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We demonstrate a kind of grating coupler that generates high quality flat-top beam with a small beamwidth from photonic integrated circuits into free-space. The grating coupler is designed on a silicon-on-insulator wafer with a 220 nm-thick silicon layer and consists of a dual-etch grating (DG) and a distributed Bragg reflector (DBR). By adjusting the structural parameters of DG and DBR, a pixel-level (6.6 um) flat-top beam with the vertical radiation of -0.5 dB and the mode match of 97% at 1550 nm is realized. Furthermore, a series of high-efficiency grating couplers are designed to create flat-top beam with different scales.

As one of nanoscale planar structures, metasurface has shown excellent superiorities on manipulating light intensity, phase and/or polarization with specially designed nanoposts pattern. It allows to miniature a bulky optical lens into the chip-size metalens with wavelength-order thickness, playing an unprecedented role in visible imaging systems (e.g. ultrawide-angle lens and telephoto). However, a CMOS-compatible metalens has yet to be achieved in the visible region due to the limitation on material properties such as transmission and compatibility. Here, we experimentally demonstrate a divergent metalens based on silicon nitride platform with large numerical aperture (NA~0.98) and high transmission (~0.8) for unpolarized visible light, fabricated by a 695-nm-thick hexagonal silicon nitride array with a minimum space of 42 nm between adjacent nanoposts. Nearly diffraction-limit virtual focus spots are achieved within the visible region. Such metalens enables to shrink objects into a micro-scale size field of view as small as a single-mode fiber core. Furthermore, a macroscopic metalens with 1-cm-diameter is also realized including over half billion nanoposts, showing a potential application of wide viewing-angle functionality. Thanks to the high-transmission and CMOS-compatibility of silicon nitride, our findings may open a new door for the miniaturization of optical lenses in the fields of optical fibers, microendoscopes, smart phones, aerial cameras, beam shaping, and other integrated on-chip devices., Comment: 16 pages, 7 figures