and ambient temperature in low-power SMD LED
20. An investigation on die crack detection using Temperature Sensitive Parameter for high speed LED mass production
21. Controlled High Filler Loading of Functionalized Al2O3-Filled Epoxy Composites for LED Thermal Management
22. Testing and Analysis of Ar Plasma Processed LED at Different Ar Gas Flow Rate and Process Time: Thermal and Surface Verification
23. Influence of extended surface area of heatsink on heat transfer: design and analysis
24. CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED
25. Properties of undoped ZnO and Mg doped ZnO thin films by sol-gel method for optoelectronic applications
26. Investigation on thermal characterization of low power SMD LED mounted on different substrate packages
27. Effects of indium mole fraction on the physical characteristics of magnetron sputtered InxAl1−xN films
28. Post-deposition annealing of magnetron sputtered InAlN film at different temperatures
29. Structural and Optical Properties of Ultra-high Pure Hot Water Processed Ga2O3 Thin Film
30. Impact of severe cracked germanium (111) substrate on aluminum indium gallium phosphate light-emitting-diode’s electro-optical performance
31. Growth of polycrystalline indium aluminum nitride thin films on silicon (111) substrates
32. Thermal and mechanical properties of epoxy composite filled with binary particle system of polygonal aluminum oxide and boron nitride platelets
33. Influence of annealed Cu–Al2O3 thin film on the performance of high power LED: thermal and optical analysis
34. Optical performance of high power LED on silver and nickel thin film coated aluminum substrates using sputtering process
35. Thermo-Mechanical Reworkable Epoxy Underfill in Board-Level Package: Material Characteristics and Reliability Criteria
36. Non-oil bleed thermal gap fillers for long-term reliability of Solid State Drive
37. Influence of Tribo-mechanical Characteristics of Advanced EN Coating for Electronic Packaging Housing
38. Influence of Prepreg Material Properties on Printed Circuit Board (PCB) Stack-up
39. Study on thermal and optical properties of high power infrared emitter by utilizing dual interface method
40. Thermal resistance studies of surface modified heat sink for 3W LED using transient curve
41. Sputtering deposition of aluminium molybdenum alloy thin film anodes for thin film microbatteries
42. Thermal study on high power infrared emitter with different thermal interface materials by utilizing dual interface method
43. Optical Properties and Surface Morphology of Zinc Telluride Thin Films Prepared by Stacked Elemental Layer Method
44. Thermal transient evaluation and optical characterization of packaged light-emitting diodes
45. A novel sealing and high scratch resistant nanorod Ni-P coating on anodic aluminum oxide
46. Impact of ZnO Nanoparticles on Thermal Properties of Poly(3-hydroxybutyrate-co-10 mol % 3-hydroxyhexanoate) Copolymer
47. Synthesis of dispensable PDMS/Al2O3/GO thermal gap filler and performance comparison with commercial thermal gap fillers for electronics packaging applications.
48. Influence of Cu Layer on Structural and Optical Properties of Copper Oxides Prepared as Stacks
49. Electroless Ni–P Deposition on an Al5052 Substrate for Thermal Management Applications
50. Synthesis of dispensable PDMS/Al2O3/GO thermal gap filler and performance comparison with commercial thermal gap fillers for electronics packaging applications
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