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Summary: This paper presents the investigations of crosstalk effects in ternary logic‐based coupled interconnects. The crosstalk analysis is investigated for coupled copper interconnects and copper‐multilayer graphene (Cu‐MLG) interconnects. In Cu‐MLG interconnects, the Cu interconnect is enclosed with MLG barrier and standard ternary inverter is used to drive the interconnect. Based on the industry standard HSPICE simulation results, the crosstalk effects such as noise peak and delay are lower compared with conventional Cu interconnects. Moreover, the Cu‐MLG interconnects show reduced power dissipation, power delay product (PDP), and energy delay product (EDP) over the Cu interconnects. From the simulation results, it is observed that the Cu‐MLG interconnects provides the performance improvements up to 30.67% compared with the Cu interconnects. Thus, the Cu‐MLG interconnects are more compatible for ternary logic integrated circuits compared with traditional Cu interconnects. [ABSTRACT FROM AUTHOR]

Multi-walled carbon nanotube (MWCNT) bundles have potentially provided attractive solutions in current nanoscale VLSI interconnects. From fabrication point of view, it is difficult to control the growth of a densely packed bundle having MWCNTs with similar diameters. A realistic bundle is combination of MWCNTs with different number of shells. Thus, this research work focuses on the analytical model of a bundle having the MWCNTs with different number of shells or in turn different diameters [mixed MWCNT bundle (MMB)]. Based on the multi-conductor transmission line theory, an equivalent single conductor (ESC) model is employed for the proposed MMB arrangements. The ESC model of MMB is used to compare the dynamic crosstalk delay with conventionally arranged bundle containing MWCNTs with similar diameters [MWCNT bundle (MB)] under different input transition time and spacing conditions. It is observed that a realistic MMB correctly estimates the crosstalk delay for the different transition time that overestimates the delay of a conventionally arranged MB by 1.35 times. Moreover, the MMB arrangement reduces the overall crosstalk delay by 47.26% compared with the conventional MB arrangements for an inter-bundle spacing ranging from 5 to 30 nm.