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604 results on '"Eric Beyne"'

1. Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Jet Impingement

Author

Georg Elsinger, Herman Oprins, Vladimir Cherman, Geert Van der Plas, Eric Beyne, and Ingrid De Wolf

Subjects
liquid jet impingement cooling, computational fluid dynamics, conjugated heat transfer, Thermodynamics, QC310.15-319, Descriptive and experimental mechanics, QC120-168.85
Abstract

With ever increasing integration density of electronic components, the demand for cooling solutions capable of removing the heat generated by such systems grows along with it. It has been shown that a viable answer to this demand is the use of direct liquid jet impingement. While this method can generally be scaled to the cooling of large areas, this is restricted by the necessity of coolant flow rate scaling. In this study, the benefits and restrictions of using increased nozzle pitch to remedy the increasing demand for overall flow rate are investigated. To this end, a model is validated against experimental findings and then used for computational fluid dynamics simulations, exploring effects of the pitch change for micro-scale nozzle diameters and nozzle-to-target spacings. It is found that while this method is efficient in adjusting the tradeoff between total coolant flow rate and pressure drop up to a certain pint, the occurrence of a hydraulic jump in the cavity causes a deterioration of its effect for large nozzle pitches.

Published
2024
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2. Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels

Author

Tiwei Wei, Herman Oprins, Vladimir Cherman, Eric Beyne, and Martine Baelmans

Subjects
microjet cooling, high power, computational fluid dynamics (CFD), Reynolds-averaged Navier–Stokes (RANS), Large Eddy Simulations (LES), transient Shear Stress Transport (SST), Thermodynamics, QC310.15-319, Descriptive and experimental mechanics, QC120-168.85
Abstract

Liquid microjet impingement cooling has shown the potential to be the solution for heat removal from electronic devices such as very-large-scale integration (VLSI) chips. The post-impingement dynamics of the jet, specifically the interaction between the liquid fronts on the surface engendered by the jets is a critical criterion improving the heat transfer characteristics. While some seminally important experimental studies have investigated this attribute, the amount of accurate data and analysis is limited by the shortcomings of real-life experiments. In this article, numerical investigations into the fluid dynamics and heat transfer in microjet cooling systems are carried out. Specifically, this paper addresses the question regarding the necessary fidelity of the simulations. Different Reynolds-averaged Navier−Stokes (RANS) models are compared to the Large Eddy Simulations (LES) simulation and the potential fidelity of different eddy-viscosity-based closures is clearly shown. Recommendations are made regarding the RANS closures that should give the best performance. It is demonstrated that the transition Shear Stress Transport (SST) model and k - ω SST model both show excellent ability to predict the local or average Nu, and also local level pressure coefficient f with less than 5% difference in the range of 30 < Red < 4000, compared with the reference LES model. For the experimental measurements in the range of 130 < Red < 1400, the LES model, transition SST model and k - ω SST model all show less than 25% prediction error. Moreover, it is shown that the validity of the unit cell assumption for the temperature and flow distribution depends on the flow rate.

Published
2019
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6. NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips.

Author

Xabier Iturbe, Nassim Abderrahmane, Jaume Abella 0001, Sergi Alcaide, Eric Beyne, Henri-Pierre Charles, Christelle Charpin-Nicolle, Lars Chittka, Angélica Dávila, Arne Erdmann, Carles Estrada, Ander Fernández, Anna Fontanelli, José Flich, Gianluca Furano, Alejandro Hernán Gloriani, Erik Isusquiza, Radu Grosu, Carles Hernández 0001, Daniele Ielmini, David Jackson, Maha Kooli, Nicola Lepri, Bernabé Linares-Barranco, Jean-Loup Lachese, Eric Laurent, Menno Lindwer, Frank Linsenmaier, Mikel Luján, Karel Masarík, Nele Mentens, Orlando Moreira, Chinmay Nawghane, Luca Peres, Jean-Philippe Noel, Arash Pourtaherian, Christoph Posch, Peter Priller, Zdenek Prikryl, Felix Resch, Oliver Rhodes, Todor P. Stefanov, Moritz Storring, Michele Taliercio, Rafael Tornero, Marcel D. van de Burgwal, Geert Van der Plas, Elisa Vianello, and Pavel Zaykov

Published
2023
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11. Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails.

Author

Anabela Veloso, Anne Jourdain, D. Radisic, Rongmei Chen, G. Arutchelvan, B. O'Sullivan, Hiroaki Arimura, Michele Stucchi, An De Keersgieter, M. Hosseini, T. Hopf, K. D'Have, S. Wang, E. Dupuy, G. Mannaert, Kevin Vandersmissen, S. Iacovo, P. Marien, S. Choudhury, F. Schleicher, F. Sebaai, Yusuke Oniki, X. Zhou, A. Gupta, Tom Schram, B. Briggs, C. Lorant, E. Rosseel, Andriy Hikavyy, Roger Loo, J. Geypen, D. Batuk, G. T. Martinez, J. P. Soulie, Katia Devriendt, B. T. Chan, S. Demuynck, Gaspard Hiblot, Geert Van der Plas, Julien Ryckaert, Gerald Beyer, E. Dentoni Litta, Eric Beyne, and Naoto Horiguchi

Published
2022
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23. Die to wafer 3D stacking for below 10um pitch microbumps.

Author

Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, and Andy Miller

Published
2016
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25. Efficient Backside Power Delivery for High-Performance Computing Systems

Author

Hesheng Lin, Geert van der Plas, Xiao Sun, Dimitrios Velenis, Francky Catthoor, Rudy Lauwereins, and Eric Beyne

Subjects
Technology, Science & Technology, system integration, Engineering, Electrical & Electronic, Air-core inductor, system optimization, backside power delivery network (PDN), Engineering, Hardware and Architecture, INTEGRATED VOLTAGE REGULATOR, Computer Science, CORE, Electrical and Electronic Engineering, Computer Science, Hardware & Architecture, buck converter, Software
Abstract

ispartof: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS vol:30 issue:11 pages:1748-1756 status: published

Published
2022
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34. System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor

Author

Dimitrios Velenis, Geert Van der Plas, Eric Beyne, X. Sun, Hesheng Lin, and Rudy Lauwereins

Subjects
Materials science, business.industry, Buck converter, Electrical engineering, Inductor, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Power (physics), Inductance, CMOS, Electrical and Electronic Engineering, business, Electrical efficiency, Power density, Voltage
Abstract

In this work, we present the analytical model of buck converter with 3D in-package air-core inductor (150 μm thick). To optimize the power efficiency at a targeted power density, models including 3D inductor and power switches are developed. Compared to 3D EM simulation, the proposed inductor model has a modeling error within 12% for the inductance calculation. With the proposed design methodology, an inductor with Q-factor up to 35 @ 300 MHz is achieved. From the system aspect, the loss breakdown in the integrated power converter is investigated. A 0.5-ratio buck converter can reach 88.5% efficiency @ 1–5W/mm2 based on the optimized inductor designs, with output voltage ranging from 0.7 V to 0.9 V and based on 28 nm CMOS.

Published
2022
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36. Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies

Author

Dries Bosman, Martijn Huynen, Daniel De Zutter, Xiao Sun, Nicolas Pantano, Geert Van der Plas, Eric Beyne, and Dries Vande Ginste

Subjects
Radiation, Technology and Engineering, INTEGRAL-EQUATION, differential surface admittance (DSA), Condensed Matter Physics, LOSSY CONDUCTORS, skin effect, interconnect modeling, operator, SERIES IMPEDANCE, magnetic materials, Electrical and Electronic Engineering, TRANSMISSION-LINE PARAMETERS, SKIN, Boundary integral equation (BIE)
Abstract

In state-of-the-art interconnect design, topologies including magnetic materials, such as the so-called superlattice conductors, are rapidly emerging as a novel strategy to handle the challenges associated with the evolution toward higher operating frequencies and integration densities. Consequently, it is imperative that the newly developed full-wave electromagnetic solvers rigorously model these innovative materials and still accurately capture phenomena such as the skin and proximity effect in good conductors. In this article, we propose such a method to rigorously characterize this important class of interconnects with arbitrary, possibly frequency-dependent, material properties, including combined dielectric and magnetic contrast. To that end, a 2-D differential surface admittance (DSA) operator is used, which invokes a single-source equivalence theorem to model both nonmagnetic and magnetic conductors efficiently. This operator is combined with the electric field integral equation (EFIE), yielding a comprehensive formalism to extract the pertinent per-unit-of-length (p.u.l.) resistance and inductance parameters of the modeled structures. The numerical properties of our technique are studied in detail, with particular attention to the influence of magnetic materials. Finally, various relevant application examples are considered to establish its correctness and versatility.

Published
2023

38. Area-Selective Electroless Deposition of Cu for Hybrid Bonding

Author

Serena Iacovo, Fumihiro Inoue, Eric Beyne, Soon-Wook Kim, Zaid El-Mekki, and Herbert Struyf

Subjects
Bonding, Materials science, Annealing (metallurgy), Surface treatment, Polishing, Electroless deposition, Cu deposition, Electrical connection, Surface topography, Annealing, Electronic, Optical and Magnetic Materials, Surfaces, Chemical-mechanical planarization, Deposition (phase transition), Dielectrics, Chemicals, Electrical and Electronic Engineering, Composite material, Layer (electronics)
Abstract

This letter describes the use of area-selective electroless Cu deposition for topography control of Cu-SiCN hybrid bonding pads. The electroless deposition of Cu allows one to obtain protrusions on hybrid bonding Cu pads without further polishing optimization. A recessed Cu pad after chemical mechanical polishing becomes a protrusion after electroless deposition. This indicates that the electroless Cu film was selectively deposited on Cu, without deposition on the SiCN surface. A void-free Cu-Cu bonding interface was observed after annealing at 350 °C with an electroless Cu layer at the interface. 100% electrical connection was obtained at 1.4- μm pitch where the deposition thickness was on target.

Published
2021
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43. Power from Below: Buried Interconnects Will Help Save Moore's Law

Author

Eric Beyne, D. Prasad, Brian Cline, and Odysseas Zografos

Subjects
Surface (mathematics), Physics, Moore's law, business.industry, media_common.quotation_subject, Electrical engineering, Power (physics), Waste heat, Trajectory, Square (unit), Power flux, Electrical and Electronic Engineering, business, media_common
Abstract

For a time, each new processor churned out more waste heat than the last. Had these chips kept on the trajectory they were following in the early 2000s, they would soon have packed about 6,400 watts onto each square centimeter-the power flux on the surface of the sun.

Published
2021
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