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435 results on '"Duane S. Boning"'

1. Modern Trends in Microelectronics Packaging Reliability Testing

Author

Emmanuel Bender, Joseph B. Bernstein, and Duane S. Boning

Subjects
packaging reliability, solder ball failure, fan-out packaging, silicon interconnect fabric, reliability prediction, Mechanical engineering and machinery, TJ1-1570
Abstract

In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes.

Published
2024
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10. Variational Quantum Pulse Learning.

Author

Zhiding Liang, Hanrui Wang 0002, Jinglei Cheng, Yongshan Ding 0001, Hang Ren, Zhengqi Gao, Zhirui Hu, Duane S. Boning, Xuehai Qian, Song Han 0003, Weiwen Jiang, and Yiyu Shi 0001

Published
2022
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28. Multi-Stage Influence Function.

Author

Hongge Chen, Si Si, Yang Li 0058, Ciprian Chelba, Sanjiv Kumar, Duane S. Boning, and Cho-Jui Hsieh

Published
2020

38. One Class Process Anomaly Detection Using Kernel Density Estimation Methods

Author

Christopher I. Lang, Fan-Keng Sun, Bruce Lawler, Jack Dillon, Ash Al Dujaili, John Ruth, Peter Cardillo, Perry Alfred, Alan Bowers, Adrian Mckiernan, and Duane S. Boning

Subjects
Electrical and Electronic Engineering, Condensed Matter Physics, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials
Published
2022
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50. Variation-Aware Methods and Models for Silicon Photonic Design-for-Manufacturability

Author

Sally I. El-Henawy, Zhengxing Zhang, and Duane S. Boning

Subjects
Resonator, Silicon photonics, Computer science, business.industry, Component (UML), Photonic integrated circuit, Process (computing), Electronic engineering, Integrated circuit design, Photonics, business, Atomic and Molecular Physics, and Optics, Design for manufacturability
Abstract

Methods for the generation and application of process variation-aware compact models for silicon photonics are presented. Three categories of process variations are considered. First, systematic variations, including die-to-die and spatial variations, are addressed with parameterized variation-aware compact models, and demonstrated for coupled resonator optical waveguide variation impact and yield analysis. Second, methods for random variation are presented, with ensemble and adjoint-based variation modeling methods. Third, particle defects are addressed with an extension to adjoint methods, enabling efficient analysis and identification of photonic component areas that are sensitive to defects. Finally, methods for extraction of variation models using variation test chip design and measurement are presented. Together, these methods are key components toward design-for-manufacturability approaches to achieve high yield and high performance in photonic integrated circuit design.

Published
2022
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