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Sc0.18Al0.82N/GaN with state-of-the-art x-ray diffraction figures of merit grown by metal modulated epitaxy under metal-rich conditions and a low substrate temperature of 400 °C is demonstrated to have improved crystalline order [250 arc sec for the (0002) reflection and 469 arc sec for the (10 1 ¯ 5)] compared to a previous state-of-the-art sample grown at a more conventional temperature of 650 °C. While both samples show a columnar structure, the higher substrate temperature sample has a good symmetric rocking curve (RC) of 229 arc sec, but unlike the lower temperature sample, the RC of the (10 1 ¯ 5) asymmetric reflection could not be measured, indicating a more columnar structure common among ScAlN films. Local lattice constant maps (LLCMs) from 4D-STEM depict abrupt strain relaxation within ∼2 nm from the ScAlN/GaN interface for the sample grown at Tsub = 400 °C. Since these LLCMs suggest a lattice mismatch in the a-lattice constant, and since the films show a sudden roughening, the composition for lattice match to GaN may be less than the accepted 18%–20% Sc, consistent with the average GaN lattice match from lattice constant values reported in the literature of 12%. Compared to traditional III-Nitrides, ScAlN films have substantially more screw and mixed-type threading dislocations, suggesting substantial shear forces that result in significant twist and distortion leading to orthorhombic diffraction patterns as viewed from plan-view TEM in the Tsub = 650 °C sample. These results offer the possibility of ScAlN integration into low-thermal-budget processes including CMOS but further indicate that structural understanding of ScAlN remains lacking. [ABSTRACT FROM AUTHOR]

The metal-insulator transition of NbO2 is thought to be important for the functioning of recent niobium oxide-based memristor devices, and is often described as a Mott transition in these contexts. However, the actual transition mechanism remains unclear, as current devices actually employ electroformed NbOx that may be inherently different to crystalline NbO2. We report on our synchrotron x-ray spectroscopy and density-functional-theory study of crystalline, epitaxial NbO2 thin films grown by pulsed laser deposition and molecular beam epitaxy across the metal-insulator transition at ∼810°C. The observed spectral changes reveal a second-order Peierls transition driven by a weakening of Nb dimerization without significant electron correlations, further supported by our density-functional-theory modeling. Our findings indicate that employing crystalline NbO2 as an active layer in memristor devices may facilitate analog control of the resistivity, whereby Joule-heating can modulate Nb-Nb dimer distance and consequently control the opening of a pseudogap.

While metal-rich ScAlN epitaxy has traditionally led to mixed phase films by controlling the surface chemistry with transient metal doses utilizing a pulsed method of molecular beam epitaxy, phase-pure, metal-rich epitaxy of ScAlN was demonstrated, showing improved structural and electrical characteristics. The effects of substrate temperature and III/V ratio were studied, and an x-ray diffraction figure of merit and surface roughness as low as 225 arcsec and 0.68 nm, respectively, were demonstrated. A significant catalytic effect is observed with the use of Sc in metal-rich conditions, resulting in varied growth rates with substrate temperature and Sc surface coverage. This catalytic effect results in complications when selecting synthesis conditions and for in situ monitoring and can be accounted for improved phase purity. The variation of growth rates with Sc surface coverage introduces non-linearities to the transient initiation stage of growth but also introduces a feedback stabilization of the surface chemistry. Accounting for these complexities, a Sc0.2Al0.8N high electron mobility transistor (HEMT) heterostructure is demonstrated with a sheet resistance of 152 Ω/□, a mobility of 700 cm2/Vs, and a sheet charge of 5.9 × 1013 cm−2. [ABSTRACT FROM AUTHOR]

Aluminum nitride (AlN) is an insulator that has shown little promise to be converted to a semiconductor via impurity doping. Some of the historic challenges for successfully doping AlN include a reconfigurable defect formation known as a DX center and subsequent compensation that causes an increase in dopant activation energy resulting in very few carriers of electricity, electrons, or holes, rendering doping inefficient. Using crystal synthesis methods that generate less compensating impurities and less lattice expansion, thus impeding the reconfiguration of dopants, and using new dopants, we demonstrate: (a) well behaved bulk semiconducting functionality in AlN, the largest direct bandgap semiconductor known with (b) substantial bulk p-type conduction (holes = 3.1 × 1018 cm−3, as recently reported in our prior work), (c) dramatic improvement in n-type bulk conduction (electrons = 6 × 1018 cm−3, nearly 6000 times the prior state-of-the-art), and (d) a PN AlN diode with a nearly ideal turn-on voltage of ∼6 V for a 6.1 eV bandgap semiconductor. A wide variety of AlN-based applications are enabled that will impact deep ultraviolet light-based viral and bacterial sterilization, polymer curing, lithography, laser machining, high-temperature, high-voltage, and high-power electronics. [ABSTRACT FROM AUTHOR]

The recent achievement of p-type AlN films via Be doping was utilized to achieve novel heteroepitaxial diodes with Schottky, Pin, and junction barrier Schottky (JBS) electrical behavior. Although the heteroepitaxial structures were quasi-vertical, which is subject to many issues lowering the breakdown voltage, the Pin diode achieved a breakdown voltage of ∼25 V for a 200 nm thick unintentionally doped intrinsic layer indicating ∼50% of the theoretical breakdown voltage performance for a similar homoepitaxial GaN pin diode. JBS and Schottky diodes were implemented using the inherent and intentional stress cracking properties of AlN grown on GaN films avoiding regrowth and plasma etching, both known to be technology impediments. The density of the intentional cracks and crystalline quality of the p-AlN films was controlled via Be doping and the total metal dose supplied during the metal modulated epitaxy shutter cycle resulting in differing degrees of grown stress. Since the intentional crack density determines the surface area ratio of the Schottky diode to the Pin diode, it is a key design parameter in optimizing device performance. Furthermore, a novel current spreading layer was implemented to improve the current uniformity in these devices. The high breakdown voltage and good forward voltage characteristics of these devices shows potential to enable high-performance III-nitride high-power devices. [ABSTRACT FROM AUTHOR]

State-of-the-art semiconducting aluminum nitride (AlN) films were characterized by cathodoluminescence (CL) spectroscopy in the range of 200–500 nm in an attempt to identify the energy levels within the bandgap and their associated defects. Near-band edge emission (around 206 nm) and high-intensity peaks centered in the near UV range (around 325 nm) are observed for both n- and p-type AlN films. The near UV peaks are potentially associated with oxygen contamination in the films. The p-type AlN films contain at least two unidentified peaks above 400 nm. Assuming that the dopant concentration is independent of compensation (i.e., in the perfect doping limit), three effective donor states are found from Fermi–Dirac statistics for Si-doped AlN, at ∼0.035, ∼0.05, and ∼0.11 eV. Similarly, a single effective acceptor energy of ∼0.03–0.05 eV (depending on the degeneracy factory considered) was found for Be doped AlN. CL investigation of doped AlN films supports claims that AlN may be a promising optoelectronic material, but also points to contaminant mitigation and defect theory as major areas for future study. [ABSTRACT FROM AUTHOR]

AlGaN self-assembled superlattices (SASLs) and their customization were investigated via metal modulated epitaxy. Using the dynamics of metal accumulation, surface strain, and surface segregation, coherent SASL structures were demonstrated with high repeatability over 910 nm (63 periods) with no growth interrupts at rates as high as 2.8 μm/h. High customizability was shown with control over period thickness as well as the thickness of the individual layers. Factors effecting the thickness and composition of each layer are discussed and methods of customization are presented. Transmission electron microscopy shows abrupt interfaces between individual layers of the SASL and good coherency throughout the structure and strong wavelength tunable ultraviolet photoluminescence was observed. Such a method of SASL fabrication offers promise for the growth of multi-quantum well structures, distributed Bragg reflectors, strain relaxation buffers, and beyond without the need for growth interrupts, and thus unintentional contaminant incorporation, between layers. [ABSTRACT FROM AUTHOR]

A non-traditional, for AlInN, method of controlling adatom kinetics and a low temperature growth condition were employed to improve the quality of high indium content aluminum indium nitride films. Metal-rich surfaces were used to enhance adatom mobility and compensate for the low growth temperature (Tsub ≤ 400 °C) effect of reducing surface diffusion lengths. The metal-rich approach resulted in 12 times lower x-ray diffraction full-width at half-maximum rocking curve figures of merit when compared to literature. In addition to promising photoluminescence emission, these results indicate improved structural quality over other reported approaches. AlInN films with ∼70% indium content were characterized via x-ray diffraction, atomic force microscopy, and photoluminescence spectroscopy with each technique indicating an optimal growth temperature of 350 °C. Al0.3In0.7N grown above 400 °C exhibited phase separation and a reduction in quality, while samples grown colder were predominantly single-phase and displayed improved photoluminescence at ∼1.45 eV. The photoluminescence spectra suggest emission from quantum wire-like structures with dimensions ranging from 15 to 18 nm. These low-temperature, metal-rich findings for high indium content AlInN are promising for future long-wavelength III-nitride optical devices. [ABSTRACT FROM AUTHOR]

GaN p++/n++ tunnel junctions (TJs) with heavy bulk or delta Mg doping at the junction were grown via molecular beam epitaxy with a hysteresis-free and repeatable negative differential resistance (NDR). The TJ with Mg doping of 5.5 × 1020 cm−3 shows NDR at ∼1.8 V and a large current density of 3.4 KA/cm2 at −1.0 V. Atomic resolution scanning transmission electron microscopy imaging showed no additional defects despite the doping exceeding the solubility limit in GaN allowing subsequent epitaxy of series-connected layers and devices. GaN homojunction TJs grown on bulk GaN showed an improved current density and NDR stability. In addition, the effect of Mg delta doping at the junction was investigated for the first time showing a dramatic improvement in the tunneling characteristics. A metal-organic chemical vapor deposition (MOCVD) grown InGaN light-emitting diode (LED) with an MBE grown GaN homojunction tunnel contact to the MOCVD grown p-GaN layer shows superior lateral conductivity and improved luminescence uniformity, but suffers an added voltage penalty, assumed to be due to interface impurities, compared to control LED with indium-tin-oxide. [ABSTRACT FROM AUTHOR]

In this work, radio-frequency (RF) plasma-induced damage to III-nitride surfaces and bulk defects is observed and mitigated. It is shown that for InN films, the surface is more sensitive to plasma-induced damage than GaN films, as observed via atomic force microscopy and reflection high energy electron diffraction. In order to isolate any possible plasma-induced damage, a growth window for InN is established, and temperature ranges are determined for other damaging effects which include roughening due to low adatom mobility, InN decomposition, and indium desorption. In situ plasma monitoring and optimization are accomplished with a combination of optical emission spectroscopy as well as a remote Langmuir probe. It is shown that by increasing the plasma nitrogen flow, the positive ion content increases; however, the ion acceleration potential reduces. Additionally, a reduced RF plasma power results in a reduction of atomic nitrogen species. These plasma species and energetic variations result in variations in the bulk unintentional background electron concentrations observed by room temperature Hall effect measurements of ∼1 μm thick InN films. By increasing the nitrogen flow from 2.5 to 7.5 sccm for a constant RF power of 350 W, the background electron concentration decreases by 74% from 1.36 × 1019 cm−3 to 3.54 × 1018 cm−3, while maintaining a smooth surface morphology. Additionally, photoluminescence spectra indicate optical emission energies shift from ∼0.81 to 0.71 eV (closer to the fundamental bandgap of InN) by limiting the damaging plasma species. Finally, conditions are presented to further minimize plasma-induced damage in III-nitride devices. [ABSTRACT FROM AUTHOR]

The structural quality of indium-rich Al0.3In0.7N grown by metal modulated epitaxy (MME), previously demonstrating x-ray diffraction (XRD) figures of merit ∼11 times better than the previous literature is investigated to explain the origin of such a large quality improvement. Four-dimensional scanning transmission electron microscope was used to map the lattice parameter near the AlInN/GaN heterojunction and indicate a 5.4% lattice constant change, suggesting 75% relaxation within ∼2 nm from the interface. Cross-sectional TEM Moiré fringes are observed at the AlInN/GaN heterointerface, indicating that there are misfit dislocations between AlInN and GaN which, while rare, have been observed for other highly mismatched In-rich III-Nitrides. The TEM measurements show regions of contrast indicating larger scale variations in strain, but defect contrast associated with dislocations and/or intrinsic basal stacking faults was minimal, indicating a good quality AlInN film and confirming prior XRD results. Significant electron beam induced damage can occur and depended strongly on operational conditions. The damage threshold current density was estimated using time-dependent TEM to be ∼5.7 A/cm2, significantly lower than from prior studies of InGaN. Damage also strongly depends on the thickness of the TEM foil examined and occurred at thicknesses greater than found for InGaN. The present study suggests that the MME technique is an excellent candidate for growing high-quality indium-rich AlInN films as compared to the traditional molecular beam epitaxy or metal organic chemical vapor deposition techniques. [ABSTRACT FROM AUTHOR]

The growth of BiFe[O.sub.3] is demonstrated on many oxide and wide bandgap semiconductor substrates by using reactive molecular beam epitaxy in an adsorption-controlled growth regime. The epitaxial integration of the ferroelectric with the highest polarization, BiFe[O.sub.3], with high bandgap semiconductors is an vital step toward novel field-effect devices.