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1. Toward Eco-Design of a 5G mmWave Transmitarray Antenna Based on Life Cycle Assessment

5. Metal Bonding in SiC Based Substrates

6. Building blocks for wafer-level 3D integration

7. Advanced Substrates for GaN-Based Power Devices

10. SiC Power Devices on QUASIC and SiCOI Smart-Cut® Substrates: First Demonstrations

14. Wafer Level 3D Stacking Using Smart Cut and Metal-Metal Direct Bonding Technology

21. An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling

22. First integration of Cu TSV using die-to-wafer direct bonding and planarization

23. Enabling 3D interconnects with metal direct bonding

24. System on Wafer: A New Silicon Concept in SiP

25. 3D Integration : a technological toolbox

26. Copper direct bonding for 3D integration

28. Enabling technologies for 3D chip stacking

29. Membrane Microlasers and their Integration

37. Cubic SiC Surface Structure Studied by X-Ray Diffraction

45. QuaSiC Smart-Cut<® Substrates for SiC High Power Devices

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